Abstract: A pouch type all-solid-state battery including a reference electrode is disclosed. In the all-solid-state battery, a potential variation of each electrode is accurately measured because the ion transfer path between the reference electrode and a positive electrode/negative electrode is short. Accordingly, the all-solid-state battery secures a desired cell performance while having battery specifications similar to actual battery specifications.

Abstract: A picture generation apparatus and a control method thereof are disclosed. An embodiment of the present disclosure provides a picture generation apparatus including a light source; a Spatial Light Modulator (SLM) configured to output an image using light transmitted from the light source; and a control unit configured to control the light source and the SLM based on at least one of illuminance of the surroundings or content of the image.

Abstract: A semiconductor device includes an active pattern including: a lower pattern extending in a first direction, and a plurality of sheet patterns spaced apart from the lower pattern in a second direction; a gate structure on the lower pattern and including a gate electrode and a gate insulating film including an interfacial insulating film including a first vertical portion and a horizontal portion. A dimension in a third direction of the first vertical portion is greater than a dimension in the second direction of the horizontal portion. The first vertical portion includes: a first area contacting a source/drain pattern; and a second area provided between the first area and the gate electrode. The interfacial insulating film includes a first element other than silicon, wherein a concentration of the first element in the first area is greater than a concentration of the first element in the second area.

Abstract: The present invention relates to a computer-implemented method for preparing oligonucleotides used to detect a nucleotide mutation of interest in a target nucleic acid sequence.

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Abstract: A display device comprises a substrate; a circuit array layer comprising pixel drivers, data lines, first dummy lines, and second dummy lines; and a light emitting array layer. The display area comprises middle, first side, and second side regions. The data lines comprise first, second, and third data lines disposed in the middle, first side, and second side regions, respectively. The first dummy lines comprise a first data detour line disposed in the first side region and adjacent to a part of the second data line, and auxiliary lines. The second dummy lines comprise a second data detour line configured to connect the first data detour line to the third data line, and additional lines. The auxiliary lines comprise a bias auxiliary line to which a bias power is applied; and a second power auxiliary line to which a second power is applied.

Abstract: A method of manufacturing a stacked structure includes forming a first metal buffer layer including crystal grains on a base substrate, forming a second metal buffer material layer on the first metal buffer layer, and crystallizing the second metal buffer material layer to form a second metal buffer layer, wherein the second metal buffer material layer includes crystal grains, and a density of the crystal grains of the second metal buffer material layer is lower than a density of the crystal grains of the first metal buffer layer.

Abstract: A tantalum capacitor includes a capacitor body comprising a tantalum body having a tantalum wire and a molded portion; an anodic terminal connected to the tantalum wire and disposed on the first surface of the capacitor body; an anodic connection portion connected to the anodic terminal and disposed on the fifth surface of the capacitor body; a cathodic terminal connected to the tantalum body and disposed on the second surface of the capacitor body; a cathodic connection portion connected to the cathodic terminal and spaced apart from the anodic connection portion on the fifth surface of the capacitor body; and a substrate disposed on the sixth surface of the body and on which the tantalum body is mounted, wherein the anodic terminal and the cathodic terminal are electrically isolated on the substrate.

Abstract: The present disclosure provides an apparatus and method of controlling a resource sharing in a real-time data transmission network which can increase a network efficiency by decentralizing data operation loads and reducing duplicate operations. The resource sharing control device is one of a plurality of devices included in a real-time data transmission system which delivers transmit data provided by a data producer to a data consumer. At least one instruction when executed by the processor causes the processor to: establish a delivery path passing at least some of the plurality of resource sharing control devices in the real-time data transmission system and through which the transmit data is delivered; and decompose an operation to be performed on the transmit data into a plurality of partial operations and allocate each of the partial operations to one or more of the plurality of resource sharing control devices on the delivery path.

Abstract: An ultra-high solids content primer coating composition comprising: (i) 5.0 to 50 wt % of at least one bisphenol F epoxy resin; (ii) 1.5 to 12 wt % of at least one silane; (iii) 0 to 20 wt % of at least one hydrocarbon resin; (iv) 0 to 15 wt % of at least one reactive diluent; (v) at least one curing agent; wherein said composition has a solids content of at least 90 wt % according to ASTM D5201-05; wherein said composition has a viscosity of 200 to 800 cps at 23° C.

Abstract: A tantalum capacitor includes a capacitor body comprising a tantalum body having a tantalum wire and a molded portion; an anodic terminal connected to the tantalum wire and disposed on the first surface of the capacitor body; an anodic connection portion connected to the anodic terminal and disposed on the fifth surface of the capacitor body; a cathodic terminal connected to the tantalum body and disposed on the second surface of the capacitor body; a cathodic connection portion connected to the cathodic terminal and spaced apart from the anodic connection portion on the fifth surface of the capacitor body; and a substrate disposed on the sixth surface of the body and on which the tantalum body is mounted, wherein the anodic terminal and the cathodic terminal are electrically isolated on the substrate.

Abstract: An ultra-high solids content primer coating composition comprising: (i) 5.0 to 50 wt % of at least one bisphenol F epoxy resin; (ii) 1.5 to 12 wt % of at least one silane; (iii) 0 to 20 wt % of at least one hydrocarbon resin; (iv) 0 to 15 wt % of at least one reactive diluent; (v) at least one curing agent; wherein said composition has a solids content of at least 90 wt % according to ASTM D5201-05; wherein said composition has a viscosity of 200 to 800 cps at 23° C. and 50% RH (ASTM D4287); and wherein the ratio between hydrogen equivalents in the curing agent and epoxy equivalents of the coating composition is in the range 50:100 to 120:100.

Abstract: A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.

Abstract: Disclosed is a method of manufacturing a sound absorbing material for a vehicle, which may include: (a) preparing a mixed fiber including an amount of about 55 to 75 wt % of microfiber polyethylene terephthalate staple fiber having fineness of about 0.3 to 0.7 denier, an amount of about 20 to 40 wt % of low-melt polyethylene terephthalate staple fiber having a fineness of about 1 to 3 denier and a melting point of about 100 to 110° C., and an amount of about 1 to 20 wt % of hollow staple fiber having a fineness of about 13 to 17 denier and a diameter of about 38 to 43 ?m, based on the total weight of the mixed fiber. The method may suitably further comprise (b) forming a plurality of webs comprising the mixed fiber; (c) forming a web layer comprising a plurality of webs; and (d) forming non-woven felt comprising the web layer.

Abstract: A capacitor includes a structure including a plurality of openings penetrating from a first surface of the structure to a second surface opposing the first surface; a capacitor layer disposed on the second surface of the structure and in the plurality of the openings and including a dielectric layer, and a first electrode and a second electrode, the dielectric layer interposed between the first electrode and the second electrode; a first connection layer disposed on the first surface of the structure and connected to the first electrode; a second connection layer disposed on the capacitor layer on the second surface and connected to the second electrode of the structure; and first and second terminals disposed on opposite side surfaces of the structure and connected to the first connection layer and the second connection layer, respectively.

Abstract: A tantalum capacitor includes a tantalum body, an encapsulation portion, first and second external electrodes spaced apart from each other on a lower surface of the encapsulation portion, a first plating layer disposed on one end surface of the encapsulation portion and a lower surface of the first external electrode to electrically connect the first external electrode and the tantalum body, an upper end of the first plating being comprised of a first bonding force improving portion contacting one upper edge of the encapsulation portion, and a second plating layer disposed on the other end surface of the encapsulation portion and a lower surface of the second external electrode to electrically connect the second external electrode and an exposed portion of a tantalum wire, an upper end of the second plating layer being comprised of a second bonding force improving portion contacting the other upper edge of the encapsulation portion.

Abstract: A capacitor component includes a porous body, a first electrode layer covering surfaces of pores of the porous body, a dielectric layer covering the first electrode layer, and a second electrode layer filling the pores of the porous body and covering the dielectric layer.

Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.

Abstract: A capacitor includes a support member included in a body, a plurality of pillars disposed in an upper portion of the support member and each having a lower portion wider than an upper portion, and a capacitor layer disposed on a side surface and an upper surface of each pillar and including a dielectric layer and first and second electrodes alternately disposed with the dielectric layer interposed therebetween. Lower end portions of adjacent pillars are in contact with each other.

Abstract: According to various exemplary embodiments, an electronic device may include: a camera unit; a processor; and a data processing unit that is electrically connected to the camera unit and the processor, wherein the data processing unit may detect a first number of pixels corresponding to first illuminance data based on first pixel data received from the camera unit to transmit the first number of pixels to the camera unit, and may determine a brightness of a display corresponding to second illuminance data based on second pixel data received from the camera unit in which a sensor corresponding to the first number of pixels is turned on.