Abstract: This disclosure relates to a connector comprising a first RF contact; a second RF contact spaced apart from the first RF contact in a first axis direction; an insulation part; and a cover shell, wherein the first RF contact includes a (1-1)th RF linker member for connecting with an RF contact of the other connector; a (1-2)th RF linker member spaced apart from the (1-1)th RF linker member on the basis of a second axis direction perpendicular to the first; and a first RF linker member arranged between the (1-1)th RF linker member and the (1-2)th RF linker member on the basis of the second axis direction, the insulation part includes a first RF inspection window arranged between the (1-1)th RF linker member and the (1-2)th RF linker member on the basis of the second axis direction, and the first RF linker member is exposed through the first RF inspection window.

Abstract: The present invention relates to a connector comprising: a first radio frequency (RF) contact for RF signal transmission; a second RF contact which is spaced apart from the first RF contact in a first axial direction; an insulation part to which the first RF contact and the second RF contact are coupled; a cover shell to which the insulation part is coupled; a first coaxial cable which is electrically connected to the first RF contact; a second coaxial cable which is spaced apart from the first coaxial cable in the first axial direction and electrically connected to the second RF contact; and a partition wall part which is coupled to the cover shell such that, with respect to the first axial direction, the first RF contact and the first coaxial cable are disposed on one side and the second RF contact and the second coaxial cable are disposed on the other side.

Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.

Abstract: The present disclosure relates to a board connector comprising: a plurality of RF contacts for transmitting a radio frequency (RF) signal; an insulating part supporting the RF contacts; a plurality of transmission contacts coupled to the insulating part; a ground housing having the insulating part coupled thereto; a first ground contact coupled to the insulating part and shielding between a first RF contact from among the RF contacts and the transmission contacts; and a second ground contact coupled to the insulating part and shielding between a second RF contact from among the RF contacts and the transmission contacts, wherein the first ground contact comprises a first shielding member shielding between the first RF contact and the transmission contacts with respect to a first axial direction and shielding between the first RF contact and the transmission contacts with respect to a second axial direction perpendicular to the first axial direction.

Abstract: The present disclosure relates to a substrate connector comprising a plurality of radio frequency (RF) contacts for RF signal transmission; an insulation unit for supporting the RF contacts; a plurality of transmission contacts coupled to the insulation unit between a first RF contact and a second RF contact so the first RF contact of the RF contacts and the second RF contact of the RF contacts are spaced from each other in a first axial direction; a ground housing to which the insulation unit is coupled; a first ground contact which is coupled to the insulation unit; and a second ground contact which is coupled to the insulation unit, wherein the first RF contact includes a first RF inspection plane with which an inspection instrument is to come in contact, and the second RF contact includes a second inspection plane with which the inspection instrument is to come in contact.

Abstract: The present disclosure relates to a board connector comprising a plurality of RF contacts; an insulation unit; a plurality of transmit contacts and a plurality of second RF contacts, so that the first and second RF contacts are spaced apart along a first axial direction; a ground housing; a first ground contact coupled to the insulation unit, and providing shielding between the first RF contacts and the transmit contacts, with respect to the first axial direction; and a second ground contact coupled to the insulation unit, and providing shielding between the second RF contacts and the transmit contacts, with respect to the first axial direction, wherein the first ground contact provides shielding between the first RF contacts and the transmit contacts, with respect to the first axial direction, and provides shielding between the first RF contacts with respect to a second axial direction perpendicular to the first axial direction.

Abstract: The present disclosure pertains to a board connector comprising a plurality of RF contacts; an insulating part; a plurality of transmission contacts coupled to the insulating part between a first RF contact and a second RF contact, such that the RF contacts are spaced from each other in a first axial direction; and a ground housing to which the insulating part is coupled, the ground housing comprising a ground inner wall, a ground outer wall, and a ground connection wall coupled to each of the ground inner and outer walls, wherein the ground inner and outer walls are double-shielding walls surrounding the side of an inner space, the RF contacts are located in the inner space surrounded by the double-shielding walls, and each of the ground inner and outer walls contacts the ground housing of a counter connector inserted into the inner space.

Abstract: The present disclosure pertains to a board connector comprising a plurality of radio frequency (RF) contacts for transmitting RF signals; an insulating part supporting the RF contacts; a plurality of transmission contacts coupled to the insulating part and between a first RF contact and a second RF contact, such that the first RF contact and the second RF contact are spaced in a first axial direction; and a grounding housing to which the insulating part is coupled, the grounding housing comprising an inner grounding wall, an outer grounding wall spaced apart from the inner grounding wall, and a grounding connection wall coupled to each of the inner and outer grounding walls, wherein the inner and outer grounding walls are double-shielding walls that surround the side of an inner space, and the first RF contact and the second RF contact are placed in the inner space surrounded by the double-shielding walls.

Abstract: An organic light emitting diode display includes: a display module including a first organic light emitting diode to emit light with a first wavelength, a second organic light emitting diode to emit light with a second wavelength, and a third organic light emitting diode to emit light with a third wavelength; a phase difference layer including a first liquid crystal pattern on the first organic light emitting diode, and a second liquid crystal pattern on the second organic light emitting diode and the third organic light emitting diode; and a linear polarization layer on the phase difference layer.

Abstract: An organic light emitting diode display includes: a display module including a first organic light emitting diode to emit light with a first wavelength, a second organic light emitting diode to emit light with a second wavelength, and a third organic light emitting diode to emit light with a third wavelength; a phase difference layer including a first liquid crystal pattern on the first organic light emitting diode, and a second liquid crystal pattern on the second organic light emitting diode and the third organic light emitting diode; and a linear polarization layer on the phase difference layer.

Abstract: An organic light emitting diode display includes: a display module including a first organic light emitting diode to emit light with a first wavelength, a second organic light emitting diode to emit light with a second wavelength, and a third organic light emitting diode to emit light with a third wavelength; a phase difference layer including a first liquid crystal pattern on the first organic light emitting diode, and a second liquid crystal pattern on the second organic light emitting diode and the third organic light emitting diode; and a linear polarization layer on the phase difference layer.

Abstract: A polarizer including a base film, a first alignment layer disposed on the base film, a phase delay layer disposed on the first alignment layer, a second alignment layer disposed on the phase delay layer, and a polarizing layer disposed on the second alignment layer. The phase delay layer includes a first liquid crystal composition including first liquid crystals, a first antioxidant, and a derivative thereof.

Abstract: An organic light emitting diode display includes: a display module including a first organic light emitting diode to emit light with a first wavelength, a second organic light emitting diode to emit light with a second wavelength, and a third organic light emitting diode to emit light with a third wavelength; a phase difference layer including a first liquid crystal pattern on the first organic light emitting diode, and a second liquid crystal pattern on the second organic light emitting diode and the third organic light emitting diode; and a linear polarization layer on the phase difference layer.

Abstract: A polarizer including a base film, a first alignment layer disposed on the base film, a phase delay layer disposed on the first alignment layer, a second alignment layer disposed on the phase delay layer, and a polarizing layer disposed on the second alignment layer. The phase delay layer includes a first liquid crystal composition including first liquid crystals, a first antioxidant, and a derivative thereof.

Abstract: A liquid crystal display and a method of driving the same. The liquid crystal display includes a liquid crystal display panel having a plurality of gate lines and a plurality of data lines formed on a substrate to cross each other, and a plurality of pixels respectively connected to the plurality of gate lines and the plurality of data lines; a data driving unit for outputting data signals through a plurality of channel terminals; and a line selection unit for applying the data signals to alternately arranged first data line blocks having data lines arranged adjacent to one side of corresponding pixels and second data line blocks having data lines arranged adjacent to the other side of corresponding pixels.

Abstract: A liquid crystal display and a method of driving the same. The liquid crystal display includes a liquid crystal display panel having a plurality of gate lines and a plurality of data lines formed on a substrate to cross each other, and a plurality of pixels respectively connected to the plurality of gate lines and the plurality of data lines; a data driving unit for outputting data signals through a plurality of channel terminals; and a line selection unit for applying the data signals to alternately arranged first data line blocks having data lines arranged adjacent to one side of corresponding pixels and second data line blocks having data lines arranged adjacent to the other side of corresponding pixels.

Abstract: A method for recognizing working position in a semiconductor test handler is disclosed. The method includes the steps of: (a) obtaining necessary information through image input unit while moving device transfer unit to upper portion of tray and in horizontal and vertical directions; (b) obtaining image information of identifiers attached to respective change kits through the image input unit while moving the device transfer unit to the respective change kits and moving the device transfer unit in one direction, and simultaneously obtaining origin of the change kit; (c) comparing kinds of semiconductor devices inputted into control unit of the handler with information of the identifiers which are obtained in the step of (b), and determining whether or not the kinds of the semiconductor devices accords with those of the change kits; and (d) calculating the working position of the device transfer unit using the image information obtained through the steps a) to c) in the image processor and the control unit.

Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.

Abstract: An apparatus for transferring semiconductor devices in a semiconductor device handler is provided which simplifies set up procedures when a species of device to be tested, and the associated change kit, is changed. A reference picker and three variable pickers are positioned within the framing structure of the handler, with the motion of the third variable picker synchronized relative to the motion of the first and second variable pickers. A plurality of sensors determine an initial position of the variable pickers, and then motion of the variable pickers is monitored by respective scanning heads and linear scales until a new setup position which corresponds to the new device species is attained. In this manner, the procedure and structure for varying position and pitch of the various pickers can be simplified, thus reducing processing time and cost.

Abstract: A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.