Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.

Abstract: An apparatus and method are provided for recognizing a working height of a device transfer system in a semiconductor device test handler which allows the working height of the device transfer system to be quickly measured and/or precisely reset. The device transfer system moves horizontally and vertically on a handler body of the semiconductor device test handler, and moves horizontally and vertically, and includes a plurality of pickers which pick up the semiconductor devices. An elevating block installed at one side of the device transfer system moves upward and downward, and a touch probe installed vertical relative to the elevating block moves upward and downward based on contact with a target object. A detector detects ascendance of the touch probe upon contact with the target object, and a working position is determined based on an initial position, a measured position, and a series of offset values.

Abstract: An apparatus and method is provided for recognizing a working position of a device transfer system in a semiconductor device test handler. The working position of a transfer unit of the handler is adjusted based on tray and change kit positions to allow components to be quickly and precisely loaded and transferred when various kinds of semiconductor devices are tested in the handler. A laser sensor which detects a color change of an object is provided with the transfer unit, and scans corners of the tray and change kits to acquire position information related to the tray and change kits. The working position of the transfer unit is calculated using basic handler information contained in the control unit of the handler and the acquired information.

Abstract: A handler for testing semiconductor devices is provided, wherein a soaking plate is fitted on a handler body having temperature control means for heating and/or cooling semiconductor devices placed thereon. Loading/unloading shuttles are movably fitted, such that they can move in a forward/backward direction, for carrying the semiconductor deices to/from a test site, thereby simplifying a handler system and permitting accurate temperature testing under in high or low temperature environments.

Abstract: A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.

Abstract: A heating and cooling apparatus is provided which employs a series of thermally conductive plates thermally coupled to heating and cooling devices to heat or cool a mounting plate loaded with semiconductor devices. The mounting plate is assembled on a heating plate, which is then assembled on a cooling plate. The heating plate includes upper and lower plates with a heater therebetween which can heat the heating plate to a desired temperature, which in turn heats the mounting plate and the semiconductor devices. The cooling plate has ‘S’ shaped flow grooves formed throughout. When cooling fluid is flowed through the flow grooves, the cooling plate is cooled, which cools the heating plate, which in turn cools the mounting plate and the semiconductor devices.

Abstract: Disclosed are an apparatus and method for recognizing a working height of a carrier in a semiconductor device test handler enabling to measure the working height of the carrier fast and precisely to reset with a simplified structure of the apparatus. In a device transfer system for picking up to transfer semiconductor devices, the device transfer system installed on a handler body to move horizontally and vertically and having pickers absorbing the semiconductor devices, the present invention includes an elevating block installed at one side of the device transfer system to move upward and downward, a touch probe installed vertical to the elevating block to move upward and downward in accordance with a contact with an under target object, a detecting means for detecting ascendance of the touch probe, and a driving means for driving the elevating block upward and downward.

Abstract: Disclosed are an apparatus and method for recognizing a working position of a device transfer system in a semiconductor device test handler enabling to recognize to reset the working positions of the transfer unit for a tray and a change kit as replacing components fast and precisely when various kinds of semiconductor devices are tested in the handler. A laser sensor detecting a color change of an object is installed at a transfer unit, and scans corners of the tray and change kits to be replaced in horizontal and vertical directions to acquire the position information of the corners of the tray and change kits. The present invention calculates the working position of the transfer unit precisely for rest using the basic information inputted previously to the control unit of the handler and the acquired information.

Abstract: Disclosed is an apparatus for transferring semiconductor devices in a semiconductor device enabling to simplify the structure for varying pickers for picking up semiconductor devices as well as accomplish fast and precise variation, of the pickers, and includes rectangular frames installed movably on a handler body, stators of two linear motors installed on inner sides of two of the frames adjacent, respectively, movers of the two linear motors installed to move along the stators, respectively, a reference pickup member fixed to an inner corner between the frames to pick up the semiconductor device, first and second pickup members coupled with the movers of the linear motors to move along the frames, respectively, a first guide member fixed to the first pickup member to be in parallel with the frame, a second guide member fixed to the second pickup member to be vertical the first guide member, and a third pickup member coupled with both of the first and second guide members to move along the second and first

Abstract: A method for recognizing working position in a semiconductor test handler is disclosed. The method includes the steps of: (a) obtaining necessary information through image input unit while moving device transfer unit to upper portion of tray and in horizontal and vertical directions; (b) obtaining image information of identifiers attached to respective change kits through the image input unit while moving the device transfer unit to the respective change kits and moving the device transfer unit in one direction, and simultaneously obtaining origin of the change kit; (c) comparing kinds of semiconductor devices inputted into control unit of the handler with information of the identifiers which are obtained in the step of (b), and determining whether or not the kinds of the semiconductor devices accords with those of the change kits; and (d) calculating the working position of the device transfer unit using the image information obtained through the steps a) to c) in the image processor and the control unit.

Abstract: An apparatus for heating and cooling a semiconductor device in a handler for testing the semiconductor device is provided. The apparatus includes: a thermal conductive mounting plate having a plurality of seating recesses on which the semiconductor devices are mounted; a thermal conductive heating plate installed adjacent to a lower side of the mounting plate and having at least one heater installed therein, for transferring heat to the mounting plate; a thermal conductive cooling plate installed adjacent to a lower side of the heating plate on a main body of the handler and having a flow groove such that a cooling fluid fed from an external cooling fluid supply source flows and then is exhausted to an outside; a heating control means for controlling heat irradiated from the heater of the heating plate to control heating temperature of the mounting plate; and a cooling control means for controlling amount of the cooling fluid fed to the cooling plate to control cooling temperature of the mounting plate.

Abstract: The present invention relates to a cooling apparatus for an XY gantray, and more particularly to a cooling apparatus which cools an X-axis and Y-axis linear motors used when linear motors are employed for the XY gantry adapted to travel on the plane to perform works. The cooling apparatus for the XY gantry comprises: the X-axis and Y-axis linear motors having respective stator element and moving element, the stator element and moving element having through-holes formed in one side thereof so that external air is introduced therethrough to flow along surface of coil blocks included in the respective moving element of the X-axis and Y-axis linear motors, thereby cooling heat generated from the coil blocks. An advantage is provided in that heat generated from each of the coil blocks can be cooled by air flowing through the air passages provided by respective through-holes of the X- and Y-axis linear motors applied to the XY gantry.

Abstract: A cooling apparatus for a linear motor is disclosed which effectively cools heat generated when the motor is driven and provides an accurately maintained motor characteristics. The cooling apparatus for the linear motor include a blower provided outside the linear motor, at least one or more supply pipes, the supply pipes being provided to predetermined locations of the stator, air guide holes coupled to the supply pipes, respectively, for guiding flow of an introduced air, and control valves provided to predetermined locations of the supply pipes, for controlling an amount of an introduced air.

Abstract: The present invention relates to a carrier handling apparatus for a module IC (integrated circuit) handler and method therefor, for performing effective tests while carrier having a plural module ICs therein are transferred between the processes. The present invention includes a base frame, a vertical frame being provided perpendicular to one side of the base frame, carrier units being fixed at a top of a carrier holder, the carrier holder being disposed parallel at upper portion surfaces of the base frame and provided to slide along LM guide rails, respective press units being provided, corresponding to respective carrier units, at one side of the vertical frame, and for connecting the module ICs contained in the carrier unit, and a driving motor providing with pulley provided at one side of the vertical frame so as to slidably move rightward and leftward the carrier unit connected thereto by means of a timing belt.

Abstract: Index head in a semiconductor device test handler for mounting semiconductor device in a test socket at a test site, wherein a force pressing down a semiconductor device is accurately controlled by means of a force transducer fitted to a head holder, a precise temperature control of the semiconductor device is made by direct heat transfer to a picked up semiconductor device from an electric heater fitted to the head, and a smooth alignment is made by a compliance part even if there is an alignment error between the index head and/or the test socket, thereby permitting a faster operation of the index head.

Abstract: The present invention relates to a linear motor with an improved cooling structure for cooling heat generated from a coil block of the motor. The linear motor includes a stator element having a stator element frame, a movable element having a movable element frame, adapted to linearly move along the stator, and a heat dissipation plate mounted on the stator element frame and the movable element frame, for externally dissipating heat generated from a coil block. Such a structure can prevent over-heating of the linear motor by dissipating heat generated from the motor coil to thereby cool the motor.

Abstract: There is disclosed a system for preventing malfunction of a switching circuit for a linear motor capable of preventing malfunction of the switching circuit due to magnet flux from the permanent magnet mounted on the movable element, the system including sensing magnets provided at a longitudinal one side of a movable element having a plurality of permanent magnets mounted thereon, a plurality of Hall sensors mounted on the stator element and used for controlling current flow into a plurality of armature coils by turning on/off a switching circuit, based upon the sensing of magnet flux generated from the sensing magnets, and dummy sensing magnet provided at one side end of the sensing magnet in such a manner that its polarity is opposite to that of the sensing magnet, and for preventing magnets flux generated from the plural permanent magnets from introducing into the plural Hall sensors.