Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Abstract: A diplexer may include a diplexer circuit unit including a first branch operating in a first frequency band and a second branch operating in a second frequency band, a static-electricity protection circuit unit connected to at least one of the first branch and the second branch in parallel so as to discharge static electricity flowing in the first or second branch toward an avoidance path, and a compensation circuit unit connected to at least one of the first branch and second branch so as to compensate for degradation caused by the static-electricity protection circuit unit.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Abstract: Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties.

Abstract: The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition including a liquid crystal oligomer having a low coefficient of thermal expansion and an improved glass transition temperature, and the like.

Abstract: There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter.

Abstract: Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg.

Abstract: Disclosed herein are an inductor and a method of manufacturing the same. More specifically, in the inductor according to the present invention, a coil with a fine pattern may be formed, and an insulating resin composite including liquid crystal oligomer for reducing occurrence of deformation of the coil may be used for an insulating substrate.

Abstract: A power supplying apparatus supplying power to a predetermined system unit is provided with a power selecting unit which is directly connected to the system part, to select one of a plurality of inputs of power and output a selected power to the system unit; and a controller which is provided outside a power supplying path between the power selecting unit and the system unit, to control the power selecting unit to selectively output the power selected by the power selecting unit to the system unit according to a power switching signal.

Abstract: Provided are an apparatus and method for forming an image by determining a thermal print head type and generating driving signals for driving the thermal print head according to the thermal print head type. The apparatus includes a data input unit which receives data regarding an image to be printed, a controller which determines the thermal print head type and generates driving signals for driving the thermal print head according to the thermal print head type, and the thermal print head which prints the image by heating a medium.

Abstract: A method of differentiating a type of heat sensitive paper is provided. The method comprises the steps of a) printing a test pattern on a surface of the heat sensitive paper using a thermal printhead, b) detecting the test pattern using an optical sensor, c) determining whether a value of an optical output of the detected test pattern is within a range previously defined in a lookup table, and d) if the value of the optical output is within the range, printing a printing data on the heat sensitive paper.

Abstract: Disclosed herein is a pivotally openable spectacles and sunshade-clip assembly in which a sunshade-clip is pivotally rotatable about a pair of hinge arm units thereof after being attached to spectacles by use of corresponding spectacles magnets and clip magnets. The spectacles include a pair of lens frames, a pair of temple arms, a pair of hinge units each used to hingedly connect one of the lens frames to one of the temple arms. The spectacles magnets are mounted in the hinge units. The sunshade-clip includes a pair of colored clip lenses, a pair of clip lens frames, a pair of hinge arm units, and the clip magnets mounted to the hinge arm units, respectively, to correspond to the spectacles magnets.

Abstract: A power supplying apparatus supplying power to a predetermined system unit is provided with a power selecting unit which is directly connected to the system part, to select one of a plurality of inputs of power and output a selected power to the system unit; and a controller which is provided outside a power supplying path between the power selecting unit and the system unit, to control the power selecting unit to selectively output the power selected by the power selecting unit to the system unit according to a power switching signal.