Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Abstract: There are provided an inertial sensor module having a hermetic seal formed of metal and a multi-axis sensor employing the same. The inertial sensor module includes: a sensor main body including a plurality of wirings connected to any one of a driving electrode of a sensor and a sensing electrode of the sensor and formed on a substrate for a lower cap by a wafer level package (WLP) scheme to detect an inertial force; a substrate for an upper cap bonded on the sensor main body to protect the sensor main body; and a hermetic seal formed of metal isolated from the wiring and interposed into the sensor main body and the substrate for the upper cap by performing the bonding by metal bonding.

Abstract: Embodiments of the invention provide a multi-axis sensor, including a first sensor embedded in an embedded substrate to sense a position, and a second sensor formed on a lower cap substrate bonded on the embedded substrate by a wafer level package scheme to sense an inertial force.

Abstract: Embodiments of the invention provide a cap module for MEMS including a substrate, a first negative photoresist, which is formed on one surface of the substrate, and a second negative photoresist, which is formed on one surface of the first negative photoresist.

Abstract: Disclosed herein is an angular velocity sensor, including: a mass body part; an internal frame supporting the mass body part; a first flexible part each connecting the mass body part to the internal frame; a second flexible part each connecting the mass body part to the internal frame; an external frame supporting the internal frame; a third flexible part connecting the internal frame and the external frame to each other; and a fourth flexible part connecting the internal frame and the external frame to each other, wherein the internal frame, the second flexible part, and the fourth flexible part have an oxide layer formed thereon.

Abstract: Disclosed herein is an inertial sensor, including: a structural part for an accelerator sensor disposed on one surface, centered on a common post; and a structural part for an angular velocity sensor disposed on the other surface, centered on the common post, wherein a piezoresistor of the structural part for the accelerator sensor and a piezoelectric material of the structural part for the angular velocity sensor are formed on different surfaces.

Abstract: There are provided a silicon substrate and a method of fabricating the same, the silicon substrate including: first and second silicon substrates having corresponding bonding surfaces; a silicon oxide film formed between the first and second silicon substrates and having at least one trench communicating with the outside; and a hermetic portion formed on an end portion of the trench according to oxidation of the silicon oxide film.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

Abstract: Disclosed herein is an inertial sensor. The inertial sensor includes a sensor unit including a flexible substrate part on which a driving electrode and a sensing electrode are formed, a mass displaceably mounted on the flexible substrate part, and a support body coupled with the flexible substrate part in order to support the mass in a floated state and made of silicon; and a lower cap covering a bottom portion of the mass and made of silicon, wherein the lower cap and the sensor unit are coupled by a silicon direct bonding method, whereby the inertial sensor and the method of manufacturing the same may be obtained to improve the convenience in manufacturing and the reliability of the sensor by bonding the sensor unit and the lower cap by the silicon direct bonding method.

Abstract: Disclosed herein is an inertial sensor which includes a sensing unit including a mass mounted to be displaced on a flexible substrate part, a driving unit moving the mass, and a displacement detecting unit detecting a displacement of the mass, the inertial sensor comprising: a top cap covering a top of the flexible substrate part; and a bottom cap covering a bottom of the mass. Thereby, the inertial sensor can be implemented in an economic EMC molding package shape, while protecting the mass and the piezo-electric element. Further, the inertial sensor optimizes a thickness of the cap covering the mass and the piezo-electric element and an interval between the mass and the piezo-electric element to have improved freedom in design of space utilization as well as improved driving characteristics and Q values.

Abstract: An MEMS variable optical attenuator includes a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of coaxially aligned optical waveguides having a receiving end and a transmitting end, respectively, and an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven by the micro-electric actuator. A surface layer is formed on the optical shutter, has reflectivity less than 80% so as to allow incident light beams to partially transmit thereinto, and further has a sufficient light extinction ratio, thereby extinguishing the partially transmitted light beams therein.

Abstract: Disclosed is herein an optical switch, which has advantages of an MEMS optical switch and a waveguide optical switch including a small electric power consumption, an easy packaging process, and a fast switching speed. The optical switch includes an input waveguide connected to an input optical fiber through which an optical signal is inputted, and a plurality of output waveguides connected to a plurality of output optical fibers through which the optical signal is outputted. An actuator is positioned between the input waveguide and the output waveguides, and has an MEMS structure including a fixed part and a moving part connected to the fixed part by a spring to move by a predetermined force.

Abstract: Disclosed is herein an optical switch, which has advantages of an MEMS optical switch and a waveguide optical switch including a small electric power consumption, an easy packaging process, and a fast switching speed. The optical switch includes an input waveguide connected to an input optical fiber through which an optical signal is inputted, and a plurality of output waveguides connected to a plurality of output optical fibers through which the optical signal is outputted. An actuator is positioned between the input waveguide and the output waveguides, and has an MEMS structure including a fixed part and a moving part connected to the fixed part by a spring to move by a predetermined force.

Abstract: A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a protective mask. The dicing method for a micro electro mechanical system chip, comprising the steps of designing a grid line and wafer pattern on a chip-scale on the non-adhesive surface of a transparent tape as a protective mask (first step); sticking microstructure-protecting membranes on the adhesive surface of the transparent tape (second step); putting the transparent tape on the whole surface of a wafer in a state wherein the grid line designed on the non-adhesive surface of the transparent tape is matched to the dicing line of the wafer (third step); cutting the transparent tape to a size larger than the wafer, mounting the wafer on a guide ring and dicing the wafer (fourth step); and separating the transparent tape from diced chips (fifth step).

Abstract: Disclosed is a MEMS (Micro Electro Mechanical System) variable optical attenuator. The MEMS variable optical attenuator comprises a substrate having a flat upper surface; an electrostatic attenuator disposed on the upper surface of the substrate; transmitting and receiving terminals disposed on the substrate so that optical axes of the terminals coincide with each other; and a beam shutter moved to a designated position between the transmitting and receiving terminals by the actuator, wherein the beam shutter is provided with a first coating layer made of a material with a reflectivity of more than 90% and formed on a surface of the beam shutter, and a second coating layer made of a material with a reflectivity of less than 80% so that a part of light is transmitted by the second coating layer and with a photodisintegration rate of the transmitted light determined by a thickness of the second coating layer.

Abstract: Disclosed is a MEMS (Micro Electro Mechanical System) variable optical attenuator. The MEMS variable optical attenuator comprises a substrate having a flat upper surface; an electrostatic attenuator disposed on the upper surface of the substrate; transmitting and receiving terminals disposed on the substrate so that optical axes of the terminals coincide with each other; and a beam shutter moved to a designated position between the transmitting and receiving terminals by the actuator, wherein the beam shutter is provided with a first coating layer made of a material with a reflectivity of more than 90% and formed on a surface of the beam shutter, and a second coating layer made of a material with a reflectivity of less than 80% so that a part of light is transmitted by the second coating layer and with a photodisintegration rate of the transmitted light determined by a thickness of the second coating layer.

Abstract: Disclosed is an MEMS variable optical attenuator comprising a substrate having a planar surface, a micro-electric actuator arranged on the planar surface of the substrate, a pair of optical waveguides having a receiving end and a transmitting end, respectively, and coaxially aligned with the other while being arranged on the planar surface, an optical shutter movable to a predetermined position between the receiving end and the transmitting end of the optical waveguides, and driven to move by the micro-electric actuator, and a surface layer formed on the optical shutter, having reflectivity less than 80% so as for incident light beams to partially transmit thereinto, and having a characteristic of light extinction, thereby extinguishing the partially transmitted light beams therein.

Abstract: Disclosed is a path-converted variable optical attenuator comprising: a transmitting fiber for launching an optical signal through a transmitting core; a receiving fiber for receiving the optical signal from the transmitting fiber through a receiving core; and a mirror having a reflector for obstructing the optical signal launched from the transmitting core of the transmitting fiber from proceeding into the receiving core of the receiving fiber, and being displaced in a direction allowing a portion of the optical signal of the transmitting fiber into the receiving fiber to attenuate the optical signal. An optical signal launched from the transmitting fiber to the receiving fiber is reflected to a separate path from paths of transmitting/receiving fibers so that attenuation may not vary according to wavelength.