Abstract: A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a photoresist or filler. The dicing method comprises the steps of spraying a liquid photoresist as a protectant of microstructures on a wafer on which the microstructures are installed, and coating the whole surface of the wafer with the photoresist (first step); heat treating the coated wafer at a predetermined temperature for a certain time to remove residual water in the sprayed photoresist and to cure the sprayed photoresist (second step); dicing the heat treated wafer (third step); and removing the photoresist (fourth step).

Abstract: A dicing method for a micro electro mechanical system chip, in which a high yield and productivity of chips can be accomplished, resulting from preventing damage to microstructures during a dicing process by using a protective mask. The dicing method for a micro electro mechanical system chip, comprising the steps of designing a grid line and wafer pattern on a chip-scale on the non-adhesive surface of a transparent tape as a protective mask (first step); sticking microstructure-protecting membranes on the adhesive surface of the transparent tape (second step); putting the transparent tape on the whole surface of a wafer in a state wherein the grid line designed on the non-adhesive surface of the transparent tape is matched to the dicing line of the wafer (third step); cutting the transparent tape to a size larger than the wafer, mounting the wafer on a guide ring and dicing the wafer (fourth step); and separating the transparent tape from diced chips (fifth step).

Abstract: Disclosed herein is an optical switch. The optical switch includes an electrostatic actuator and a substrate. The electrostatic actuator includes an electrostatic actuator, the electrostatic actuator comprising, a reciprocating mass located in the center of the electrostatic actuator, first rotating axes located symmetrically at the left and right sides of the reciprocating mass, first rotating masses rotatably connected to the first rotating axes, first rotating springs for supporting the first rotating masses, linear springs connected to the first rotating masses, second rotating masses connected to the linear springs, second rotating springs for supporting the second rotating masses, second rotating axes connected to the second rotating masses, structural anchors at the side ends of the actuator, drive electrodes, and a micro mirror movable by the same displacement as the reciprocating mass.

Abstract: Disclosed is a path-converted variable optical attenuator comprising: a transmitting fiber for launching an optical signal through a transmitting core; a receiving fiber for receiving the optical signal from the transmitting fiber through a receiving core; and a mirror having a reflector for obstructing the optical signal launched from the transmitting core of the transmitting fiber from proceeding into the receiving core of the receiving fiber, and being displaced in a direction allowing a portion of the optical signal of the transmitting fiber into the receiving fiber to attenuate the optical signal. An optical signal launched from the transmitting fiber to the receiving fiber is reflected to a separate path from paths of transmitting/receiving fibers so that attenuation may not vary according to wavelength.

Abstract: A variable optical attenuator to provide a new drive mechanism for an actuator, whereby the amount of attenuation does not increase in geometric progression as voltage increases, and an exceptional resolution effect is achieved.