Abstract: A semiconductor device includes an active region in a substrate, first to third gate structures crossing the active region and sequentially arranged parallel to each other, a first doped region in the active region between the first and second gate structures and having a first horizontal width and a first depth, and a second doped region in the active region between the second and third gate structures and having a second horizontal width and a second depth. The second horizontal width is larger than the first horizontal width and the second depth is shallower than the first depth. A distance between the first and second gate structures adjacent to each other is smaller than that between the second and third gate structures adjacent to each other. Related fabrication methods are also described.

Abstract: A non-volatile memory cell array, comprising sector selection transistors controlled by a voltage applied to sector selection lines, first through fourth memory cells connected in series to the sector selection transistors, a first common source line connected between the first memory cell and the second memory cell, and a second common source line connected between the third memory cell and the fourth memory cell and separated from the first common source line. A first voltage is applied to the first common source line, and a second voltage different from the first voltage is applied to the second common source line.

Abstract: A semiconductor device includes an active region in a substrate, first to third gate structures crossing the active region and sequentially arranged parallel to each other, a first doped region in the active region between the first and second gate structures and having a first horizontal width and a first depth, and a second doped region in the active region between the second and third gate structures and having a second horizontal width and a second depth. The second horizontal width is larger than the first horizontal width and the second depth is shallower than the first depth. A distance between the first and second gate structures adjacent to each other is smaller than that between the second and third gate structures adjacent to each other. Related fabrication methods are also described.

Abstract: A non-volatile memory cell array, comprising sector selection transistors controlled by a voltage applied to sector selection lines, first through fourth memory cells connected in series to the sector selection transistors, a first common source line connected between the first memory cell and the second memory cell, and a second common source line connected between the third memory cell and the fourth memory cell and separated from the first common source line. A first voltage is applied to the first common source line, and a second voltage different from the first voltage is applied to the second common source line.

Abstract: A non-volatile memory integrated circuit device and a method fabricating the same are disclosed. The non-volatile memory integrated circuit device includes a semiconductor substrate, word and select lines, and a floating junction region, a bit line junction region and a common source region. The semiconductor substrate has a plurality of substantially rectangular field regions, and the short and long sides of each substantially rectangular field region are parallel to the row and column directions of a matrix, respectively.

Abstract: The present invention is directed to a non-volatile memory device and a method of operating the same. The non-volatile memory device includes a first transistor connected to an nth bitline and a second transistor connected to an (n+1)th bitline. The first transistor and the second transistor are serially coupled between the nth bitline and the (n+1)th bitline. The non-volatile memory device may include a 2-transistor 1-bit unit cell where a drain region and a source region of a memory cell have the same or similar structure. Since a cell array of a non-volatile memory device according to the invention may include a 2-transistor 2-bit unit cell, storage capacity of the non-volatile memory device may be doubled.

Abstract: A non-volatile memory device includes a first sensing line, a first word line, a depletion channel region, and impurity regions. The first sensing line and the first word line are formed adjacent to each other in parallel on a substrate. The first sensing line and the first word line have a tunnel oxide layer, a first conductive pattern, a dielectric layer pattern and a second conductive pattern sequentially stacked on the substrate. The depletion channel region is formed at an upper portion of the substrate under the first sensing line. The impurity regions are formed at upper portions of the substrate exposed by the first sensing line and the first word line.

Abstract: A device is described comprising a substrate of a first conductivity type having a first dopant concentration, a first well formed in the substrate, a second well of the first conductivity type formed in the substrate and being deeper than the first well, the second well having a higher dopant concentration than the first dopant concentration, and a nonvolatile memory cell formed on the second well. A device is described comprising four wells of various conductivity types with a nonvolatile memory cell formed on the second well. A device is described comprising a plurality of wells for isolating transistors of a plurality of voltage ranges, wherein each one of the plurality of wells contains at least one transistor of a particular voltage range, and wherein transistors of only one of the plurality of voltage ranges are within each of the plurality of wells.

Abstract: A non-volatile memory device with a non-planar gate insulating layer and a method of fabricating the same are provided. The device includes a tunnel insulating pattern, a charge storage layer, an upper insulating layer and a control gate electrode which are sequentially stacked. A lower insulating pattern, which is covered with the charge storage layer and thicker than the tunnel insulating pattern, is disposed on the semiconductor substrate beside the tunnel insulating layer. A heavily doped region including impurities of the same type as the semiconductor substrate is disposed in the semiconductor substrate under the tunnel insulating pattern.

Abstract: A non-volatile memory device includes a memory cell block, a first switching block, and a second switching block. A plurality of memory cells are arranged in the memory cell block and each of the memory cells includes a memory transistor having a floating gate and a control gate and is connected to a local bit line and includes a selection transistor connected to the memory transistor in series that is connected to a source line. The first switching block selectively connects a global bit line to the local bit line and the second switching block controls the memory cells in the memory cell block in units of a predetermined number of bits. The first switching block includes at least two switching devices connected in parallel between the global bit line and the local bit line.

Abstract: The present invention is directed to a non-volatile memory device and a method of operating the same. The non-volatile memory device includes a first transistor connected to an nth bitline and a second transistor connected to an (n+1)th bitline. The first transistor and the second transistor are serially coupled between the nth bitline and the (n+1)th bitline. The non-volatile memory device may include a 2-transistor 1-bit unit cell where a drain region and a source region of a memory cell have the same or similar structure. Since a cell array of a non-volatile memory device according to the invention may include a 2-transistor 2-bit unit cell, storage capacity of the non-volatile memory device may be doubled.

Abstract: A memory device comprises a semiconductor substrate of a first conductive type, a memory transistor, a select transistor, a floating junction region, a common source region, and a bit line junction region. The floating junction region is formed of a second conductive type on the semiconductor substrate below a tunnel insulating film. The common source region of a second conductive type is formed on the semiconductor substrate adjacent a memory transistor gate and separated from the floating junction region. A bit line junction region of a second conductive type is formed on the semiconductor substrate adjacent a select transistor gate and is separated from the floating junction region, wherein the common source region includes a single junction region with a first doping concentration, and a depth of the common source region is shallower than a depth of the floating junction region and the bit line junction region.

Abstract: Provided are an EEPROM cell, an EEPROM device, and methods of manufacturing the EEPROM cell and the EEPROM device. The EEPROM cell is formed on a substrate including a first region and a second region. A first EEPROM device having a first select transistor and a first memory transistor is disposed in the first region, while a second EEPROM device having a second select transistor and a second memory transistor is disposed in the second region. In the first region, a first drain region and a second floating region are formed apart from each other. In the second region, a second drain region and a second floating region are formed apart from each other. A first impurity region, a second impurity region, and a third impurity region are disposed in a common source region between the first and second regions of the substrate. The first and third impurity regions form a DDD structure, and the first and second impurity region form an LDD structure.

Abstract: A method of manufacturing a NOR-type mask ROM device includes forming a first gate electrode for an OFF cell and a second gate electrode for an ON cell on a semiconductor substrate of a first conductivity type. To code the mask ROM device, a plurality of source/drain regions is formed by implanting impurities of a second conductivity type, opposite the first conductivity type, into the semiconductor substrate adjacent only to one side of the first gate electrode and adjacent to both sides of the second gate electrode. To prevent misalignment of a bit line contact hole with a contact region, additional impurities are implanted only into a bit line contact region of the mask ROM device region. When a semiconductor device formed on the same substrate as the mask ROM device includes a double diffused region, additional implantation for both may be realized simultaneously.

Abstract: A non-volatile memory device includes a first sensing line, a first word line, a depletion channel region, and impurity regions. The first sensing line and the first word line are formed adjacent to each other in parallel on a substrate. The first sensing line and the first word line have a tunnel oxide layer, a first conductive pattern, a dielectric layer pattern and a second conductive pattern sequentially stacked on the substrate. The depletion channel region is formed at an upper portion of the substrate under the first sensing line. The impurity regions are formed at upper portions of the substrate exposed by the first sensing line and the first word line.

Abstract: Provided are an EEPROM cell, an EEPROM device, and methods of manufacturing the EEPROM cell and the EEPROM device. The EEPROM cell is formed on a substrate including a first region and a second region. A first EEPROM device having a first select transistor and a first memory transistor is disposed in the first region, while a second EEPROM device having a second select transistor and a second memory transistor is disposed in the second region. In the first region, a first drain region and a second floating region are formed apart from each other. In the second region, a second drain region and a second floating region are formed apart from each other. A first impurity region, a second impurity region, and a third impurity region are disposed in a common source region between the first and second regions of the substrate. The first and third impurity regions form a DDD structure, and the first and second impurity region form an LDD structure.

Abstract: A method of fabricating a nonvolatile memory device includes preparing a semiconductor substrate having a cell array region and a peripheral circuit region. Cell gate patterns are formed in the cell array region, and peripheral gate patterns are formed in the peripheral circuit region. Each of the cell gate patterns includes a control gate pattern and a capping pattern, and each of the peripheral gate patterns has a smaller thickness than the cell gate pattern. An interlayer dielectric layer is formed on the resultant structure having the cell gate patterns and the peripheral gate patterns. The interlayer dielectric layer is planarized by etching until the top surface of the capping pattern is exposed, so that an interlayer dielectric pattern is formed. The interlayer dielectric pattern covers the peripheral circuit region and fills a space between the cell gate patterns.

Abstract: A device is described comprising a substrate of a first conductivity type having a first dopant concentration, a first well formed in the substrate, a second well of the first conductivity type formed in the substrate and being deeper than the first well, the second well having a higher dopant concentration than the first dopant concentration, and a nonvolatile memory cell formed on the second well. A device is described comprising four wells of various conductivity types with a nonvolatile memory cell formed on the second well. A device is described comprising a plurality of wells for isolating transistors of a plurality of voltage ranges, wherein each one of the plurality of wells contains at least one transistor of a particular voltage range, and wherein transistors of only one of the plurality of voltage ranges are within each of the plurality of wells.

Abstract: A non-volatile memory cell able to be written in a first direction and read in a second direction is described. The memory cell includes one or two charge trapping regions located near either the source or the drain, or both the source and the drain. During a programming operation, electrons can be injected into the charge trapping region by hot electron injection. During an erasing operation, holes can be injected into the charge trapping region. Embodiments of the invention include a charge trapping region that is overlapped by the control gate only to an extent where the electrons that were injected during a programming operation can be erased later by injecting holes in the charge trapping region.

Abstract: An electrically erasable programmable read-only memory (EEPROM) device includes an EEPROM cell located on a semiconductor substrate, the EEPROM cell including a memory transistor and a selection transistor. A source region and a drain region are located on the semiconductor substrate adjacent to opposite sides of the EEPROM cell, respectively, and a floating region is positioned between the memory transistor and the selection transistor. The source region includes a first doped region, a second doped region and a third doped region, where the first doped region surrounds a bottom surface and sidewalls of the second doped region, and the second doped surrounds a bottom surface and sidewalls of the third doped region. Also, a second impurity concentration of the second doped region is higher than that of the first doped region and lower than that of the third doped region.