Abstract: A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.

Abstract: A power module for a vehicle includes: a circuit board provided with a first metallic layer; a first switching portion disposed on a center portion of the circuit board, and including a plurality of semiconductor chips; a second switching portion disposed on the outside the first switching portion on the circuit board and including a plurality of semiconductor chips; a third switching portion disposed on the outside the first switching portion on the circuit board; a lead frame disposed on one side of the circuit board; and a signal lead disposed on the other side of the circuit board.

Abstract: An embodiment provides a power module that includes a first substrate comprising first material, a plurality of first switching elements on the first substrate, a second substrate comprising second material having a lower thermal conductivity than the first material, a plurality of second switching elements and a third switching element on the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

Abstract: An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.

Abstract: An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

Abstract: A power module for a vehicle includes: a circuit board provided with a first metallic layer; a first switching portion disposed on a center portion of the circuit board, and including a plurality of semiconductor chips; a second switching portion disposed on the outside the first switching portion on the circuit board and including a plurality of semiconductor chips; a third switching portion disposed on the outside the first switching portion on the circuit board; a lead frame disposed on one side of the circuit board; and a signal lead disposed on the other side of the circuit board.

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Abstract: A power module may include: a positive terminal connected to a positive pole of a battery; a negative terminal connected to a negative pole of the battery; an output terminal connected to a winding among multiple windings included in a motor; a changeover terminal connected to a neutral point regarding the multiple windings; a top switch connected between the positive terminal and the output terminal; a bottom switch connected between the negative terminal and the output terminal; and a changeover switch connected to the changeover terminal and configured to form a common node with at least one of the top switch or the bottom switch.

Abstract: A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.

Abstract: An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

Abstract: A motor driving apparatus includes a motor including windings respectively corresponding to a plurality of phases, a first inverter including at least one first power module and providing an AC voltage corresponding to each of the phases to one end of the windings, a second inverter including a plurality of second power modules each including a changeover switch and providing the AC voltage corresponding to each of the phases to the other end of the windings based on information indicating whether the changeover switch is turned on, and a controller connected to the changeover switch and configured to control whether the changeover switch is turned on according to a motor driving mode, wherein each of the second power modules has a changeover terminal to which a first end of the changeover switch is connected, and the changeover terminals of the plurality of second power modules are short-circuited to each other.

Abstract: Disclosed are a power module and a method for manufacturing the same. A power module according to an embodiment of the present disclosure includes: a first substrate; a second substrate disposed spaced apart from the first substrate and including at least one metal layer; at least one chip disposed between the first substrate and the second substrate and in electrical contact with the metal layer; and a third substrate configured to be disposed spaced apart from the first substrate and the second substrate, electrically connect the chip and at least one external input terminal, include one or more conductive patterns each of which is connected to one of the at least one lead frame, and be formed in a multi-layer structure such that the one or more conductive patterns are not short-circuited to each other.

Abstract: An apparatus for inspecting a display panel includes a light source, a half mirror reflecting a first beam which is a portion of a source beam irradiated from the light source and transmitting a second beam which is another portion of the source beam toward a display panel, a reflective mirror reflecting the second beam transmitting the half mirror and the display panel to return to the half mirror, a panel supporter supporting the display panel between the half mirror and the reflective mirror, a wave plate disposed between the half mirror and the reflective mirror and transmitting the second beam, a rotator rotating the wave plate at a predetermined angle and an imaging detector photographing an interference fringe by the first beam and the second beam.

Abstract: The present disclosure relates to a method for producing fermented green coffee beans and fermented green coffee beans produced thereby, the method including: (A) a step of freezing green coffee beans at ?10 to ?25° C.; (B) a step of immersing the frozen green coffee beans in water for 3 to 10 hours; (C) a step of taking out the green coffee beans immersed in the water, removing the water and leaving the beans to stand for 5 to 15 hours while supplying air at 20 to 30° C.; (D) a step of sterilizing the green coffee beans and then inoculating the same with a strain to anaerobically ferment the same; and (E) a step of sterilizing and then drying the anaerobically fermented green coffee beans. When the fermented green coffee beans are roasted into coffee beans, aroma and taste may be improved and odor may be removed.

Abstract: A power module and a manufacturing method includes a chip; an upper substrate provided above the chip and formed with a circuit pattern; a lower substrate provided below the chip and formed with a circuit pattern; and a spacer including a plurality of metal portions electrically connecting at least two among the chip, the upper substrate and the lower substrate to transmit an electrical signal, and an insulating portion positioned between the plurality of metal portions and insulating the metal portions.

Abstract: A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.

Abstract: Disclosed is a power module capable of maximizing heat dissipation performance through application of a thick lead frame and a ceramic coating layer to upper and lower sides of a semiconductor device.

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Abstract: A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.

Abstract: A power module includes a substrate having a dielectric layer, a first power semiconductor device disposed on an upper part of the substrate, and a second power semiconductor device disposed on a lower part of the substrate.