Abstract: The present invention relates to an LED lamp capable of freely converting color temperature and a method for converting color temperature using the same. The LED lamp may include a single-color or white LED, a fixed filter, and a color temperature conversion filter. The LED lamp can implement illumination light having a desired color temperature and color rendering property by gradually and reversibly expanding and reducing an overlap region between the fixed filter and the color temperature conversion filter, thereby having high convenience and economic efficiency.

Abstract: The present invention relates to an LED lighting module using AC power, where an AC-driven LED lighting is implemented by a simplified rectifier circuit and by adjusting the number of LED elements, without using a dedicated circuit configuration such as SMPS, and the LED modules are arranged in a way to enable a multiplicity of unit modules to be driven with a single power supply. The LED lighting module using AC power contains a power supply which receives AC power; unit modules, each having at least two LED sets connected together, each having one LED element or plural interconnected LED elements driven by an input power; and rectifier circuits, each being separately installed to which the power is input, for rectifying AC power which is input through the power supply when a multiplicity of unit modules form a loop.

Abstract: A UV coating composition for LED color conversion including: 25 wt % to 97 wt % of a UV curable resin; and 3 wt % to 75 wt % of a phosphor. The composition enables emission of white light using only a white LED lens or a light guide plate without affecting a blue, violet or UV LED, thereby eliminating a need for a white LED. Further, users of a LED including the composition can perform direct and easy adjustment of the intensity of white light to obtain a desired intensity by replacing a conventional LED lens. The LED lens provides soft and comfortable lighting which effectively reduces glare caused by high brightness white LED lighting. Moreover, the composition slows deterioration of a lighting device and makes possible a light guide plate having a simple and thin structure.

Abstract: There is provided a radio frequency identification (RFID) tag. The RFID tag includes a base formed of an insulating material, a circuit chip adhered to one surface of the base and including a pad for an electrical connection, and an antenna formed by jetting a conductive material onto the one surface of the base and electrically connected to the pad.

Abstract: A UV coating composition for LED color conversion including: 25 wt % to 97 wt % of a UV curable resin; and 3 wt % to 75 wt % of a phosphor. The composition enables emission of white light using only a white LED lens or a light guide plate without affecting a blue, violet or UV LED, thereby eliminating a need for a white LED. Further, users of a LED including the composition can perform direct and easy adjustment of the intensity of white light to obtain a desired intensity by replacing a conventional LED lens. The LED lens provides soft and comfortable lighting which effectively reduces glare caused by high brightness white LED lighting. Moreover, the composition slows deterioration of a lighting device and makes possible a light guide plate having a simple and thin structure.

Abstract: An LED light converting resin composition and an LED member using the same. The LED light converting resin composition having 20˜99 wt % of transparent resin, 0.8˜60 wt % of a lighting color converting fluorescent substance, and 0.2˜20 wt % of a light diffusing bead with an average particle diameter of 0.2˜30 ?m.

Abstract: Disclosed are an LED light converting resin composition, and an LED member using the same. The LED light converting resin composition comprises 20˜99 wt % of transparent resin, 0.8˜60 wt % of a lighting color converting fluorescent substance, and 0.2˜20 wt % of a light diffusing bead with an average particle diameter of 0.2˜30 ?m. It is possible to emit a white or yellowish white light, like a conventional white light LED, only by independently using a white light emitting LED lens with no change in a blue, violet, or UV LED. There is no need to use a white LED which is relatively expensive and has a short life. Instead, as required, it is possible to easily replace a conventional LED lens with the disclosed LED lens by a user or an operator, thereby obtaining a mild white light with a required luminance. Thus, glaring, caused by a high-luminance white LED lighting, can be effectively reduced, thereby providing a milder lighting with improved comfort.

Abstract: A dye-sensitized solar cell is disclosed. The dye-sensitized solar cell includes a first substrate, being transparent, a first electrode, formed on a rear surface of the first substrate, a second electrode, formed apart from the first electrode, a catalytic layer, formed on a rear surface of the first electrode, a light absorption layer, which is formed on a front surface of the second electrode and includes a dye absorbed into metal oxide such that the dye forms a specific pattern with the metal oxide, an electrolyte, interposed between the first electrode and the second electrode, a base layer, which is formed on a rear surface of the second electrode and forms a background against the pattern formed by the dye such that the pattern can be identified when viewed from the outside, and a second substrate, formed on a rear surface of the base layer.

Abstract: A dye-sensitized solar cell and a mobile device including the same are disclosed. The dye-sensitized solar cell includes a first transparent substrate, which allows sunlight incident to pass through, a second substrate, which is formed apart from the first substrate, and a plurality of cells, which includes a first electrode, a second electrode, a light absorption layer and an electrolyte. Here, the first electrode and the second electrode are interposed between the first substrate and the second substrate, the first electrode is disposed on a rear surface of the first substrate, the second electrode is disposed on a front surface of the second substrate, the light absorption layer is interposed between the first electrode and the second electrode and includes metal oxide and a dye absorbed in the metal oxide, and the electrolyte is interposed between the first electrode and the second electrode.

Abstract: A display array substrate according to an aspect of the invention may include: a substrate wafer having cutting grooves curved inward; and a transparent electrode coated over one surface of the substrate wafer, wherein shock, occurring when cutting the substrate wafer, is prevented from being transmitted to the transparent electrode by cutting the substrate wafer along the cutting grooves having a different height from the transparent electrode.

Abstract: There is provided a radio frequency identification (RFID) tag. The RFID tag includes a base formed of an insulating material, a circuit chip adhered to one surface of the base and including a pad for an electrical connection, and an antenna formed by jetting a conductive material onto the one surface of the base and electrically connected to the pad.

Abstract: A radio frequency identification (RFID) tag includes a circuit chip including a pad for an electrical connection on one surface thereof, a molding part receiving the circuit chip therein while exposing the pad to the outside, and an antenna formed on an outer surface of the molding part, having a predetermined pattern shape and electrically connected to the pad.

Abstract: The present invention relates to an LED lighting module using AC power, where an AC-driven LED lighting is implemented by a simplified rectifier circuit and by adjusting the number of LED elements, without using a dedicated circuit configuration such as SMPS, and the LED modules are arranged in a way to enable a multiplicity of unit modules to be driven with a single power supply. The LED lighting module using AC power contains a power supply which receives AC power; unit modules, each having at least two LED sets connected together, each having one LED element or plural interconnected LED elements driven by an input power; and rectifier circuits, each being separately installed to which the power is input, for rectifying AC power which is input through the power supply when a multiplicity of unit modules form a loop.

Abstract: The present invention relates to an AC-powered LED lighting system made in implementing AC-driven LED lightings that are achieved without the use of a dedicated circuit configuration such as SMPS, etc., but with the help of a simplified rectifier circuit and through adjustment of the number of LEDs. To this end, there is provided a lighting system composed of LED lightings, for which an LED module where LEDs are mounted is driven by an external AC input power. Here, an AC-powered LED lighting system comprises: a power source part receiving AC power from outside for use as a drive source of the system; a rectifying part rectifying the input power by a bridge rectifier circuit; and a LED driving part configured with a plurality of serially connected LEDs in correspondence to the input power, the LED driving part receiving rectified power from the rectifying part to drive the LEDs by a target voltage.

Abstract: This invention relates to an LED lamp device which can be applicable to a socket of a general fluorescent lamp, a halogen lamp, an incandescent lamp or the like by embodying an LED illuminating lamp powered by an alternating current (AC) through a simplified rectifier circuit and control of the number of LEDs without a dedicated circuit such as SMPS or the like when constructing the illuminating lamp using the LEDs, and which can reduce manufacturing costs and miniaturize the size of a product.

Abstract: A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.

Abstract: A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.

Abstract: In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

Abstract: A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.

Abstract: A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.