Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.

Abstract: Aspects relate to activation of a cell (e.g., an SCell) based on measurements made by a user equipment (UE) when the cell is not activated with respect to (e.g., as a secondary cell for) the UE (e.g., the cell is deemed by the network as an unknown cell for that UE). In this case, when the network requests the UE to conduct measurements with respect to that cell (e.g., in conjunction with activation of the cell), the UE may report information based on the measurements the UE conducted when the cell was not activated with respect to that UE.

Abstract: A composition, and method for using the composition, in the fabrication of an electronic device, and particularly for depositing a film comprising silicon and boron having low dielectric constant (<6.0) and high oxygen ash resistance. The film includes silicon and boron and may be, without limitation, a silicon borocarboxide, a silicon borocarbonitride, a silicon boroxide, or a silicon borocarboxynitride.

Abstract: An yttrium compound, a method of manufacturing an integrated circuit device, and a raw material for forming an yttrium-containing film, the yttrium compound being represented by the following General formula (1):

Abstract: Provided is a display device. The display device includes a flexible substrate comprising an active area, and a non-active area surrounding a border of the active area; a thin-film transistor and a light-emitting element on the active area; an encapsulation unit over the thin-film transistor and the light-emitting element; a hole formed in the active area by removing a portion of the flexible substrate; a first common layer disposed on a side surface of the hole, extended from the light-emitting element and comprising same elements with the light-emitting element; and a tip protruding from the side surface of the hole. The first common layer disposed adjacent to the tip is disconnected from the light-emitting element.

Abstract: Discussed is an apparatus for self-assembling semiconductor light-emitting devices, the apparatus including a fluid chamber to accommodate the semiconductor light-emitting devices, each semiconductor light-emitting device having a magnetic body; a magnet to apply a magnetic force to the semiconductor light-emitting devices while an assembly substrate is disposed at an assembly position of the self-assembly apparatus; a power supply to induce formation of an electric field on the assembly substrate to allow the semiconductor light-emitting devices to be seated at a preset positions on the assembly substrate in a process of moving the semiconductor light-emitting devices due to a change in a position of the magnet; and a fluid injector to shoot a fluid to some of the semiconductor light-emitting devices to allow the some of the semiconductor light-emitting devices seated on the assembly substrate to be separated from the assembly substrate.

Abstract: Embodiments relate to a method for supporting X-ray image reading including receiving information associated with a reading target positioned in a reading space where X-rays pass through or are reflected off, acquiring a non X-RAY image of an item object based on the information associated with the reading target, and generating a fake X-RAY image of the item object by applying the non X-RAY image of the item object to the image transform model, and a system for performing the same.

Abstract: A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.

Abstract: Disclosed are an X-RAY image reading support method including the steps of acquiring a target X-RAY image photographed by transmitting or reflecting X-RAY in a reading space in which an object to be read is disposed; applying the target X-RAY image to a reading model that extracts features from an input image; and identifying the object to be read as an object corresponding to a classified class when the object to be read is classified as a set class based on a first feature set extracted from the target X-RAY image, and an X-RAY image reading support system performing the method.

Abstract: A receiver circuit includes data lane modules, a clock lane module, a bias current controller and a link layer. Each of the data lane modules receive respective data signals. The clock lane module receives clock signals and provides each of the data lane modules with a respective divided clock signal among divided clock signals. The bias current controller controls a clock bias current. The link layer provides a bias control signal to the bias current controller and provides clock gating signals to the clock lane module, based on low power data signals low power clock signals. The bias current controller, based on the bias control signal, provides the clock bias current having a first magnitude to the clock lane module in a second power mode and provides the clock bias current having a second magnitude to the clock lane module in a third power mode.

Abstract: The present invention may be applied to display device-related technical fields and relates to a display device using a semiconductor light-emitting element, such as a micro light-emitting diode (LED), and a manufacturing method therefor. The present invention, according to one embodiment, may comprise: a substrate; a stepped film positioned on at least some pixel regions, among a plurality of individual pixel regions positioned on the substrate; an assembly electrode positioned on the substrate or the stepped film; an insulation layer positioned on the assembly electrode; a partition wall positioned on the insulation layer and defining an assembly groove having mounted therein a semiconductor light-emitting element forming the individual pixel; the semiconductor light-emitting element mounted in an assembly surface of the assembly groove; and a lighting electrode electrically connected to the semiconductor light-emitting element.

Abstract: Discussed is an assembly apparatus for assembling a semiconductor light emitting diode to a display panel, the assembly apparatus including an assembly module including at least one magnetic member and a magnetic member accommodator having at least one magnetic member accommodation hole, and a rotary module connected to the assembly module to rotate the assembly module along an orbit.

Abstract: The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field.

Abstract: A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.

Abstract: Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.

Abstract: The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.

Abstract: An evaporator includes: an evaporator case that defines a food storage space therein; a cooling tube located at the evaporator case and filled with refrigerant; a foil heater attached to at least one surface of the evaporator case and configured to contact the evaporator case and to generate heat such that heat for defrosting is transferred to the evaporator case. A defrosting time is reduced in comparison to that of conventional natural defrosting, such that the freshness of food can be maintained, and the cooling efficiency, having been reduced by frost, is increased such that power consumption can be reduced. The foil heater is attached to a conventional roll-bond type evaporator case, and the present invention has an advantageous effect of facilitating the maintenance of the foil heater because of a structure in which the foil heater is attached to the evaporator case.

Abstract: A display device can include a plurality of semiconductor light emitting diodes; first and second wiring electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes; a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode that generate an electric field when a current is supplied thereto; a dielectric layer disposed to cover the plurality of pair electrodes; and a covalent bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes, and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes, wherein the first wiring electrode and the second wiring electrode are located at opposite sides of the plurality of pair electrodes based on the plurality of semiconductor light emitting diodes.

Abstract: Disclosed is an evaporator, comprising: a heating tube left as an empty space between first and second case sheets, which form an evaporator case, so as not to be overlapped with a cooling tube, and forming a heating passage in which a working liquid for defrosting flows; and a heater attached to the outer surface, which corresponds to the heating tube, of the evaporator case so as to heat the working liquid inside the heating tube. The heating tube can have a structure which an inlet and an outlet are respectively formed at both sides of a heater attachment part in the longitudinal direction and both end portions of a passage part are respectively connected to the inlet and the outlet, or can have a structure in which an opening is formed at one side of the heater attachment part, the working liquid heated by the heater is discharged through the opening, and the cooled working liquid is returned.

Abstract: Disclosed are an X-RAY image reading support method including the steps of acquiring a target X-RAY image photographed by transmitting or reflecting X-RAY in a reading space in which an object to be read is disposed; applying the target X-RAY image to a reading model that extracts features from an input image; and identifying the object to be read as an object corresponding to a classified class when the object to be read is classified as a set class based on a first feature set extracted from the target X-RAY image, and an X-RAY image reading support system performing the method.