Patents by Inventor Hyun Yoon
Hyun Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12292849Abstract: A peripheral component interconnect express (PCIe) device includes a common function performing operations associated with a PCIe interface according to a function type, the common function being programmable to be a function type selected from a plurality function types, an access identification information controller generating first access identification information for allowing an access to the common function, and providing the first access identification information to an assigned system image to which the common function has been assigned, a data packet receiver receiving a data packet including target identification information indicating a target system image from the target system image, and an access allowance determiner determining whether or not to allow the target system image to access the common function based on the first access identification information and the target identification information.Type: GrantFiled: January 8, 2024Date of Patent: May 6, 2025Assignee: SK hynix Inc.Inventors: Yong Tae Jeon, Byung Cheol Kang, Seung Duk Cho, Sang Hyun Yoon, Se Hyeon Han, Jae Young Jang
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Patent number: 12294389Abstract: A semiconductor device such as a sigma delta A/D converter includes an integrator configured to output first and second output signals, a quantizer configured to generate a first digital signal based on the output signals, first and second switches configured to control application of first and second reference voltages to a first resistor based on respective first and second control signals, and a third switch configured to control connection between the first resistor and a first input terminal of the integrator based on a third control signal. The first through third control signals are generated based on the first digital signal and a second digital signal obtained by delaying the first digital signal. The third switch is turned on when any one of the first and second switches is turned on, and is turned off when both the first and second switches are turned off.Type: GrantFiled: December 30, 2022Date of Patent: May 6, 2025Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Young Hyun Yoon
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Publication number: 20250132433Abstract: Provided is a battery pack and a vehicle including the same. A battery pack according to an embodiment of the present disclosure includes a plurality of pouch-type battery cells, a pack case having an inner space in which the plurality of pouch-type battery cells are accommodated, and a plurality of cell covers provided in the inner space of the pack case to at least partially surround at least some of the plurality of pouch-type battery cells, each of the plurality of cell covers being each to have a dimension that is changeable in a width direction.Type: ApplicationFiled: July 11, 2023Publication date: April 24, 2025Applicant: LG Energy Solution, Ltd.Inventors: Jeong-Hoon Park, Ka-Hyun Yoon, Hye-Mi Jung, Hyuk-Kyun Chang, Jung-Woo Choi
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Patent number: 12278052Abstract: A multilayer electronic component includes a body including a dielectric layer including a plurality of dielectric grains and internal electrodes alternately disposed with the dielectric layer in a first direction and external electrodes disposed on the body, wherein at least one of the plurality of dielectric grains has a core-shell structure including an inner core and a shell covering at least a portion of the core, a ratio of an average size of the core to an average size of the dielectric grains having the core-shell structure is 0.4 or more and 0.8 or less, a ratio ((Dy+Tb)/Sn) of the sum of the moles of dysprosium (Dy) and the moles of terbium (Tb) to the moles of tin (Sn) included in the dielectric layer satisfies 0.7 or more and 1.5 or less, and at least one of the dielectric layers has four or more dielectric grains in the first direction.Type: GrantFiled: March 17, 2023Date of Patent: April 15, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hee Sun Chun, Jin Woo Kim, Tae Hyung Kim, Hyo Ju Lee, Seok Hyun Yoon, Jeong Ryeol Kim
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Patent number: 12278053Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.Type: GrantFiled: December 6, 2023Date of Patent: April 15, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Woo Kim, Chang Hak Choi, Seok Hyun Yoon, Ki Yong Lee, Jong Myeong Jeon
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Patent number: 12272839Abstract: An electrode assembly includes a plurality of electrodes arranged in a stack along a stacking axis with a respective separator portion of an elongated separator sheet positioned between and winding around each of the electrodes in the stack along a serpentine path. The plurality of electrodes include a top electrode positioned at a top of the stack along the stacking axis, and the plurality of electrodes include a bottom electrode positioned at a bottom of the stack. The separator portions in the stack include a top separator portion abutting the top electrode and a bottom separator portion abutting the bottom electrode. The bottom electrode may have a thickness along the stacking axis that is from 80% to 120% of a thickness of the top electrode along the stacking axis. Moreover, a maximum thickness of each of the electrodes in the stack may be less than 8.3 mm.Type: GrantFiled: November 1, 2024Date of Patent: April 8, 2025Assignee: LG Energy Solution, Ltd.Inventors: Se Hyun Yoon, Beomsu Kim, Yong Nam Kim, Heeyong Kim, Dong Hyeuk Park, Dong Myung Kim, Jae Han Jung
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Publication number: 20250112147Abstract: An integrated circuit device with front- and back-side metals may include coils in interconnect structures on one or both sides of a semiconductor substrate. The coil(s) may include vias extending through (and coupling wires on both sides of) the substrate. The coil(s) may include multiple turns or loops. The coil(s) may be on one side, and parallel to, the substrate. Coils may be orthogonal or parallel to each other. A resistor may have smaller resistor segments on both sides of the substrate coupled by through-substrate vias. A capacitor may utilize through-substrate vias as plates. Through-substrate vias may inhibit eddy currents in the substrate. A cage of wires and through-substrate vias may shield devices within the cage from interfering fields external to the cage.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: Intel CorporationInventors: Xi Li, Chuanzhao Yu, Yazan Hejazin, Marco Bresciani, Hyun Yoon, Lichung Chang
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Patent number: 12258434Abstract: The present disclosure relates to an expanded foam solution for forming a thermosetting expanded foam having excellent flame retardancy produced using the same. According to the present disclosure, nanoclay is mixed with a polyol-based compound using ultrasonic waves, an isocyanate-based compound is added, and a trimerization catalyst or an isocyanurate compound is mixed with the polyol-based compound so that an isocyanurate structure is formed.Type: GrantFiled: June 16, 2023Date of Patent: March 25, 2025Assignee: KYUNG DONG ONE CORPORATIONInventors: Jong Hyun Yoon, Sang Yun Lee, Dae Woo Nam
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Publication number: 20250093768Abstract: A substrate processing apparatus is provided and includes: a support unit including a spin chuck and a centering jig that is on the spin chuck, the spin chuck configured to support and rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a swing arm including a correction unit that includes a sensor and an emitter, the swing arm configured to move such that the correction unit moves to a target point on the substrate, and the emitter configured to irradiate a beam towards the substrate; and a controller configured to: control the spin chuck and the swing arm; and determine whether a movement trajectory of the swing arm is aligned with a rotation center of the spin chuck based on information acquired by the sensor about the centering jig.Type: ApplicationFiled: July 11, 2024Publication date: March 20, 2025Applicants: SEMES CO., LTD., SAMSUNG ELECTRONICS CO. LTD.Inventors: Jin Yeong SUNG, Ki Hoon CHOI, Seung Un OH, Young Ho PARK, Sang Hyeon RYU, Jang Jin LEE, Hyun YOON, Sang Gun LEE, Yu Jin CHO, Ho Jong HWANG, Jong Ju PARK, Jong Keun OH, Yong Woo KIM
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Publication number: 20250095971Abstract: A plasma processing apparatus includes: a plasma chamber; a radio frequency (RF) power supply configured to generate plasma in the plasma chamber; an electromagnet configure to apply a magnetic field to the plasma; and a pulse current generator configured to provide a pulse current to the electromagnet, wherein each period of the pulse current includes a first section and a second section subsequent to the first section, and the pulse current generator is further configured to: provide, at the first section, the pulse current to the electromagnet in a first direction to generate the magnetic field, and provide, at the second section, the pulse current to the electromagnet in a second direction opposite to the first direction to reduce intensity of the magnetic field generated at the first section.Type: ApplicationFiled: April 19, 2024Publication date: March 20, 2025Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji Mo LEE, kyung-Sun Kim, Dong Hyeon Na, Jung Hyun Song, Myeong Soo Shin, Seung Bo Shim, Kui Hyun Yoon, Jun Ho Lee, Woong Jin Cheon, Dong Seok Han
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Publication number: 20250073742Abstract: Provided is a control device and a substrate processing apparatus including the same. The substrate processing apparatus includes a support unit configured to support and rotate a first substrate, the support unit including a spin chuck, a spray unit configured to spray a processing fluid on the first substrate, a correction unit on a swing arm and configured to irradiate a beam onto the first substrate when the processing fluid is provided on the first substrate, wherein the swing arm is adjacent to the spin chuck and is configured to move the correction unit to a target point on the first substrate, and a controller configured to control the spin chuck and the swing arm, and correct a position error of the swing arm using a second substrate, wherein a plurality of anchor patterns are on the second substrate.Type: ApplicationFiled: July 10, 2024Publication date: March 6, 2025Inventors: Jin Yeong Sung, Ki Hoon Choi, Seung Un Oh, Young Ho Park, Sang Hyeon Ryu, Jang Jin Lee, Hyun Yoon, Sang Gun Lee, Yu Jin Cho, Ho Jong Hwang, Jong Ju Park, Jong Keun Oh, Yong Woo Kim
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Publication number: 20250074624Abstract: An aircraft assembly system includes a jig; and a position adjuster connected to the jig and configured to adjust a position of the jig, wherein the jig includes a ball stud between the jig and the position adjuster, and the position adjuster includes a socket in which at least a portion of the ball stud is accommodated and in which the ball stud is rotatably fastened.Type: ApplicationFiled: January 29, 2024Publication date: March 6, 2025Inventors: Dong Ho Lee, Myung Kyun Jeong, Chang Hoon Lee, Tae Hwan Kwak, Sang Bin Han, Suk Hyun Yoon, Tae Jin Song, Jun Young Choi, Cheol Bae Park
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Patent number: 12244037Abstract: An electrode assembly manufacturing method includes the steps of: assembling an electrode stack; performing a primary heat press operation on the electrode stack; then performing a pre-heating operation on the electrode stack; and then performing a secondary heat press operation on the electrode stack. The pre-heating operation may include applying heat and pressure to the electrode stack for a time period from 10 seconds to 40 seconds under a pressure condition from 0.5 MPa to 2 MPa and under a temperature condition from 50° C. to 85° C. The pressure condition applied in the pre-heating operation may include applying a lower pressure than that applied in the primary and secondary heat press operations. The primary heat press operation may include engaging the electrode stack with a gripper to secure a position of the electrode stack, which gripper may be disengaged from the electrode stack before performing the pre-heating operation.Type: GrantFiled: July 8, 2022Date of Patent: March 4, 2025Assignee: LG Energy Solution, Ltd.Inventors: Se Hyun Yoon, Beomsu Kim, Yong Nam Kim, Heeyong Kim, Dong Hyeuk Park, Dong Myung Kim, Jae Han Jung
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Patent number: 12244038Abstract: An electrode assembly includes a plurality of electrodes arranged in a stack along a stacking axis with a respective separator portion of an elongated separator sheet positioned between and winding around each of the electrodes in the stack along a serpentine path. The plurality of electrodes include a top electrode positioned at a top of the stack along the stacking axis, and the plurality of electrodes include a bottom electrode positioned at a bottom of the stack. The separator portions in the stack include a top separator portion abutting the top electrode and a bottom separator portion abutting the bottom electrode. The bottom electrode may have a thickness along the stacking axis that is from 80% to 120% of a thickness of the top electrode along the stacking axis. Moreover, a maximum thickness of each of the electrodes in the stack may be less than 8.3 mm.Type: GrantFiled: July 8, 2022Date of Patent: March 4, 2025Assignee: LG Energy Solution, Ltd.Inventors: Se Hyun Yoon, Beomsu Kim, Yong Nam Kim, Heeyong Kim, Dong Hyeuk Park, Dong Myung Kim, Jae Han Jung
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Publication number: 20250064877Abstract: Proposed is a muscle strength-enhancing composition being capable of maintaining or strengthening muscles or preventing muscle-related diseases. More specifically, proposed is a food composition containing a composite extract as an active ingredient obtained by mixing Angelica keiskei and Morus alba L. at a weight ratio of 1:8 to 16 and extracting the resulting mixture with alcohol. The food composition promotes antioxidant activity (for example, DPPH scavenging activity and ABTS scavenging activity) and muscle function enhancement activity which suppresses muscle protein breakdown and promotes muscle building, whereby the food composition prevents muscle-related diseases by enabling muscles to be maintained or strengthened.Type: ApplicationFiled: July 25, 2023Publication date: February 27, 2025Applicant: HAMSOA PHARMACEUTICAL CO., LTD.Inventors: Hyug Yong CHOI, Hyun Joo CHO, Youn Seon KIM, Tae Hee KIM, Jae Hyun YOON, Yung Hyun CHOI, Seon Yeong JI, Hyun HWANGBO, Da Hye KIM, Min Yeong KIM
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Publication number: 20250065360Abstract: A control device and a substrate processing apparatus including the same are provided. The substrate processing apparatus includes: a support unit including a spin head and configured to support and to rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a correction unit in a swing arm, the correction unit configured to move to a target point on the substrate and to irradiate a beam when the processing liquid is sprayed onto the substrate; and a control unit configured to calculate the target point, wherein the control unit is configured to convert image coordinates associated with a first coordinate system and then to calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and the second coordinate system is based on rotation angles of the spin head and the swing arm.Type: ApplicationFiled: July 10, 2024Publication date: February 27, 2025Inventors: Jin Yeong Sung, Ki Hoon Choi, Seung Un Oh, Young Ho Park, Sang Hyeon Ryu, Jang Jin Lee, Hyun Yoon, Sang Gun Lee, Yu Jin Cho, Ho Jong Hwang, Jong Ju Park, Jong Keun Oh, Yong Woo Kim
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Patent number: 12237181Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a cup having a treatment space therein; a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit, in which the support unit includes: a plurality of pin members provided to the support plate to support the substrate placed on the support plate; and a discharge member coupled to the pin member to discharge charges to the air according to a rotation of the support plate, and the discharge member is provided as a conductive member.Type: GrantFiled: March 24, 2022Date of Patent: February 25, 2025Assignee: Semes Co., Ltd.Inventors: Ho Jong Hwang, Do Yeon Kim, Hyun Yoon
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Patent number: 12237816Abstract: An on-chip transformer circuit is disclosed. The on-chip transformer circuit comprises a primary winding circuit comprising at least one turn of a primary conductive winding arranged as a first N-sided polygon in a first dielectric layer of a substrate; and a secondary winding circuit comprising at least one turn of a secondary conductive winding arranged as a second N-sided polygon in a second, different, dielectric layer of the substrate. In some embodiments, the primary winding circuit and the secondary winding circuit are arranged to overlap one another at predetermined locations along the primary conductive winding and the secondary conductive winding, wherein the predetermined locations comprise a number of locations less than all locations along the primary conductive winding and the secondary conductive winding.Type: GrantFiled: August 18, 2021Date of Patent: February 25, 2025Assignee: Intel CorporationInventors: Kaushik Dasgupta, Chuanzhao Yu, Chintan Thakkar, Saeid Daneshgar, Hyun Yoon, Xi Li, Anandaroop Chakrabarti, Stefan Shopov
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Publication number: 20250062493Abstract: An electrode assembly manufacturing method includes the steps of: assembling an electrode stack; performing a primary heat press operation on the electrode stack while engaging the electrode stack with a gripper; and then performing a secondary heat press operation on the electrode stack while the gripper is disengaged from the electrode stack. The secondary heat press operation may include applying heat and pressure to the electrode stack for a time period from 5 seconds to 60 seconds under a temperature condition from 50° C. to 90° C. and under a pressure condition from 1 Mpa to 6 Mpa. The step of assembling the electrode stack may include alternately stacking first and second electrodes on an elongated separator sheet, and sequentially folding the separator sheet over a previously-stacked one of the electrodes before a subsequent electrode is stacked. An apparatus for performing the manufacturing method is also disclosed.Type: ApplicationFiled: October 31, 2024Publication date: February 20, 2025Applicant: LG Energy Solution, Ltd.Inventors: Se Hyun Yoon, Beomsu Kim, Yong Nam Kim, Heeyong Kim, Dong Hyeuk Park, Dong Myung Kim, Jae Han Jung
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Publication number: 20250062494Abstract: An electrode assembly includes a plurality of electrodes arranged in a stack along a stacking axis with a respective separator portion of an elongated separator sheet positioned between and winding around each of the electrodes in the stack along a serpentine path. The plurality of electrodes include a top electrode positioned at a top of the stack along the stacking axis, and the plurality of electrodes include a bottom electrode positioned at a bottom of the stack. The separator portions in the stack include a top separator portion abutting the top electrode and a bottom separator portion abutting the bottom electrode. The bottom electrode may have a thickness along the stacking axis that is from 80% to 120% of a thickness of the top electrode along the stacking axis. Moreover, a maximum thickness of each of the electrodes in the stack may be less than 8.3 mm.Type: ApplicationFiled: November 1, 2024Publication date: February 20, 2025Applicant: LG Energy Solution, Ltd.Inventors: Se Hyun Yoon, Beomsu Kim, Yong Nam Kim, Heeyong Kim, Dong Hyeuk Park, Dong Myung Kim, Jae Han Jung