Patents by Inventor Hyung Jin Park

Hyung Jin Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240363548
    Abstract: A wafer includes chip areas and a first scribe lane disposed between the chip areas, and a first trench pattern disposed in the first scribe lane. The first scribe lane extends in a first direction. The first trench pattern includes a plurality of first trench groups spaced apart from each other in the first direction.
    Type: Application
    Filed: September 6, 2023
    Publication date: October 31, 2024
    Inventors: Geon Hee KIM, Hyung Jin PARK, Seung Won LEE
  • Patent number: 12077646
    Abstract: This application features a method of forming a polymer layer on the surface of a substrate using a self-initiating monomer. A polymer layer is formed by polymerization of a monomer on a metal layer to fill or cover defects of the metal layer. The metal layer the polymer layer may be used as an airtight material.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: September 3, 2024
    Assignee: Quantum MicroMaterials, Inc.
    Inventors: Sung-Chan Jo, Kyonghoon Lee, John S. Althaus, Hyung Jin Park
  • Patent number: 12043148
    Abstract: An embodiment is a seat height gear system including a monopost apparatus configured to be mounted under a seat, the monopost apparatus comprising a lower post and an upper post, and a direct drive motor apparatus within the monopost apparatus, the direct drive motor apparatus including a motor and a gear unit, the gear unit including a pinion and a rack bar, the rack bar being configured to be engaged with the pinion, the motor being fixed to the lower post of the monopost apparatus, the pinion being coupled to the motor, the rack bar being fixed to an upper post of the monopost apparatus, the motor being configured to rotate the pinion, and the rack bar being configured to convert the rotation of the pinion into the linear motion.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: July 23, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DAS CO., LTD
    Inventors: Hyung-Jin Park, Gil-Ju Kim, Soo-Hyun Moon, Ju-Yeol Kong, Sung-Hak Hong, Sang-Do Park, Ga-Be Nam, Seong-Hwan Song, Yong-Tak Han, Duck-Yeol Kim
  • Publication number: 20240209231
    Abstract: This application disclose an airtight film including a plastic base layer; a ceramic sealing layer formed on the plastic base layer; and a polymer sealing layer. The polymer sealing layer includes many polymer molecules chemically bonding to the ceramic sealing layer as a result of polymerization reactions of at least one monomer on the ceramic sealing layer as opposed to from coating of a pre-polymerized polymer composition on the ceramic sealing layer.
    Type: Application
    Filed: May 12, 2023
    Publication date: June 27, 2024
    Inventors: Sung-Chan JO, Kyonghoon LEE, John S. ALTHAUS, Hyung Jin PARK
  • Publication number: 20240006333
    Abstract: A semiconductor includes an underlayer; a lower core layer spaced apart from the underlayer, the lower core layer including a plurality of lower segments spaced apart from each other in a horizontal direction; an upper core layer spaced apart from the lower core layer, the upper core layer including a plurality of upper segments spaced apart from each other in the horizontal direction; a post pattern vertically penetrating the upper core layer and the lower core layer; a passivation layer surrounding the lower core layer, the upper core layer, and the post pattern; coating layer surrounding the passivation layer; and a support pattern extending in the vertical direction and passing through the lower core layer, the upper core layer, the passivation layer, and the coating layer.
    Type: Application
    Filed: November 15, 2022
    Publication date: January 4, 2024
    Inventors: Seung Won LEE, Hyung Jin PARK, Han Bit KIM, Jeong Woo HONG
  • Publication number: 20230357578
    Abstract: This application disclose an airtight film including a plastic base layer; a ceramic sealing layer formed on the plastic base layer; and a polymer sealing layer. The polymer sealing layer includes many polymer molecules chemically bonding to the ceramic sealing layer as a result of polymerization reactions of at least one monomer on the ceramic sealing layer as opposed to from coating of a pre-polymerized polymer composition on the ceramic sealing layer.
    Type: Application
    Filed: May 12, 2023
    Publication date: November 9, 2023
    Inventors: Sung-Chan JO, Kyonghoon LEE, John S. ALTHAUS, Hyung Jin PARK
  • Publication number: 20230349205
    Abstract: Disclosed herein is a charging door assembly of a vehicle, which improves operability when opened and reduces a protruding amount. The charging door assembly of a vehicle according to the present disclosure includes a charging door configured to open and close a charging port formed on a panel of a vehicle body, a main link hinge-coupled to the vehicle body and an inner surface of the charging door, and a sub-link hinge-coupled to the vehicle body and the inner surface of the charging door at a position spaced apart from the main link. After the charging door is moved to the outside of the panel, the inner surface of the charging door is opened while maintaining a state in which the inner surface of the charging door is located within a predetermined distance from the panel.
    Type: Application
    Filed: December 8, 2022
    Publication date: November 2, 2023
    Inventors: Yong-Won Jeong, Jeong-Ho Byeon, Chan Joo Moon, Hyung-Jin Park, Ji-Hun Kim, Dong-Ho Ha
  • Patent number: 11804446
    Abstract: Provided is a semiconductor device capable of improving the divisibility of a wafer by concentrating crack stress by disposing notch patterns on a scribe line of a wafer, by locally removing a metal thin film in a scribe line and propagating a dividing energy in a vertical direction of a die surface. A semiconductor device includes: die regions spaced apart from each other in a wafer, scribe line regions disposed between neighboring ones of the die regions and covered with a metal material layer, and one or more open areas disposed in each of the scribe line regions and formed by locally removing the metal material layer, wherein each of the open areas includes one or more notch patterns indicating a direction in which the scribe line region is extended.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: October 31, 2023
    Assignee: SK hynix Inc.
    Inventors: Hyung Jin Park, Jung Wook Kim, Hyo Jun Lee
  • Patent number: 11772522
    Abstract: An embodiment rail device includes an upper rail, a first bearing support on the upper rail, a lower rail, a bearing connection end on the lower rail and inserted into the first bearing support, a vertically elongated bearing contact adjustment hole on the lower rail, an upper bearing rotatably connected to the bearing connection end and in close contact with a floor of the first bearing support, a lower plate including a fastening groove that receives a lower end of the lower rail, a bearing shaft mounting hole on a wall surface portion of the fastening groove and matched with the bearing contact adjustment hole, a second bearing support outside the fastening groove and having an opened upper portion, a lower bearing rotatably disposed within the second bearing support, and a bearing shaft fastened to the bearing shaft mounting hole and the bearing contact adjustment hole by a screw.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: October 3, 2023
    Assignees: Hyundai Motor Company, Kia Corporation, DAS Co., Ltd.
    Inventors: Hyung Jin Park, Gil Ju Kim, Soo Hyun Moon, Ju Yeol Kong, Sung Hak Hong, Sang Do Park, Ga Be Nam, Jae Chul Jung, Jin Gu Park
  • Patent number: 11752905
    Abstract: A device for providing a fatigue-reducing position of a vehicle seat is provided. A first latch unit is mounted on a rear seat cushion such that a first striker mounted on a front seatback is fastened thereto in a lockable manner. A second latch unit is mounted on a rear surface portion of a rear seatback. A sliding-locking unit is mounted on a package panel disposed behind a rear seat in a height adjustable manner. A second striker is provided on a front end of the sliding-locking unit to be fastened to the second latch unit in a lockable manner. A seat in a second or third row in the cabin of a vehicle is detachable from the original position to be fixedly placed like a hammock between a front seat and a package panel to provide a fatigue-reducing position in which an occupant comfortably rests.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: September 12, 2023
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Hyun Kyu Moon, Sang Do Park, Sang Uk Yu, Deok Soo Lim, Hyo Cheol Kang, Ju Yeol Kong, Hyung Jin Park, Seon Chae Na, Chan Ho Jung, Seong Mun Yun
  • Publication number: 20230278470
    Abstract: An embodiment is a seat height gear system including a monopost apparatus configured to be mounted under a seat, the monopost apparatus comprising a lower post and an upper post, and a direct drive motor apparatus within the monopost apparatus, the direct drive motor apparatus including a motor and a gear unit, the gear unit including a pinion and a rack bar, the rack bar being configured to be engaged with the pinion, the motor being fixed to the lower post of the monopost apparatus, the pinion being coupled to the motor, the rack bar being fixed to an upper post of the monopost apparatus, the motor being configured to rotate the pinion, and the rack bar being configured to convert the rotation of the pinion into the linear motion.
    Type: Application
    Filed: September 20, 2022
    Publication date: September 7, 2023
    Inventors: Hyung-Jin Park, Gil-Ju Kim, Soo-Hyun Moon, Ju-Yeol Kong, Sung-Hak Hong, Sang-Do Park, Ga-Be Nam, Seong-Hwan Song, Yong-Tak Han, Duck-Yeol Kim
  • Publication number: 20230200694
    Abstract: The present disclosure provides a lancing device that includes a lancet for piercing a user's skin and a lancing device body to drive the lancet. An actuator included in the lancing device body can drive the lancet to perform a linear reciprocating motion multiple times upon a single activation. Accordingly, the lancet may pierce the user's skin multiple times upon a single activation.
    Type: Application
    Filed: February 17, 2023
    Publication date: June 29, 2023
    Inventors: Kyonghoon LEE, Hyung Jin PARK, Jihong LEE, Mincheol KIM
  • Publication number: 20230202353
    Abstract: An embodiment rail device includes an upper rail, a first bearing support on the upper rail, a lower rail, a bearing connection end on the lower rail and inserted into the first bearing support, a vertically elongated bearing contact adjustment hole on the lower rail, an upper bearing rotatably connected to the bearing connection end and in close contact with a floor of the first bearing support, a lower plate including a fastening groove that receives a lower end of the lower rail, a bearing shaft mounting hole on a wall surface portion of the fastening groove and matched with the bearing contact adjustment hole, a second bearing support outside the fastening groove and having an opened upper portion, a lower bearing rotatably disposed within the second bearing support, and a bearing shaft fastened to the bearing shaft mounting hole and the bearing contact adjustment hole by a screw.
    Type: Application
    Filed: November 18, 2022
    Publication date: June 29, 2023
    Inventors: Hyung Jin Park, Gil Ju Kim, Soo Hyun Moon, Ju Yeol Kong, Sung Hak Hong, Sang Do Park, Ga Be Nam, Jae Chul Jung, Jin Gu Park
  • Patent number: 11460983
    Abstract: A method of operating an electronic device is provided. The method includes selecting at least one particular location in content displayed on a display, identifying text included in the at least one particular location, and executing at least one program based on the text.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: October 4, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Chul Choi, Soo-Jin Park, Hyung-Jin Park, Na-Gyeom Yoo, Bo-Hyun Yu, Jae-Woong Chun, Hyo-Sun Choi, Soo-Ji Hwang
  • Publication number: 20220310622
    Abstract: A semiconductor device includes a stacked line structure including a bit line over a substrate, an active layer positioned at a higher level than the stacked line structure and parallel to the bit line, a capacitor positioned at a higher level than the active layer, a first plug extending downwardly to be coupled to the bit line through the active layer, a second plug formed between the active layer and the capacitor, and a word line extending in a direction that intersects with the bit line while intersecting with the active layer.
    Type: Application
    Filed: June 16, 2022
    Publication date: September 29, 2022
    Inventor: Hyung-Jin PARK
  • Patent number: 11417660
    Abstract: A semiconductor device includes a stacked line structure including a bit line over a substrate, an active layer positioned at a higher level than the stacked line structure and parallel to the bit line, a capacitor positioned at a higher level than the active layer, a first plug extending downwardly to be coupled to the bit line through the active layer, a second plug formed between the active layer and the capacitor, and a word line extending in a direction that intersects with the bit line while intersecting with the active layer.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: August 16, 2022
    Assignee: SK hynix Inc.
    Inventor: Hyung-Jin Park
  • Publication number: 20220219582
    Abstract: A device for providing a fatigue-reducing position of a vehicle seat is provided. A first latch unit is mounted on a rear seat cushion such that a first striker mounted on a front seatback is fastened thereto in a lockable manner. A second latch unit is mounted on a rear surface portion of a rear seatback. A sliding-locking unit is mounted on a package panel disposed behind a rear seat in a height adjustable manner. A second striker is provided on a front end of the sliding-locking unit to be fastened to the second latch unit in a lockable manner. A seat in a second or third row in the cabin of a vehicle is detachable from the original position to be fixedly placed like a hammock between a front seat and a package panel to provide a fatigue-reducing position in which an occupant comfortably rests.
    Type: Application
    Filed: January 7, 2022
    Publication date: July 14, 2022
    Inventors: Hyun Kyu Moon, Sang Do Park, Sang Uk YU, Deok Soo Lim, Hyo Cheol Kang, Ju Yeol Kong, Hyung Jin Park, Seon Chae Na, Chan Ho Jung, Seong Mun Yun
  • Publication number: 20220216162
    Abstract: Provided is a semiconductor device capable of improving the divisibility of a wafer by concentrating crack stress by disposing notch patterns on a scribe line of a wafer, by locally removing a metal thin film in a scribe line and propagating a dividing energy in a vertical direction of a die surface. A semiconductor device includes: die regions spaced apart from each other in a wafer, scribe line regions disposed between neighboring ones of the die regions and covered with a metal material layer, and one or more open areas disposed in each of the scribe line regions and formed by locally removing the metal material layer, wherein each of the open areas includes one or more notch patterns indicating a direction in which the scribe line region is extended.
    Type: Application
    Filed: June 28, 2021
    Publication date: July 7, 2022
    Inventors: Hyung Jin PARK, Jung Wook KIM, Hyo Jun LEE
  • Publication number: 20220145030
    Abstract: This application features a method of forming a polymer layer on the surface of a substrate using a self-initiating monomer. A polymer layer is formed by polymerization of a monomer on a metal layer to fill or cover defects of the metal layer. The metal layer the polymer layer may be used as an airtight material.
    Type: Application
    Filed: July 20, 2021
    Publication date: May 12, 2022
    Inventors: Sung-Chan Jo, Kyonghoon LEE, John S. ALTHAUS, Hyung Jin PARK
  • Patent number: D1055802
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: December 31, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Hyung-Jin Park, Do-Woo Kwon