Abstract: A display device includes a first conductive layer disposed on a substrate, a passivation layer disposed on the first conductive layer, a second conductive layer disposed on the passivation layer, a via layer disposed on the second conductive layer, a third conductive layer disposed on the via layer, the third conductive layer including a first electrode, a second electrode, a connection pattern, the first electrode, the second electrode, and the connection pattern being spaced apart from each other, and a light emitting element, a first end and a second end of the light emitting element being disposed on the first electrode and the second electrode, respectively, wherein the connection pattern electrically connects the first conductive layer and the second conductive layer through a first contact hole penetrating the via layer and the passivation layer.

Abstract: A display device includes a substrate, a first conductive layer on the substrate and including a lower light blocking pattern and a first signal line, a buffer layer on the first conductive layer, a semiconductor layer on the buffer layer and including a first semiconductor pattern and a second semiconductor pattern separated from the first semiconductor pattern, an insulating layer on the semiconductor layer and including an insulating layer pattern, a second conductive layer on the insulating layer and including a second signal line, a planarization layer on the second conductive layer, and a third conductive layer on the planarization layer and including an anode electrode. The first semiconductor pattern is electrically connected to the lower light blocking pattern by the anode electrode, and at least a portion of the second semiconductor pattern is isolated from and overlaps each of the first signal line and the second signal line.

Abstract: A method of manufacturing a display device includes discharging ink including light emitting elements onto a substrate; applying a first electric field to the substrate to fix the light emitting elements; removing foreign substances from the substrate by using a cleaning device in a state in which the first electric field is applied to the substrate; and releasing application of the first electric field after the removing of the foreign substances from the substrate by using the cleaning device.

Abstract: The present invention relates to a photoelectric conversion element material provided with a base material and a light-receiving layer including a semiconductor film formed on the base material. The semiconductor film that forms this light-receiving layer includes Ag2?xBixSx+1 (x is an integer of 0 or 1) and has a crystallite diameter of 10 nm or more and 40 nm or less. The light-receiving layer can be produced by applying an ink containing the semiconductor nanoparticles dispersed in a dispersion medium to a base material and then firing the ink at 200° C. or higher and 350° C. or lower. The photoelectric conversion element material of the present invention has an absorption property with respect to light with wavelengths in the near infrared region and excellent photoresponsivity.

Abstract: A substrate processing apparatus includes: a stage including a first region and a second region surrounding the first region, the stage configured to receive a substrate; and a plurality of pins in or on the stage and configured to adsorb the substrate with negative pressure. The plurality of pins include a plurality of first pins in the first region and are configured to be elevated at the same time, and a plurality of second pins in the second region and are configured to be elevated at the same time. In operation, the first pins are elevated and adsorb the substrate first, and then, the second pins are elevated and adsorb the substrate.

Abstract: A display device including a substrate including a first display region having a first width, a second display region having a second width smaller than the first width, a peripheral region at a periphery of the first and second display regions, and a dummy region in the peripheral region, a first pixel in the first display region, a second pixel in the second display region, a first control line connected to the first pixel and extending in the first display region, a second control line connected to the second pixel and extending in the second display region, and a dummy line connected to the second control line in the dummy region, wherein the second control line is at a first conductive layer on a first insulating layer, the dummy line is at a second conductive layer on a second insulating layer on the first conductive layer.

Abstract: The present disclosure provides a water-blocking device including a water-blocking plate installed on a floor of a passage, rails installed on both sidewalls of the floor, and a driving part configured to lift and lower the water-blocking plate, wherein, when the driving part is operated, the water-blocking plate is lifted and lowered along the rails.

Abstract: The present disclosure relates to a memory device and a manufacturing method of the memory device. The memory device according to an embodiment includes a stacked structure including gate lines separated from and stacked on top of each other, a main plug formed in a vertical direction to the stacked structure, a plug separation pattern separating the main plug into first and second sub-plugs, a gap formed in the plug separation pattern; and a separation layer surrounding the gap.

Abstract: A display device includes a power supply to supply a first initialization power source to the pixels through a first initialization and to supply a second initialization power source to the pixels through a second power line.

Abstract: A gene amplification chip may include: a cover layer having a solution inlet through which a sample solution to be injected; a chamber layer disposed on one surface of the cover layer, and having a chamber to receive the sample solution when the sample solution is injected through the solution inlet such that an amplification reaction of the sample solution occurs in the chamber; a bottom layer disposed on another surface of the chamber layer; and a photothermal film attached to an outer surface of the bottom layer, and configured to convert light into heat to heat the sample solution received in the chamber.

Abstract: A display device including a first substrate including a display area, and a non-display area, a second substrate on the first substrate, and a sealing member in a sealing area of the non-display area. The first substrate includes a first base portion, a first conductive layer including a first signal line and a lower light blocking layer, on the first base portion, a buffer layer on the first conductive layer, a semiconductor layer overlapping the lower light blocking layer, on the buffer layer, a gate insulating layer on the semiconductor layer, and a second conductive layer including second and third signal lines electrically connected to the first signal line, and a gate electrode overlapping the semiconductor layer, on the gate insulating layer. In plan view, the first signal line is between the second signal line and the third signal line. The first signal line overlaps the sealing member.

Abstract: In one example, a semiconductor device includes a substrate having leads that include lead terminals, lead steps, and lead offsets extending between the lead steps so that at least some lead steps reside on different planes. A first electronic component is coupled to a first lead step side and includes a first electronic component first side, and a first electronic component second side opposite to the first electronic component first side. A second electronic component is coupled to a second lead step side, and includes a second electronic component first side, and a second electronic component second side opposite to the second electronic component first side. An encapsulant encapsulates the first electronic component, the second electronic component, and portions of the substrate. The lead terminals are exposed from a first side of the encapsulant. Other examples and related methods are also disclosed herein.

Abstract: A display device is provided. The display device comprises a display panel including a plurality of signal pads and one or more dummy pads, and at least one flexible wiring board providing signals to the signal pads, wherein a maximum bias period of signals provided to a pair of adjacent signal pads with at least one dummy pad interposed therebetween is longer than a maximum bias period of signals provided to a pair of adjacent signal pads with no dummy pad disposed therebetween.

Abstract: A vehicle canister device includes a main canister including an inlet port through which evaporative gas is introduced from a fuel tank, an outlet port through which the evaporative gas introduced during operation of an engine is discharged to an intake side of the engine, and an internal space for filling activated carbon. The vehicle canister device also includes an auxiliary canister mounted in fluid-communication with the main canister and configured to allow external air to flow into the main canister through an atmosphere port provided on the main canister or the evaporative gas to flow therethrough upon stop of the engine. The auxiliary canister includes a plurality of activated carbon layers each filled with an activated carbon and a plurality of air layers disposed between the activated carbon layers.

Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.

Abstract: The present invention relates to a method for etching lithium niobate, the method including a process of etching lithium niobate using a mask pattern as a physical dry etching method using Ar plasma produced in a chamber through Ar gas, wherein in the process of etching lithium niobate, a process pressure of the chamber is maintained at 1 mTorr to 20 mTorr, and a method for forming a lithium niobate pattern using the same.

Abstract: An apparatus and method for bio-particle detection are provided. The apparatus for bio-particle detection includes: a bio-particle detection chip including a substrate having a plurality of through-hole groups, each through-hole group of the plurality of through-hole groups including through-holes which pass through the substrate from a first surface of the substrate toward an second surface of the substrate opposite to the first surface, and which are configured to accommodate a sample solution loaded therein; and a processor configured to determine a number of through-holes, among the through holes of at least one through-hole group of the plurality of through-hole groups, having a target material encapsulated therein, based on at least one of an electrical signal and an optical signal corresponding to the through-holes of the at least one through-hole group, and to estimate a concentration of the target material based on the determined number.

Abstract: A display device includes: a substrate; a first active layer of a first transistor and a second active layer of a second transistor on the substrate; a first gate insulating layer on the first active layer; a first gate electrode on the first gate insulating layer; a second gate insulating layer on the second active layer; and a second gate electrode on the second gate insulating layer, wherein a hydrogen concentration of the first gate insulating layer is lower than a hydrogen concentration of the second gate insulating layer.

Abstract: A display device includes a substrate, a first conductive layer on the substrate and including a lower light blocking pattern and a first signal line, a buffer layer on the first conductive layer, a semiconductor layer on the buffer layer and including a first semiconductor pattern and a second semiconductor pattern separated from the first semiconductor pattern, an insulating layer on the semiconductor layer and including an insulating layer pattern, a second conductive layer on the insulating layer and including a second signal line, a planarization layer on the second conductive layer, and a third conductive layer on the planarization layer and including an anode electrode. The first semiconductor pattern is electrically connected to the lower light blocking pattern by the anode electrode, and at least a portion of the second semiconductor pattern is isolated from and overlaps each of the first signal line and the second signal line.

Abstract: A display device includes: a substrate; a first semiconductor layer disposed on the substrate, where the first semiconductor layer includes a channel region and a doped region; a first gate electrode disposed to overlap the channel region of the first semiconductor layer; an intermediate film disposed on the first semiconductor layer and the first gate electrode; and a first electrode disposed on the intermediate film, where an opening is defined through the intermediate film to overlap the doped region of the first semiconductor layer, the doped region of the first semiconductor layer and the first electrode contacts each other through the opening, and an area of a cross-section of the opening parallel to the substrate is in a range of about 49 ?m2 to about 81 ?m2.