Patents by Inventor Hyung-Suk Kim

Hyung-Suk Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090321773
    Abstract: An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
    Type: Application
    Filed: August 27, 2009
    Publication date: December 31, 2009
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Sam PARK, Seung Ick Lee, Hun Joo Hahm, Hyung Suk Kim, Bum Jin Kim, Young June Jeong, Ho Sik Ahn, Jung Kyu Park
  • Publication number: 20090304082
    Abstract: Signatures that can be used to identify video and audio content are generated from the content by generating measures of dissimilarity between features of corresponding groups of pixels in frames of video content and by generating low-resolution time-frequency representations of audio segments. The signatures are generated by applying a hash function to intermediate values derived from the measures of dissimilarity and to the low-resolution time-frequency representations. The generated signatures may be used in a variety of applications such as restoring synchronization between video and audio content streams and identifying copies of original video and audio content. The generated signatures can provide reliable identifications despite intentional and unintentional modifications to the content.
    Type: Application
    Filed: November 29, 2007
    Publication date: December 10, 2009
    Inventors: Regunathan Radhakrishnan, Claus Bauer, Kent Bennett Terry, Brian David Link, Hyung-Suk Kim, Eric Gsell
  • Patent number: 7592631
    Abstract: An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted with the LED chip. A lead-coating assembly configured to be inserted into the receiving part of the heat conductive member, including a lead is inserted at one end into the receiving part of the heat conductive member, and electrically connected to the LED chip. An electrically insulating layer is placed in tight contact between the lead and the receiving part of the heat conductive member isolates the lead from the receiving part. With the lead inserted into the heat conductive member, it is possible to reduce size while maintaining high heat conductivity and stability.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: September 22, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Sam Park, Seung Ick Lee, Hun Joo Hahm, Hyung Suk Kim, Bum Jin Kim, Young June Jeong, Ho Sik Ahn, Jung Kyu Park
  • Patent number: 7560745
    Abstract: The LED package includes a substrate, one LED or more separated from each other by designated intervals and arranged in a line on the substrate, and a molding portion, for sealing the upper surface of the substrate including the LEDs, provided with an upper surface including two curved surfaces having circular circumferential shapes, wherein each of the curved surfaces has a curvature for totally reflecting light emitted from the LEDs. The LED package assures a sufficient optical traveling route therein without requiring a separate light guide plate, thereby emitting a white ray having uniform luminance.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: July 14, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Suk Kim, Young Sam Park, Hun Joo Hahm, Jung Kyu Park, Young June Jeong
  • Publication number: 20090168455
    Abstract: A backlight unit for a liquid crystal display (LCD) device, disposed under a liquid crystal panel to illuminate the liquid crystal panel. The backlight unit includes a light guide plate, first and second light emitting diode (LED) arrays, disposed on adjacent sides, perpendicular to each other, of the light guide plate, each array having a plurality of LED blocks, consisting of one or more LEDs, and a control unit that controls electric signals, respectively inputted to the LED blocks, to regulate luminance for the respective LED blocks, wherein light emitted from the first and second LED arrays is overlapped each other in the light guide plate.
    Type: Application
    Filed: July 8, 2008
    Publication date: July 2, 2009
    Inventors: Dae Hyun Kim, Hun Joo Hahm, Hyung Suk Kim, Dae Yeon Kim
  • Publication number: 20090135332
    Abstract: Provided is a backlight unit of an LCD device including a printed circuit board; a plurality of light emitting diodes (LEDs) mounted on the printed circuit board; and a bottom chassis formed with only an outer frame and having the printed circuit board housed thereon.
    Type: Application
    Filed: March 5, 2008
    Publication date: May 28, 2009
    Inventors: Hun Joo Hahm, Hyung Suk Kim, Dae Yeon Kim
  • Patent number: 7513632
    Abstract: A direct-illumination backlight apparatus using LEDs includes a flat reflective plate, an LED light source, a transparent plate, a scattering pattern, and a light guide. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel.
    Type: Grant
    Filed: September 24, 2007
    Date of Patent: April 7, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Suk Kim, Jung Kyu Park, Ho Sik Ahn, Young June Jeong, Young Sam Park, Hun Joo Hahm, Bum Jin Kim
  • Publication number: 20090059579
    Abstract: There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes.
    Type: Application
    Filed: April 3, 2008
    Publication date: March 5, 2009
    Inventors: Jae Hong Shin, Hun Joo Hahm, Hyung Suk Kim, Chang Ho Shin, Dae Yeon Kim, Chul Hee Yoo, Dong Hyun Cho
  • Publication number: 20090059123
    Abstract: There are provided a plane light source and an LCD backlight unit having the same.
    Type: Application
    Filed: August 27, 2008
    Publication date: March 5, 2009
    Inventors: Seong Yeon HAN, Hun Joo HAHM, Hyung Suk KIM, Young June JEONG, Young Sam PARK, Chul Hee YOO
  • Patent number: 7473937
    Abstract: A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: January 6, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Sam Park, Hyung Suk Kim, Jung Kyu Park, Ho Sik Ahn, Young June Jeong, Hun Joo Hahm, Bum Jin Kim
  • Publication number: 20080315780
    Abstract: There is provided an integrated LED driving device including: a DC/DC converting part converting and outputting a DC voltage inputted from the outside by switching of a switch into a driving voltage of a magnitude suitable for driving a plurality of LED arrays; a constant current controlling part receiving at least one of information on the current flowing through the LED array and information on a voltage applied to the LED array by feed-back, the constant current controlling part including a PWM controller PWM-controlling a switching duty of the switch of the DC/DC converting part, and controlling a switching duty of each of the switches of the switching part to allow the current to flow through the LED array with a predetermined magnitude; and a control logic receiving a control signal by a user and controlling the PWM controller in response to the control signal.
    Type: Application
    Filed: June 19, 2008
    Publication date: December 25, 2008
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Yun LEE, Chang Hoon BAEK, Do Hun KIM, Hyung Suk KIM
  • Patent number: 7462036
    Abstract: There are provided a printed circuit board connector for a backlight unit and a chassis using the same. The printed circuit board connector for a backlight unit including: a horizontal supporter; a vertical supporter having one end connected to the horizontal supporter to divide the horizontal supporter into first and second areas; at least one connecting terminal formed on the horizontal supporter to be partially exposed in each of the first and second areas of the horizontal supporter, wherein the connecting terminal electrically connects printed circuit boards having one ends placed on the first and second areas, respectively.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: December 9, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Ho Shin, Hun Joo Hahm, Jung Kyu Park, Won Joon Lee, Hyung Suk Kim
  • Publication number: 20080265269
    Abstract: A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 30, 2008
    Inventors: Chul Hee Yoo, Young June Jeong, Young Sam Park, Seong Yeon Han, Ho Yeon Kim, Hun Joo Hahm, Hyung Suk Kim
  • Publication number: 20080197366
    Abstract: A white LED module includes a circuit board, a blue LED chip disposed on the circuit board, a green light source of an LED chip or phosphor disposed on the circuit board, and a red light source of an LED chip or phosphor disposed on the circuit board. At least one of the green and red light sources is a phosphor, which is excited by the blue LED chip to radiate. The blue LED chip emits light in a triangular region defined by color coordinates (0.0123, 0.5346), (0.0676, 0.4633) and (0.17319, 0.0048), the green light source emits light in a triangular region defined by color coordinates (0.025, 0.5203), (0.4479, 0.541) and (0.0722, 0.7894), and the red light source emits light in a triangular region defined by color coordinates (0.556, 0.4408), (0.6253, 0.3741) and (0.7346, 0.2654).
    Type: Application
    Filed: April 17, 2008
    Publication date: August 21, 2008
    Inventors: Chul-Hee Yoo, II Ku Kim, Seong Yeon Han, Hyung Suk Kim, Hun Joo Hahm
  • Patent number: 7414270
    Abstract: The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: August 19, 2008
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Bum Jin Kim, Hyung Suk Kim, Ho Sik Ahn, Young June Jeong, Sung Min Yang
  • Publication number: 20080171451
    Abstract: There are provided a printed circuit board connector for a backlight unit and a chassis using the same. The printed circuit board connector for a backlight unit including: a horizontal supporter; a vertical supporter having one end connected to the horizontal supporter to divide the horizontal supporter into first and second areas; at least one connecting terminal formed on the horizontal supporter to be partially exposed in each of the first and second areas of the horizontal supporter, wherein the connecting terminal electrically connects printed circuit boards having one ends placed on the first and second areas, respectively.
    Type: Application
    Filed: January 15, 2008
    Publication date: July 17, 2008
    Inventors: Chang-Ho Shin, Hun Joo Hahm, Jung Kyu Park, Won Joon Lee, Hyung Suk Kim
  • Patent number: D595245
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: June 30, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Hyun Kim, Hun Joo Hahm, Hyung Suk Kim, Dae Yeon Kim, Young Sam Park, Do Hun Kim, Seong Yeon Han
  • Patent number: D595246
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: June 30, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Hyun Kim, Hun Joo Hahm, Hyung Suk Kim, Dae Yeon Kim, Young Sam Park, Do Hun Kim, Seong Yeon Han
  • Patent number: D595247
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: June 30, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Hyun Kim, Hun Joo Hahm, Hyung Suk Kim, Dae Yeon Kim, Young Sam Park, Do Hun Kim, Seong Yeon Han
  • Patent number: D599750
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: September 8, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Hyun Kim, Hun Joo Hahm, Hyung Suk Kim, Dae Yeon Kim, Young Sam Park, Do Hun Kim, Seong Yeon Han