Patents by Inventor Hyung-Jin Lee

Hyung-Jin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240363548
    Abstract: A wafer includes chip areas and a first scribe lane disposed between the chip areas, and a first trench pattern disposed in the first scribe lane. The first scribe lane extends in a first direction. The first trench pattern includes a plurality of first trench groups spaced apart from each other in the first direction.
    Type: Application
    Filed: September 6, 2023
    Publication date: October 31, 2024
    Inventors: Geon Hee KIM, Hyung Jin PARK, Seung Won LEE
  • Patent number: 12127658
    Abstract: A container is provided according to an embodiment of the present disclosure. The container may include a container part in which an accommodation space configured to accommodate contents is formed, a middle body configured to communicate with the accommodation space and coupled to the container part to surround at least a portion of the container part, an inner cover rotatably connected to the middle body to open or close the accommodation space, and an outer cover rotatably connected to the middle body to open or close the middle body.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: October 29, 2024
    Assignee: KOLMAR KOREA CO., LTD.
    Inventors: Hyung Sang Kim, Chang Soo Lee, Koo Sup Ahn, Jong Hyun Park, Hye Jin Jung, Hee Yoon Kim, Eun Ji Jeong
  • Publication number: 20240354715
    Abstract: A predictive maintenance algorithm providing method for bus maintenance priority determination according to the present invention includes operations of (a) grouping and classifying, by a data processing unit of an operational server, a plurality of buses to be monitored according to preset classification criteria, (b) receiving, by a monitoring unit of the operational server, bus monitoring information including a plurality of types of data collected by vehicle information collection devices installed on the buses for each group classified according to the operation (a), (c) performing, by the data processing unit, refinement on the bus monitoring information, (d) inputting, by the data processing unit, the bus monitoring information refined in the operation (c) as training data for an artificial intelligence machine to build an artificial intelligence model for determining bus maintenance priorities, (e) re-receiving, by the monitoring unit, the bus monitoring information collected by the vehicle informatio
    Type: Application
    Filed: April 19, 2024
    Publication date: October 24, 2024
    Inventors: Hyung Jin SON, Sang Woo SON, Yoon Hyun KIM, Tae Hwan LEE, Hyuck Joon BYUN, Jae Hwan JEONG, Ji Yang PARK
  • Publication number: 20240355499
    Abstract: Spiral graphene nanocrystals having electrical conductivity in a vertical direction due to interlayer covalent bonds, a graphene thin film including the spiral graphene nanocrystals, an interconnect structure manufactured from the spiral graphene nanocrystals or the graphene thin film, and a method of manufacturing the interconnect structure and an electronic device including the interconnect structure.
    Type: Application
    Filed: April 22, 2024
    Publication date: October 24, 2024
    Inventors: CHANG SEOK LEE, Yohan KIM, Hyung-Joon SHIN, KYUNGEUN BYUN, KEUN WOOK SHIN, HYEON JIN SHIN, Seungwoo SON, Zonghoon LEE
  • Patent number: 12125685
    Abstract: A plasma processing apparatus may include a lower electrode supporting a wafer; a focus ring surrounding an edge of the lower electrode and having a ring shape; and an edge ring disposed in a position lower than a position of the focus ring. The focus ring may include a lower region and an upper region disposed on the lower region, and the upper region increases in electrical conductivity as the upper region is closer to the lower region.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: October 22, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun Soo Lee, Yoshihisa Hirano, Jae Hoon Kim, Young Jin Noh, Sung Moon Park, Seung Kyu Lim, Kyeong Seok Jeong, Hyung Kyu Choi
  • Patent number: 12125775
    Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: October 22, 2024
    Assignees: NEPES CO., LTD., NEPES LAWEH CORPORATION
    Inventors: Byung Cheol Kim, Yong Tae Kwon, Hyo Gi Jo, Dong Hoon Oh, Jae Cheon Lee, Hyung Jin Shin, Mary Maye Melgo Galimba
  • Publication number: 20240347434
    Abstract: A package for semiconductor is disclosed. The semiconductor package according to an aspect of the present invention may include a semiconductor chip; a first insulating layer for embedding the semiconductor chip and protecting the semiconductor chip; a redistribution layer disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and for embedding the redistribution layer and protecting the redistribution layer; and a conductive pad disposed on the second insulating layer.
    Type: Application
    Filed: March 8, 2024
    Publication date: October 17, 2024
    Inventors: Jong Heon KIM, Young Ho KIM, Yun Mook PARK, Young Mo LEE, Hyung Jin SHIN, Kyu Shik KIM, Bo Mi LEE
  • Publication number: 20240348923
    Abstract: A coil member according to an embodiment comprises: a substrate including an upper surface and a lower surface opposite to the upper surface; a first coil electrode disposed on the upper surface of the substrate and including first pattern electrodes; a second coil electrode disposed on the lower surface of the substrate and including second pattern electrodes; and third pattern electrodes disposed on the upper surface and the lower surface of the substrate, wherein a distance between the first pattern electrodes is different from a distance between the first pattern electrodes and the third pattern electrodes, and a distance between the second pattern electrodes is different from a distance between the second pattern electrodes and the third pattern electrodes.
    Type: Application
    Filed: June 26, 2024
    Publication date: October 17, 2024
    Inventors: Seung Jin LEE, Hyung Kyu Yoon, Hye Yeong Jung
  • Patent number: 12115886
    Abstract: A pre-active safety seat system applied to the vehicle implements a method for improving a pre-active safety seat speed, which confirms a risk region by matching a recline angle, a slide movement position, and a cushion tilt angle, which are detected from each of a plurality of sensors of a multi-seat sensor in a risk collision situation detected by a vehicle environment sensor of an ADAS, with a seat safety map, and combines and simultaneously controls a plurality of motors of a multi-seat motor configured for a seat target posture of a seat for converting the risk region into a safety region, by a controller, shortening a pre-active safety seat (PSS) required time of a seat target posture in the pre-active safety seat (PSS) operable section before collision of the vehicle from a risk detection.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: October 15, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Hyung-Joo Kim, Haeng-Kyeom Kim, Guk-Mu Park, Tae-Hoon Lee, Seung-Young Lee, Wook Jin, Eung-Man Kim, Dong-Woo Jeong, Ju-Yeol Kong
  • Publication number: 20240327684
    Abstract: An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at ?20° C. of about 50 ?m to about 100 ?m and a gel fraction of about 50% to about 75%.
    Type: Application
    Filed: June 3, 2024
    Publication date: October 3, 2024
    Inventors: Ik Hwan Cho, Ji Ho Kim, Jee Hee Kim, Ji Won Kang, Byeong Do Kwak, Yong Tae Kim, Il Jin Kim, Sung Hyun Mun, Hyung Rang Moon, Seon Hee Shin, Gwang Hwan Lee, Woo Jin Lee, Jae Hyun Han
  • Publication number: 20240304938
    Abstract: A pouch cell includes: an electrode lead electrically connected to an electrode assembly accommodated in a pouch to protrude outwardly from the pouch; a lead film that covers a portion of the electrode lead to insulate the electrode lead from the pouch, and includes a passage that forms a gas flow path when a pressure inside the pouch increases to a set pressure or higher; and a pressing member that is disposed outside the pouch, and presses the passage to close the gas flow path of the passage.
    Type: Application
    Filed: February 15, 2024
    Publication date: September 12, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Sang Hun Kim, Eun Suk Park, Yu Jin Lee, Hyung Kyun Yu
  • Patent number: 12084538
    Abstract: A method for producing a polymer containing metal atoms or halogen atoms at the terminals thereof with excellent efficiency while minimizing or eliminating side reactions or the like is provided. The method can also freely control molecular weight characteristics of the polymer.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: September 10, 2024
    Assignee: LG Chem, Ltd.
    Inventors: Yoon Hyung Hur, Je Gwon Lee, Sung Soo Yoon, No Jin Park, Eun Young Choi, Se Jin Ku, Mi Sook Lee, Hyung Ju Ryu, Na Na Kang, Eung Chang Lee
  • Publication number: 20240286559
    Abstract: An embodiment mounting and demounting device for a wireless electronic device includes a pair of holder wings arranged symmetrically to each other and configured to press both sides of the wireless electronic device, a holder wing adjusting device configured to apply a force to adjust a gap between the holder wings using a driving force of a drive motor, a lifting implementing device configured to interlock with the holder wing adjusting device to lift the wireless electronic device upward in a case in which the holder wings are spread apart by a predetermined reference gap or more, a lower housing wrapped around a lower side of the holder wings, the holder wing adjusting device, and the lifting implementing device, and an upper housing coupled to an upper side of the lower housing and configured to allow the wireless electronic device to pass through in an up and down direction.
    Type: Application
    Filed: November 13, 2023
    Publication date: August 29, 2024
    Inventors: Guk Mu Park, Dong Woo Jeong, Dong Ho Kang, Jung Sang You, Hyung Joo Kim, Hyeong Jong Kim, Seung Min Jeong, Seung Young Lee, Byung Jin Son, Han Su Yoo, Hyo Seop Cha, Young Gyu Song, Yun Chang Kim, Jae Sik Choi, Dae Hee Lee, Byung Yong Choi, Seon Chae Na, Sang Do Park, Eun Sue Kim, Yong Seong Jang, Eom Seok Yoo, Seung Young Lee, Jin Wook Choi
  • Patent number: 12074371
    Abstract: A millimeter-wave reflective structure configured to reflect incident millimeter waves includes: a transparent substrate defining unit cells in the form of a matrix, the transparent substrate having an upper surface; and conductive patterns arranged in the unit cells on the transparent substrate, each of the conductive patterns having a hollow rectangular shape.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: August 27, 2024
    Assignees: CORNING INCORPORATED, POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Won-bin Hong, Byounggwan Kang, Hyung Rae Kim, Kyung-jin Lee, Young-no Youn
  • Publication number: 20240281923
    Abstract: An optical inspection device includes: an optical inspection main body on which a target substrate is mounted; high-resolution cameras spaced from the target substrate and disposed in the optical inspection main body, where the high-resolution cameras photograph high-resolution images; and an image converter which converts the high-resolution images into a low-resolution image, where the image converter includes a gray uniformizer which adjusts grays of the high-resolution images to allow a gray deviation among the high-resolution images to be equal to or less than a deviation reference value.
    Type: Application
    Filed: November 17, 2023
    Publication date: August 22, 2024
    Inventor: Hyung Jin LEE
  • Publication number: 20240276871
    Abstract: A novel compound for a light emitting device, and an organic light emitting device containing the same are disclosed.
    Type: Application
    Filed: March 13, 2024
    Publication date: August 15, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Byung Cheol MIN, Dong Jun KIM, Jeong Woo HAN, Hyung Jin LEE, Ja Eun ANN, Dong Yuel KWON, Dae Woong LEE, Hyeon Jeong IM, Yeong Rong PARK, Il Soo OH, Bo Ra LEE, Ill Hun CHO
  • Patent number: 12062833
    Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: August 13, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
  • Publication number: 20240261283
    Abstract: The present disclosure relates to medical use of a compound of chemical formula 1 for treatment or prevention of pulmonary fibrosis. The present disclosure also relates to combination therapy with the compound of chemical formula 1 and nintedanib.
    Type: Application
    Filed: May 31, 2022
    Publication date: August 8, 2024
    Inventors: Hyung-Chul RYU, Jae-Sun KIM, Jee-Woong LIM, Soon-Jin KWON, Seung-Yong LEE
  • Publication number: 20240254112
    Abstract: A novel compound for a capping layer, and an organic light emitting device containing the same are disclosed.
    Type: Application
    Filed: March 25, 2024
    Publication date: August 1, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Byung Cheol MIN, Dong Jun KIM, Jeong Woo HAN, Hyung Jin LEE, Ja Eun ANN, Dong Yuel KWON
  • Patent number: 12052499
    Abstract: A coil member according to an embodiment comprises: a substrate including an upper surface and a lower surface opposite to the upper surface; a first coil electrode disposed on the upper surface of the substrate and including first pattern electrodes; a second coil electrode disposed on the lower surface of the substrate and including second pattern electrodes; and third pattern electrodes disposed on the upper surface and the lower surface of the substrate, wherein a distance between the first pattern electrodes is different from a distance between the first pattern electrodes and the third pattern electrodes, and a distance between the second pattern electrodes is different from a distance between the second pattern electrodes and the third pattern electrodes.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: July 30, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Seung Jin Lee, Hyung Kyu Yoon, Hye Yeong Jung