Abstract: A method of fabricating a capacitor includes forming a lower electrode on a semiconductor substrate in a reaction space. A homogeneous oxide layer is formed on the lower electrode. A dielectric layer is formed on the homogeneous oxide layer. An upper electrode is formed on the dielectric layer. The forming of the homogeneous oxide layer includes performing a homogeneous oxide layer forming cycle at least one time. The homogeneous oxide layer forming cycle includes supplying an oxidizing agent, purging the oxidizing agent, and pumping-out the reaction space.

Abstract: A method includes inputting defect data of a source domain, to which a first mask is applied/unapplied to a reconstruction algorithm. The algorithm is trained to generate defect data of the source domain, to which the first mask is reconstructed. Normal data of the source domain is input to the algorithm, and includes data to which a second mask is applied, and data to which the second mask is not applied. The algorithm is trained to generate normal data of the source domain, to which the second mask is reconstructed. Normal data of a target domain is input to the algorithm, and the normal data of the target domain includes data to which the second mask is applied, and data to which the second mask is not applied. The algorithm is trained to generate normal data of the target domain, to which the second mask is reconstructed.

Abstract: Provided is an electronic device including at least one communication module comprising communication circuitry; and a processor, wherein the processor is configured to: establish a first communication connection with a first external device using the at least one communication module, receive a first signal from the first external device through the first communication connection, perform a first function of a first application corresponding to the first signal upon receiving the first signal from the first external device through the first communication connection, based on identifying that a second communication connection with a second external device using the at least one communication module is not established, and perform a second function of a second application related to the second external device corresponding to the first signal upon receiving the first signal from the first external device through the first communication connection, based on identifying that the second communication connection w

Abstract: A method for preparing a nanosheet dispersion solution includes a step of adding a two-dimensional material having a layered structure to a solvent containing at least two materials to weaken an interlayer bonding force, and a step in which a nanosheet, which is exfoliated as the material is attached to a surface thereof by a covalent bond during the exfoliation process, has a repulsive force so as not to agglomerate. The nanosheet dispersion solution prepared by the preparing method of the inventive concept may be obtained by increasing the surface area of the two-dimensional sheet from the two-dimensional material, may solve the problem of the yield, may reduce a barrier in the charge transfer by reducing the interlayer distance, and may maintain the dispersed phase of the ink prepared by the repulsive force of the nanosheet.

Abstract: A method and apparatus for performing post-exposure bake operations is described herein. The apparatus includes a plate stack and enables formation of a first high ion density plasma before the ion concentration within the first high ion density plasma is reduced using a diffuser to form a second low ion density plasma. The second low ion density plasma is an electron cloud or a dark plasma. An electric field is formed between a substrate support and the diffuser and through the second low ion density plasma during post-exposure bake of a substrate disposed on the substrate support. The second low ion density plasma electrically couples the substrate support and the diffuser during application of the electric field. The plate stack is equipped with power supplies and insulators to enable the formation or modification of a plasma within three regions of a process chamber.

Abstract: One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.

Abstract: An augmented reality device may comprise a display, at least one sensor, a communication circuit, and at least one processor operatively connected with the display, the at least one sensor, and the communication circuit.

Abstract: A capacitor structure may include a lower electrode on a substrate, a dielectric layer on the substrate, and an upper electrode on the dielectric layer. The lower electrode may include a metal nitride having a chemical formula of M1Ny (M1 is a first metal, and y is a positive real number). The dielectric layer may include a metal oxide and nitrogen (N), the metal oxide having a chemical formula of M2Ox (M2 is a second metal, and x is a positive real number). A maximum value of a detection amount of nitrogen (N) in the dielectric layer may be greater than a maximum value of a detection amount of nitrogen (N) in the lower electrode.

Abstract: An electronic device may include a display, a communication circuit, at least one camera, a memory, and a processor operatively connected to the display, the communication circuit, the at least one camera, and the memory. The memory may store instructions that, when executed, cause the processor to provide an augmented reality (AR) environment or a virtual reality (VR) environment through the display, connect the electronic device and at least one external electronic device through the communication circuit, display the at least one external electronic device through the display, specify a first external electronic device among the displayed at least one external electronic device based on an input interface switching event, and control an operation of the electronic device in the augmented reality environment or the virtual reality environment using the specified first external electronic device.

Abstract: A capacitor structure may include a lower electrode on a substrate, a dielectric layer on the substrate, and an upper electrode on the dielectric layer. The lower electrode may include a metal nitride having a chemical formula of M1Ny (M1 is a first metal, and y is a positive real number). The dielectric layer may include a metal oxide and nitrogen (N), the metal oxide having a chemical formula of M2Ox (M2 is a second metal, and x is a positive real number). A maximum value of a detection amount of nitrogen (N) in the dielectric layer may be greater than a maximum value of a detection amount of nitrogen (N) in the lower electrode.

Abstract: One embodiment can provide a method and system for compensating for timing skew in a differential pair transmission line on a printed circuit board (PCB). During operation, the system obtains a PCB comprising one or more layers and at least a differential pair transmission line. The differential pair transmission line comprises first and second transmission lines, with a respective transmission line coupled to at least one via extending through the one or more layers of the PCB. The system determines a difference in length between first and second transmission lines and determines a stub length of the at least one via based on the determined difference in length between the first and second transmission lines, thereby compensating for the time skew in the differential pair transmission line.

Abstract: A deposition system, includes: a reaction chamber; a first gas supply unit supplying a first precursor in a liquid state stored in a first main tank to the reaction chamber in a gaseous state; a reactant supply unit supplying a reactant to the reaction chamber; and an exhaust unit discharging an exhaust material, wherein the first gas supply unit includes a first sub tank, a first liquid mass flow controller, and a first vaporizer, the first precursor is supplied to the reaction chamber by passing through the first sub tank, the first liquid mass flow controller, and the first vaporizer, a first automatic refill system operates to periodically fill the first sub tank with the liquid first precursor stored in the first main tank, and the exhaust unit comprises a processing chamber, a pump, and a scrubber to which a plasma pretreatment system is applied.

Abstract: One embodiment can provide a method and system for compensating for timing skew in a differential pair transmission line on a printed circuit board (PCB). During operation, the system obtains a PCB comprising one or more layers and at least a differential pair transmission line. The differential pair transmission line comprises first and second transmission lines, with a respective transmission line coupled to at least one via extending through the one or more layers of the PCB. The system determines a difference in length between first and second transmission lines and determines a stub length of the at least one via based on the determined difference in length between the first and second transmission lines, thereby compensating for the time skew in the differential pair transmission line.

Abstract: Provided is a method of manufacturing a mask includes preparing a first conductive layer. The first conductive layer includes a third portion having a mesh shape in a plurality of cell regions on a substrate, a second portion disposed between the cell regions, and a first portion surrounding the third portion and the second portion. The method further includes preparing a second conductive layer including at least one opening on the first conductive layer. The method also includes oxidizing a part of the first conductive layer exposed through the at least one opening of the second conductive layer. The method further includes preparing a plating layer on the first conductive layer and the second conductive layer, and removing the first conductive layer and the second conductive layer from the plating layer.

Abstract: A stylus pen and a controlling method thereof are provided. A stylus pen housed in and withdrawn from a terminal device includes a user inputter configured to receive a contact command of a user, a microphone configured to receive a voice command of a user, a communicator configured to transmit the received voice command to the terminal device, and a processor configured to control the user inputter, the microphone, and the communicator, and the processor may, based on the stylus pen being withdrawn from the terminal device, and a first contact command being received through the user inputter, activate the microphone which is in a deactivated state to convert the stylus pen to a main voice input device.

Abstract: A capacitor structure may include a lower electrode on a substrate, a dielectric layer on the substrate, and an upper electrode on the dielectric layer. The lower electrode may include a metal nitride having a chemical formula of M1Ny (M1 is a first metal, and y is a positive real number). The dielectric layer may include a metal oxide and nitrogen (N), the metal oxide having a chemical formula of M2Ox (M2 is a second metal, and x is a positive real number). A maximum value of a detection amount of nitrogen (N) in the dielectric layer may be greater than a maximum value of a detection amount of nitrogen (N) in the lower electrode.

Abstract: Systems and methods are provided for reducing crosstalk between differential signals in a printed circuit board (PCB) using fine pitch vias. A pair of contact pads are on the top surface of the PCB and configured to couple a PCB component to the PCB, the contacts a first distance from each other. A first via of a plurality of vias is electrically coupled to a first contact of the pair of contacts and a second via is electrically coupled to a second contact, the first via and second via a second distance from each other, the second distance being less than current standards for minimum via pitch. Each via comprises a via pad on the top surface and a plated through-hole extending from the top surface to a termination point. A separator gap is between the first via and the second via.

Abstract: An exemplary embodiment of the present disclosure for implementing the foregoing object discloses a method of generating defect data of a target domain by using defect data of a source domain.

Abstract: Systems and methods are provided for reducing crosstalk between differential signals in a printed circuit board (PCB) using fine pitch vias. A pair of contact pads are on the top surface of the PCB and configured to couple a PCB component to the PCB, the contacts a first distance from each other. A first via of a plurality of vias is electrically coupled to a first contact of the pair of contacts and a second via is electrically coupled to a second contact, the first via and second via a second distance from each other, the second distance being less than current standards for minimum via pitch. Each via comprises a via pad on the top surface and a plated through-hole extending from the top surface to a termination point. A separator gap is between the first via and the second via.

Abstract: One embodiment provides a printed circuit board (PCB). The PCB can include one or more metal layers and at least a pair of differential transmission lines. The pair of differential transmission lines can include a first transmission line and a second transmission line. The first transmission line can include a plurality of timing-skew-compensation structures, and a respective timing-skew-compensation structure of the first transmission line or a corresponding segment of the second transmission line adjacent to the timing-skew-compensation structure has a non-uniform width.