Patents by Inventor I-Ming Lin
I-Ming Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12682934Abstract: An electronic device includes a heat-dissipation bottom plate, a metal carrier disposed on the heat-dissipation bottom plate, a plurality of first thermally conductive pads assembled to the metal carrier, and a second thermally conductive pad that is assembled to the metal carrier. The metal carrier has an accommodating space configured to allow a hard disk drive (HDD) to be assembled therein. A memory module and at least one interface card are connected to the metal carrier through the first thermally conductive pads. The metal carrier or the HDD is connected to the heat-dissipation bottom plate through the second thermally conductive pad. The HDD, the memory module, and the at least one interface card are in cooperation with the first thermally conductive pads, the metal carrier, the second thermally conductive pad, and the heat-dissipation bottom plate for heat-dissipation.Type: GrantFiled: December 5, 2024Date of Patent: July 14, 2026Assignee: ASRock Industrial Computer CorporationInventors: I-Ming Lin, Yi-Shu Hsieh, Chia-Hon Ju, Ming-Jie Lee
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Publication number: 20260085896Abstract: A heat dissipation device is adapted to dissipate a heat source. The heat dissipation device includes a casing, a heat conducting base, a heat conducting block, multiple heat dissipation pipes, at least one first heat dissipation fins assembly, and a heat dissipation medium. The heat conducting base is disposed inside the casing and thermally coupled to the heat source, and has a cavity and a side portion surrounding the cavity. The heat conducting block is disposed inside the cavity and is thermally coupled to the heat conducting base. Each heat dissipation pipe is inserted into the side portion. The at least one first heat dissipation fins assembly partially covers the cavity. The heat dissipation pipes are thermally coupled to the at least one first heat dissipation fins assembly. The heat dissipation medium is stored inside the cavity and immerses at least a portion of the heat conducting block.Type: ApplicationFiled: August 26, 2025Publication date: March 26, 2026Applicant: ASRock Industrial Computer CorporationInventor: I-Ming Lin
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Publication number: 20260078962Abstract: A thermal device including a bottom plate, a heat sink, and an evaporation chamber is provided. The bottom plate has multiple first grooves. The heat sink has multiple second grooves. The heat sink is assembled on the bottom plate, so that the first grooves and the second grooves co-construct multiple fluid channels. The evaporation chamber is configured on the bottom plate. The evaporation chamber includes a chamber and multiple columns. The chamber has multiple fluid inlets and multiple fluid outlets located on different sides. The fluid channels are communicated with the fluid inlets and the fluid outlets. The columns are disposed in the chamber.Type: ApplicationFiled: June 20, 2025Publication date: March 19, 2026Applicant: ASRock Industrial Computer CorporationInventor: I-Ming Lin
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Publication number: 20250246209Abstract: An electronic device includes a heat-dissipation bottom plate, a metal carrier disposed on the heat-dissipation bottom plate, a plurality of first thermally conductive pads assembled to the metal carrier, and a second thermally conductive pad that is assembled to the metal carrier. The metal carrier has an accommodating space configured to allow a hard disk drive (HDD) to be assembled therein. A memory module and at least one interface card are connected to the metal carrier through the first thermally conductive pads. The metal carrier or the HDD is connected to the heat-dissipation bottom plate through the second thermally conductive pad. The HDD, the memory module, and the at least one interface card are in cooperation with the first thermally conductive pads, the metal carrier, the second thermally conductive pad, and the heat-dissipation bottom plate for heat-dissipation.Type: ApplicationFiled: December 5, 2024Publication date: July 31, 2025Inventors: I-MING LIN, YI-SHU HSIEH, CHIA-HON JU, MING-JIE LEE
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Patent number: 11016555Abstract: An apparatus and a method for controlling power consumption associated with a computing device having first and second processors configured to perform different types of operations includes providing a user interface that allows, during normal operation of the computing device, at least one of: (i) a user selection of desired performance levels of the first and second processors relative to one another, such that higher desired performance levels of one processor correspond to lower desired performance levels of the other processor, and (ii) a user selection of a desired performance level of the first processor and a user selection of a desired performance level of the second processor, the two user selections being made independently of one another. The apparatus and method control, during normal operation of the computing device, performance levels of the processors in response to the one or more user selections of the desired performance levels.Type: GrantFiled: August 1, 2018Date of Patent: May 25, 2021Assignee: Advanced Micro Devices, Inc.Inventor: I-Ming Lin
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Publication number: 20180341317Abstract: An apparatus and a method for controlling power consumption associated with a computing device having first and second processors configured to perform different types of operations includes providing a user interface that allows, during normal operation of the computing device, at least one of: (i) a user selection of desired performance levels of the first and second processors relative to one another, such that higher desired performance levels of one processor correspond to lower desired performance levels of the other processor, and (ii) a user selection of a desired performance level of the first processor and a user selection of a desired performance level of the second processor, the two user selections being made independently of one another. The apparatus and method control, during normal operation of the computing device, performance levels of the processors in response to the one or more user selections of the desired performance levels.Type: ApplicationFiled: August 1, 2018Publication date: November 29, 2018Inventor: I-Ming Lin
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Patent number: 10067555Abstract: An apparatus and a method for controlling power consumption associated with a computing device having first and second processors configured to perform different types of operations includes providing a user interface that allows, during normal operation of the computing device, at least one of: (i) a user selection of desired performance levels of the first and second processors relative to one another, such that higher desired performance levels of one processor correspond to lower desired performance levels of the other processor, and (ii) a user selection of a desired performance level of the first processor and a user selection of a desired performance level of the second processor, the two user selections being made independently of one another. The apparatus and method control, during normal operation of the computing device, performance levels of the processors in response to the one or more user selections of the desired performance levels.Type: GrantFiled: February 20, 2014Date of Patent: September 4, 2018Assignee: Advanced Micro Devices, Inc.Inventor: I-Ming Lin
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Publication number: 20150234450Abstract: An apparatus and a method for controlling power consumption associated with a computing device having first and second processors configured to perform different types of operations includes providing a user interface that allows, during normal operation of the computing device, at least one of: (i) a user selection of desired performance levels of the first and second processors relative to one another, such that higher desired performance levels of one processor correspond to lower desired performance levels of the other processor, and (ii) a user selection of a desired performance level of the first processor and a user selection of a desired performance level of the second processor, the two user selections being made independently of one another. The apparatus and method control, during normal operation of the computing device, performance levels of the processors in response to the one or more user selections of the desired performance levels.Type: ApplicationFiled: February 20, 2014Publication date: August 20, 2015Applicant: Advanced Micro Devices, Inc.Inventor: I-Ming Lin
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Publication number: 20150078609Abstract: A vent structure for electro-acoustic product includes a plastic member shaped like a tube and defining an opening, and a ventilation layer bonded to the plastic member using an insert molding technique and fully covered over the opening. Thus, the ventilation layer of the vent structure is more moisture-heat resistant in the environment and will not drop from the plastic member easily.Type: ApplicationFiled: September 16, 2013Publication date: March 19, 2015Applicant: MERRY ELECTRONICS (SUZHOU) CO., LTD.Inventors: YING-HO TSENG, YUNG-HO CHANG, CAI-LI CHEN, I-MING LIN
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Publication number: 20140181539Abstract: A system and method for adaptive power consumption in a computing device having a chassis forming an enclosure for a chamber. The computing device further includes, in the chamber, a heterogeneous processing unit that includes a CPU operatively coupled with a GPU and that generates thermal and performance information for the CPU and GPU, a memory, and a memory controller that connects the memory to the heterogeneous processing unit. A passive cooling subsystem and an active cooling subsystem cools off the chamber. A plurality of thermal sensors are positioned to monitor temperatures within the chamber. A thermal detection and control unit receives thermal and performance information from the heterogeneous processing unit and the plurality of thermal sensors and responsively adjusts overall power consumption of the heterogeneous processing unit, the memory controller, the memory and the active cooling subsystem to maintain performance of the heterogeneous processing unit while minimizing thermal heating.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Applicant: ADVANCED MICRO DEVICES, INC.Inventor: I-Ming Lin
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Patent number: 8286436Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.Type: GrantFiled: February 11, 2011Date of Patent: October 16, 2012Inventors: I-Ming Lin, Fu-Hsing Hsieh
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Publication number: 20120257780Abstract: An earphone structure with no-section-difference design is provided, including an earphone casing, a transmission wire and a strain relief thereof. The earphone casing has a joining end to join with a joining section of the transmission wire The strain relief is formed at where the earphone casing and the transmission wire are joined. Along from the earphone casing to the transmission wire, diameter of the strain relief decreases progressively to a same diameter with that of the transmission wire, thereby providing a no-section-difference exterior look thereof between the strain relief and the transmission wire.Type: ApplicationFiled: April 8, 2011Publication date: October 11, 2012Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.Inventors: Chung-Yi Huang, I-Ming Lin, Yu-Lan Liang, Chiu-Yun Tung
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Patent number: 8213668Abstract: An in-ear earphone includes a shell and a sound output device. The shell has a first engaging portion. The sound output device has a sound tunnel, a second engaging portion and a speaker. The speaker is disposed between the sound tunnel and the second engaging portion coaxially with the sound tunnel. The second engaging portion is movably engaged with the first engaging portion. The angle between the shell and the sound output device is adjustable so that the sound tunnel can be suitably plugged into individual user's ear canals.Type: GrantFiled: November 4, 2008Date of Patent: July 3, 2012Assignee: Merry Electronics Co., Ltd.Inventors: Ching-Jung Tsao, I-Ming Lin
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Patent number: 8073178Abstract: A microphone includes a casing having an open side and a lid mounted to and covering the open side of the casing. A circuit board and a mounting plate are mounted in the casing. An audio conversion unit and a switch are mounted on the circuit board and electrically connected with each other such that activation of the switch controls on/off of the audio conversion unit. The lid includes a pivotal portion pivotably engaged with an end of the mounting plate distant to the switch, allowing the other end of the lid to pivot relative to the mounting plate between an activating position for pressing against and activating the switch and a non-activating position disengaged from the switch. A returning member is mounted between the lid and the casing for returning the other end of the lid to the non-activating position.Type: GrantFiled: March 29, 2007Date of Patent: December 6, 2011Assignee: Merry Electronics Co., Ltd.Inventors: Ching-Jung Tsao, I-Ming Lin
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Publication number: 20110132001Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.Type: ApplicationFiled: February 11, 2011Publication date: June 9, 2011Inventors: I-Ming Lin, Fu-Hsing Hsich
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Patent number: 7918092Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.Type: GrantFiled: March 19, 2007Date of Patent: April 5, 2011Inventors: I-Ming Lin, Fu-Hsing Hsieh
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Patent number: 7894622Abstract: A microphone includes a case, a circuit board, a plate, a cover/button element and an elastic element. The circuit board is disposed in the case and includes a transducer for receiving and converting sound waves into electric signals and a switch operable for turning on and off the circuit board. The plate is disposed in the case and defines two slots and an aperture through which the switch is exposed. A cover/button element includes at least two hooks inserted through the slots defined in the plate so that the cover/button element is movable between a normal position away from the switch of the circuit board and a pushed position in contact with the switch while always covering the case. The elastic element is sandwiched between the plate and the cover/button element for returning the cover/button element to the normal position from the pushed position.Type: GrantFiled: October 13, 2006Date of Patent: February 22, 2011Assignee: Merry Electronics Co., Ltd.Inventors: Chun-Nan Chen, I-Ming Lin
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Publication number: 20100111348Abstract: An in-ear earphone includes a shell and a sound output device. The shell has a first engaging portion. The sound output device has a sound tunnel, a second engaging portion and a speaker. The speaker is disposed between the sound tunnel and the second engaging portion coaxially with the sound tunnel. The second engaging portion is movably engaged with the first engaging portion. The angle between the shell and the sound output device is adjustable so that the sound tunnel can be suitably plugged into individual user's ear canals.Type: ApplicationFiled: November 4, 2008Publication date: May 6, 2010Inventors: Ching-Jung TSAO, I-Ming LIN
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Patent number: 7614911Abstract: The present invention discloses a strain relief collar for use with an accessory associated with a mobile device and its method of making. The first step is the making of an outer molded body having an engagement portion with a cutout. The second step is inserting a cord into the outer molded body. The third step is the forming of an inner molded body having a hooking portion extending outward from the periphery thereof and beyond the cutout for engaging with an accessory. The present invention also discloses another strain relief collar for use with another accessory associated with a mobile device and its method of making. The first step is connecting the cord to an electrical component associated with the accessory. The second step is the forming of an inner molded body. The third step is the forming of an outer molded body.Type: GrantFiled: November 9, 2007Date of Patent: November 10, 2009Assignee: Merry Electronics Co., Ltd.Inventors: Fang-Chang Hsieh, I-Ming Lin
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Patent number: D671606Type: GrantFiled: February 7, 2012Date of Patent: November 27, 2012Inventor: I-Ming Lin