Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: An imaging system including a housing, a light-splitting element, a light valve module, and a compensation module is provided. The light valve module is disposed on a transmission path of an illumination beam and is configured to convert the illumination beam into an image beam. The light-splitting element is disposed on the transmission path of the illumination beam and is configured to reflect the illumination beam and allow the image beam to pass through. The compensation module is disposed between the light valve module and the light-splitting element. The compensation module includes a carrier element and a compensation element. The carrier element includes a slot. The carrier element is configured to rotate around a rotation axis. The compensation element is disposed in the slot and is located on the transmission path of the illumination beam and a transmission path of the image beam.

Abstract: An imaging system including a housing, a light-splitting element, a light valve module, and a compensation module is provided. The light valve module is disposed on a transmission path of an illumination beam and is configured to convert the illumination beam into an image beam. The light-splitting element is disposed on the transmission path of the illumination beam and is configured to reflect the illumination beam and allow the image beam to pass through. The compensation module is disposed between the light valve module and the light-splitting element. The compensation module includes a carrier element and a compensation element. The carrier element includes a slot. The carrier element is configured to rotate around a rotation axis. The compensation element is disposed in the slot and is located on the transmission path of the illumination beam and a transmission path of the image beam.

Abstract: A projector includes an outer casing and a projection module. The outer casing has a front end surface, a projection opening, and at least one heat dissipation opening. The projection opening and the at least one heat dissipation opening are located at the front end surface. The projection module is disposed in the outer casing and includes a light source module configured to provide an illumination beam, a light valve configured to convert the illumination beam to an image beam, and a projection lens protruding from the front end surface and is configured to project the image beam out of the outer casing through the projection opening. The projection module is configured to rotate relative to the outer casing to change a projection direction of the image beam and may be embedded in a ceiling and present a better appearance, and the projection direction of the projector is less restricted.

Abstract: A projector includes an outer casing and a projection module. The outer casing has a front end surface, a projection opening, and at least one heat dissipation opening. The projection opening and the at least one heat dissipation opening are located at the front end surface. The projection module is disposed in the outer casing and includes a light source module configured to provide an illumination beam, a light valve configured to convert the illumination beam to an image beam, and a projection lens protruding from the front end surface and is configured to project the image beam out of the outer casing through the projection opening. The projection module is configured to rotate relative to the outer casing to change a projection direction of the image beam and may be embedded in a ceiling and present a better appearance, and the projection direction of the projector is less restricted.

Abstract: A thin heat sink structure includes a housing and at least one heat dissipation plate. The housing is assembled from a first housing portion and a second housing portion and is formed therein with a receiving space. The heat dissipation plate is provided in the receiving space and is formed with at least one hollow flow channel by stamping. The flow channel is in communication with the first housing portion and the second housing portion. Two heat dissipation plates can be stacked in the receiving space in such a way that the two flow channels are linearly or angularly offset with respect to and overlap each other, and that the overlapping portions of the two flow channels form a hollow portion in communication with the two housing portions. The thin heat sink structure can be made into a large heat sink with high heat dissipation efficiency.

Abstract: A PCM (phase change material)-based heat sink structure includes an evaporation unit, a condensation unit, and a connecting pipe. The evaporation unit has a first space provided with a plurality of spaced first partitions that are integrally formed by an aluminum extrusion process. The first partitions partition the first space into a plurality of first branch passages. The first partitions are formed with a first main passage communicating with each first branch passage. The condensation unit has a second space provided with a plurality of spaced second partitions that are integrally formed by an aluminum extrusion process. The second partitions partition the second space into a plurality of second branch passages. The second partitions are formed with a second main passage communicating with each second branch passage. The connecting pipe is connected between the condensation unit and the evaporation unit to form a circulating heat dissipation loop.

Abstract: The disclosure provides a method and a projection device for focal length calibration. The projection device includes a distance sensor, a projection lens, and a controller. The method includes: defining, by the distance sensor, a detection area on a projection surface; dividing, by the controller, the detection area into a plurality of reference areas; detecting, by the distance sensor, a reference distance between the projection device and each reference area; finding, by the controller, at least one first area and at least one second area in the reference areas; and performing, by the controller, a focusing operation of the projection lens only based on the reference distance of each second area.

Abstract: The disclosure provides a method and a projection device for focal length calibration. The projection device includes a distance sensor, a projection lens, and a controller. The method includes: defining, by the distance sensor, a detection area on a projection surface; dividing, by the controller, the detection area into a plurality of reference areas; detecting, by the distance sensor, a reference distance between the projection device and each reference area; finding, by the controller, at least one first area and at least one second area in the reference areas; and performing, by the controller, a focusing operation of the projection lens only based on the reference distance of each second area.

Abstract: A projector and a light source module including a light emitting diode element, a pin connector, and two power cords are provided. The light emitting diode element has a first electrode and a second electrode. The pin connector is disposed on the light emitting diode element and has two connection pins, wherein each connection pin has a first connection end and a second connection end, and the two first connection ends respectively contact the first electrode and the second electrode. The two power cords are respectively connected to the first electrode and the second electrode through the two connection pins, wherein each power cord includes a joint and a wire connected to each other, each joint and the corresponding second connection end are mutually plugged along a first axial direction, each wire extends out from the corresponding joint along a second axial direction perpendicular to the first axial direction.

Abstract: A projector and a light source module including a light emitting diode element, a pin connector, and two power cords are provided. The light emitting diode element has a first electrode and a second electrode. The pin connector is disposed on the light emitting diode element and has two connection pins, wherein each connection pin has a first connection end and a second connection end, and the two first connection ends respectively contact the first electrode and the second electrode. The two power cords are respectively connected to the first electrode and the second electrode through the two connection pins, wherein each power cord includes a joint and a wire connected to each other, each joint and the corresponding second connection end are mutually plugged along a first axial direction, each wire extends out from the corresponding joint along a second axial direction perpendicular to the first axial direction.

Abstract: A lamp module suitable for a projector has an insulating base, a lamp, electrode lines, electrode terminals, electrode strips, conductive lines, an electrical connector and conductive terminals. The lamp is mounted on the insulating base. Each of the electrode lines has an end connected to the lamp. The electrode terminals are respectively connected to the other ends of the electrode lines. Each of the electrode strips has a first end and a second end, wherein the electrode terminals and the first ends are fastened on the insulating base, and the electrode terminals respectively contact the first ends. The electrical connector is connected to one ends of the conductive lines. The conductive terminals are respectively connected to another ends of the conductive lines. The conductive terminals and the second ends herein are fastened on the insulating base, and the conductive terminals respectively contact the second ends.

Abstract: The present invention provides an assembled heat sink structure including a base, a plurality of heat dissipating fins mounted on the top of the base, and a capillary device located inside the base, wherein the base is formed and assembled by an upper cover with a lower cover and the mountain-shaped fin-like device for diversion or capillary is located inside the base, so that after a plurality of heat dissipating fins are assembled on the top of the base, they can be welded to form an integration. Then, a heat dissipating medium can be poured into the airtight chamber of the base, and thus, when the base is contacted with the contact surface, the heat can be absorbed by an absorbing end of the base, transmitted to a plurality of heat dissipating fins on the top of the base and then exhausted by a fan, thereby achieving heat dissipating effect.

Abstract: A lamp module suitable for a projector has an insulating base, a lamp, electrode lines, electrode terminals, electrode strips, conductive lines, an electrical connector and conductive terminals. The lamp is mounted on the insulating base. Each of the electrode lines has an end connected to the lamp. The electrode terminals are respectively connected to the other ends of the electrode lines. Each of the electrode strips has a first end and a second end, wherein the electrode terminals and the first ends are fastened on the insulating base, and the electrode terminals respectively contact the first ends. The electrical connector is connected to one ends of the conductive lines. The conductive terminals are respectively connected to another ends of the conductive lines. The conductive terminals and the second ends herein are fastened on the insulating base, and the conductive terminals respectively contact the second ends.

Abstract: A lens cap device having a cap protecting device, an actuating device, and a lens cap. The cap protecting device has a protecting cap with a lens exposure hole. The actuating device has a push element and an actuating element. The push element is slidably disposed on the cap protecting device. One end of the actuating element is pivotally connected on the cap protecting device to form a pivot point. The actuating element and the push element are linked together. The lens cap is slidably mounted on the cap protecting device. The lens cap is pivotally connected with the other end of the actuating element. The lens cap is driven by the actuating element to cover or open the lens exposure hole.

Abstract: A lens cap device having a cap protecting device, an actuating device, and a lens cap. The cap protecting device has a protecting cap with a lens exposure hole. The actuating device has a push element and an actuating element. The push element is slidably disposed on the cap protecting device. One end of the actuating element is pivotally connected on the cap protecting device to form a pivot point. The actuating element and the push element are linked together. The lens cap is slidably mounted on the cap protecting device. The lens cap is pivotally connected with the other end of the actuating element. The lens cap is driven by the actuating element to cover or open the lens exposure hole.