Abstract: A lens cap device having a cap protecting device, an actuating device, and a lens cap. The cap protecting device has a protecting cap with a lens exposure hole. The actuating device has a push element and an actuating element. The push element is slidably disposed on the cap protecting device. One end of the actuating element is pivotally connected on the cap protecting device to form a pivot point. The actuating element and the push element are linked together. The lens cap is slidably mounted on the cap protecting device. The lens cap is pivotally connected with the other end of the actuating element. The lens cap is driven by the actuating element to cover or open the lens exposure hole.

Abstract: A projection apparatus including a projection module, a control unit, a housing, a wireless-receiving unit and a control panel is provided. The control unit is electrically connected to the projection module for controlling the projection module. The housing is suitable for accommodating the projection module and the control unit and has a concavity exposed outside. The wireless-receiving unit is disposed inside the housing and is electrically connected to the control unit. The control panel is detachably installed in the concavity. When the control panel is installed in the concavity, the control panel is electrically connected to the control unit such that the control panel is suitable for providing an electric signal to the control unit for controlling the projection module. When the control panel is detached from the concavity, the control panel is suitable for providing a wireless signal to the wireless-receiving unit for controlling the projection module.

Abstract: A radiator plate rapid cooling apparatus includes a base deck and radiation fins located thereabove formed integrally by extrusion, forging or soldering. The base deck is located at the bottom end of the radiator plate and has passages formed by machining that house a capillary device placed therein or integrally formed by extrusion to become a double-layer passage loop. After being vacuumized, the loop is filled with a liquid or gas heat dissipation medium to the amount of 10% to 70% of the internal volume capacity of the passages. The base deck is in contact with a contact surface of a computer heat generating element. Heat may be concentrated on a heat absorption end of the base deck, transferred to the radiation fins, and be dispelled by a fan to improve heat dissipation.

Abstract: A radiator plate rapid cooling apparatus includes a base deck and radiation fins located thereabove formed integrally by extrusion, forging or soldering. The base deck is located at the bottom end of the radiator plate and has passages formed by machining that house a capillary device placed therein or integrally formed by extrusion to become a double-layer passage loop. After being vacuumized, the loop is filled with a liquid or gas heat dissipation medium to the amount of 10% to 70% of the internal volume capacity of the passages. The base deck is in contact with a contact surface of a computer heat generating element. Heat may be concentrated on a heat absorption end of the base deck, transferred to the radiation fins, and be dispelled by a fan to improve heat dissipation.

Abstract: A radiation fin structure aims to disperse heat for personal or notebook computers and peripheral devices thereof. The structure includes a base deck at the bottom end of the radiation fins with grid type passages formed therein to form a closed loop. The closed loop is filled with a liquid or gas heat dissipation medium to the amount about 50% to 90% of the internal volume capacity of the grid type passages. When the base deck is in contact with the contact surface of a computer heat generating element, heat concentrates on the heat absorption end of the base deck and is transferred to the fin-type heat dissipation section to be dispelled by a fan to improve heat dissipation effect.

Abstract: An apparatus for forming the thin film on the organic light-emitting diode component includes an evaporation resource mechanism, a mixing chamber mechanism, a hollow revolving spindle mechanism, and a vacuum mechanism. The mixing chamber mechanism is coupled to the evaporation resource mechanism. The vacuum mechanism is coupled to the mixing chamber mechanism and is used for generating vacuum in the mixing chamber mechanism. The hollow revolving spindle mechanism has a hollow revolving spindle whose of one end is coupled to the mixing chamber mechanism, a revolving arm coupled to the other end of the hollow revolving spindle and having a surface and a plurality of spraying holes disposed on the surface, and a transmission mean having a driving resource and a transmitting body disposed around the hollow revolving spindle, such that the driving source drives the transmitting body and further the transmitting body drives the hollow revolving spindle.

Abstract: An edge-coupled photodetector, especially a compound semiconductor edge-coupled photodetectors, has a light funnel integrated right in front of the coupling aperture for enhancing the optical coupling efficiency. The light funnel is formed utilizing either a wet etched, crystallographically defined semiconductor slope or a dry etched, resist-profile-defined semiconductor slope covered by the planarized dielectrics. The funnel internals can be partially or fully metallized for total mirror reflection. The lightwave entering the funnel and propagating along the optical axis converges through mirror reflection or total internal reflection. Through such an invention, the edge-coupled photodetector can have both high operation speed and high quantum efficiency with enlarged alignment tolerance.

Abstract: A method of forming a film for organic electrified light emitting elements includes aligning a substrate with a shadow mask outside a vacuum deposition chamber; moving the aligned substrate and the shadow mask into the vacuum deposition chamber through a robotic arm and holding the aligned substrate and the shadow mask through an alignment mechanism; and plating an organic material from a vaporization material by vaporization to form a film of the organic electrified light emitting elements on the substrate.

Abstract: A plurality of metal bumps connecting a nonconducting substrate and a chip, consisting of: at least a first metal bump having at least one curved face, at least a second metal bump having at least one curved face, and at least a third metal bump having at least a first curved face and a second curved face. The three centers of these first three metal bumps form a triangle, in that the first curved face of the third metal bump is adjacent to the curved face of the first metal bump, and the second curved face of the third metal bump is adjacent to the curved face of the second metal bump.

Abstract: A plurality of metal bumps connecting a nonconducting substrate and a chip, consisting of: at least a first metal bump having at least one curved face, at least a second metal bump having at least one curved face, and at least a third metal bump having at least a first curved face and a second curved face. The three centers of these first three metal bumps form a triangle, in that the first curved face of the third metal bump is adjacent to the curved face of the first metal bump, and the second curved face of the third metal bump is adjacent to the curved face of the second metal bump.