Patents by Inventor I-Peng Yao

I-Peng Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230226661
    Abstract: The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 ?m to 10 ?m. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing apparatus.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 20, 2023
    Inventors: I-PENG YAO, YUNG-CHANG HUNG, HSIEN-CHANG HUNG, LYANG-GUNG WANG, HSIN-RU SONG, JENG YI WU, CHI CHE HUANG
  • Patent number: 10906154
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of second fibers, a polymeric elastomer and a plurality of pores. The second fibers are arranged irregularly and cross each other to form the pores, and the polymeric elastomer is attached to the second fibers and does not fill the pores.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: February 2, 2021
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chih-Yi Lin, Tai-Yun Fu, Yung-Chang Hung, Jhih-Gong Lin
  • Patent number: 10702970
    Abstract: The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: July 7, 2020
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wei-Te Liu, Wen-Chieh Wu, Yung-Chang Hung
  • Patent number: 10076818
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a plurality of first trenches. The first trench has an opening at the first surface. The polishing layer is located on the first surface of the base layer and fills the first trenches. The polishing layer has a plurality of second trenches, the positions of the second trenches correspond to those of the first trenches, and the depth of the second trenches is less than that of the first trenches.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: September 18, 2018
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang
  • Patent number: 10022836
    Abstract: The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: July 17, 2018
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Wei-Te Liu, Chun-Ta Wang
  • Patent number: 10022835
    Abstract: The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: July 17, 2018
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Wei-Te Liu
  • Publication number: 20180193974
    Abstract: The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.
    Type: Application
    Filed: January 5, 2018
    Publication date: July 12, 2018
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, WEI-TE LIU, WEN-CHIEH WU, YUNG-CHANG HUNG
  • Publication number: 20180147690
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of second fibers, a polymeric elastomer and a plurality of pores. The second fibers are arranged irregularly and cross each other to form the pores, and the polymeric elastomer is attached to the second fibers and does not fill the pores.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 31, 2018
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, CHIH-YI LIN, TAI-YUN FU, YUNG-CHANG HUNG, JHIH-GONG LIN
  • Publication number: 20180111247
    Abstract: The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.
    Type: Application
    Filed: December 20, 2017
    Publication date: April 26, 2018
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEI-TE LIU
  • Patent number: 9889630
    Abstract: The sheet of a polishing equipment of the present invention includes a buffer layer, an adsorption layer, and an adhesion layer. The adhesion layer is disposed between the buffer layer and the adsorption layer. The adhesion layer has a plurality of adhesion points to bind the buffer layer and the adsorption layer together. The adhesion points are discontinuous and have gaps in between. Consequently, when the sheet is pressed, air can be vented out through the gaps between the adhesion points, so that the adsorption force is increased.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: February 13, 2018
    Assignee: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wen-Chieh Wu
  • Publication number: 20180036861
    Abstract: The present invention relates to a polishing pad with improved slurry retention capacity, which includes a polishing layer. The polishing layer includes an elastomer main body and a plurality of titanium dioxide nanowires. Each of the titanium dioxide nanowires is independent and is distributed evenly and randomly in the elastomer main body. The present invention further provides a polishing apparatus and a method for manufacturing the polishing pad.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 8, 2018
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, PIN-HSIEN SUNG, CHIN-WEI CHEN, WEN-CHIEH WU
  • Patent number: 9884400
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a polymeric elastomer and a plurality of hollow structures. The hollow structures are distributed in the polymeric elastomer uniformly, and the sizes of the hollow structures are substantially equal to each other.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: February 6, 2018
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD
    Inventors: Chung-Chih Feng, I-Peng Yao, Wen-Chieh Wu, Hsin-Ru Song
  • Patent number: 9862071
    Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: January 9, 2018
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang
  • Publication number: 20170297165
    Abstract: The present invention relates to a polishing pad comprising a polishing surface. The polishing surface comprises a first polishing area and a second polishing area. The first polishing area comprises a plurality of first foaming holes, and the second polishing area comprises a plurality of second foaming holes, and an average pore diameter of the first foaming holes is less than an average pore diameter of the second foaming holes. The polishing pad according to the present invention uses the polishing areas with the different pore diameters of the holes to avoid unevenly removing the edge and central part of a substrate when polishing, so that a thickness of the substrate becomes uniform.
    Type: Application
    Filed: June 28, 2017
    Publication date: October 19, 2017
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, KUN-CHENG TSAI
  • Publication number: 20170239783
    Abstract: The present invention relates to a mounting sheet comprising a mounting layer. The mounting layer comprises a mounting surface for mounting the substrate. The mounting surface comprises a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area. The sheet according to the invention has the different mounting areas, so that the substrate is easily unloaded when polishing is completed. Furthermore, the broken of the substrate due to removal and the duration and the difficulty of removal are reduced.
    Type: Application
    Filed: April 14, 2017
    Publication date: August 24, 2017
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, HSIN-RU SONG, WEN-CHIEH WU
  • Publication number: 20170203407
    Abstract: A back pad capable of color rendering end-of-life includes an absorption layer, a dye capsule layer and a carrier layer. The absorption layer has a surface. The dye capsule layer is disposed on the surface of the absorption layer. The carrier layer is laminated onto the dye capsule layer. The dye capsule layer of the present disclosure can be dissolved to release dyes after water penetrates in the back pad, and the end-of-life of the back pad can be easily determined through a color-rendering effect of the dyes.
    Type: Application
    Filed: May 9, 2016
    Publication date: July 20, 2017
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, HSIN-RU SONG
  • Patent number: 9682457
    Abstract: The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: June 20, 2017
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Wen-Chieh Wu, Yung-Chang Hung
  • Patent number: 9669518
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: June 6, 2017
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Wen-Chieh Wu, Yung-Chang Hung
  • Patent number: 9616611
    Abstract: The present invention relates to a ball shaped product and a method for making the same. The method includes the following steps of: (a) placing a ball shaped interior material on a supporting seat, wherein a part of an outer surface of the ball shaped interior material is exposed outside the supporting seat; (b) placing the ball shaped interior material and the supporting seat in a chamber; (c) covering a wrapping material on the chamber; (d) vacuum pumping the chamber, so that the wrapping material is attached to the exposed part of the outer surface of the ball shaped interior material; (e) releasing the vacuum of the chamber; and (f) rotating the ball shaped interior material, and repeating the step (a) to step (e) at least one time.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: April 11, 2017
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Ko-Feng Wang, Kai-Feng Kang, Chun-Yi Kuo
  • Publication number: 20160199961
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a polymeric elastomer and a plurality of hollow structures. The hollow structures are distributed in the polymeric elastomer uniformly, and the sizes of the hollow structures are substantially equal to each other.
    Type: Application
    Filed: October 1, 2015
    Publication date: July 14, 2016
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, WEN-CHIEH WU, HSIN-RU SONG