Patents by Inventor I-Peng Yao

I-Peng Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090041997
    Abstract: A PU composite and a method of fabricating the same are provided. The fabrication method includes: (a) providing a release paper; (b) coating a fabric layer on the release paper, the fabric layer containing a PU resin, an abrasion resistant, and a colorant; (c) drying the fabric layer; (d) coating a first laminated layer on the fabric layer; (e) drying the first laminated layer; (f) laminating a wet PU foam layer on the first laminated layer; (g) releasing the release paper to form a semi-product; (h) providing a plastic layer, which is of a thermoplastic; (i) coating a second laminated layer on the plastic layer; (j) drying the second laminated layer; and (k) laminating the semi-product of Step (g) on the second laminated layer, so as to form a PU composite. Compared with conventional PU composites, the PU composite of the present invention has better UV resistance, solvent resistance, and abrasion resistance.
    Type: Application
    Filed: January 14, 2008
    Publication date: February 12, 2009
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Ko-Feng Wang, Chen-Tai Cheng, Kai-Feng Kang
  • Publication number: 20080299879
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Application
    Filed: May 29, 2007
    Publication date: December 4, 2008
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Kun-Cheng Sung
  • Publication number: 20080287047
    Abstract: The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Application
    Filed: May 18, 2007
    Publication date: November 20, 2008
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, CHEN-HSIANG CHAO, YUNG-CHANG HUNG
  • Publication number: 20080268223
    Abstract: The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Zong-Yao Ku
  • Publication number: 20080268227
    Abstract: The present invention relates to a complex polishing pad and method for making the same. The method of the invention comprises the steps of: (a) providing a buffer layer, the buffer layer being continuous-porous material and having a surface; (b) flattening the surface of the buffer layer to form a flattened surface; and (c) disposing a polishing layer on the flattened surface so as to form the complex polishing pad, wherein the polishing layer is used to polish a polishing workpiece. Whereby, the complex polishing pad of the invention has a better flatness, and the buffer layer and the polishing layer have a stronger combination.
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Publication number: 20080220702
    Abstract: The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
    Type: Application
    Filed: May 21, 2008
    Publication date: September 11, 2008
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih FENG, I-Peng YAO, Chen-Hsiang CHAO, Kun-Cheng SUNG
  • Publication number: 20080220701
    Abstract: A method for making a polishing pad includes providing a non-woven fabric made of a plurality of fibers. The non-woven fabric is submerged with a polymer resin solution. The polymer resin submerged in non-woven fabric is cured to form a porous polymer having an outer face adapted for polishing a workpiece. The outer face of the porous polymer is finished to form a polishing pad with a plurality of naps on the outer face. The plurality of naps on the outer face have a density ranging from 1.0 to 2.0 g/cm3, and the plurality of naps on the outer face have a length ranging from 50 to 600 ?m.
    Type: Application
    Filed: May 20, 2008
    Publication date: September 11, 2008
    Inventors: Chung-Ching Feng, Chen-Hsiang Chao, I-Peng Yao, Yung-Chang Hung
  • Publication number: 20080200102
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; and a buffer layer formed between the base material and an upper surface of the membrane with low permeability and embedded into the fibers of the base material. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided.
    Type: Application
    Filed: February 15, 2007
    Publication date: August 21, 2008
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Publication number: 20080200105
    Abstract: The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate comprises holes, and the material of the surface substrate comprises elastomer. The buffer substrate comprises holes, and the material of the buffer substrate comprises the elastomer. The surface substrate and the buffer substrate are adhered with adhesive comprising the elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece.
    Type: Application
    Filed: February 15, 2007
    Publication date: August 21, 2008
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Publication number: 20080188168
    Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a high polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The high polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
    Type: Application
    Filed: February 5, 2007
    Publication date: August 7, 2008
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Chao-Yuan Tsai
  • Publication number: 20080187715
    Abstract: A method for making an elastic laminate includes providing adhesive on each of two sides of a highly porous foil to form a polygonal reticulate adhesive film which includes a plurality of polygonal adhesive dots spaced from one another by a plurality of adhesive-free linear gaps, or which includes a plurality of hollow polygonal adhesive units connected to one another and each encloses a polygonal adhesive-free gap. Two sheets of elastic layers are adhered by the adhesive to the sides of the highly porous foil so that polygonal reticulate gaps exist between the highly porous foil and the elastic layer, providing a laminate with moisture-absorbing, permeable, quick drying, thermally insulating, and elastic properties.
    Type: Application
    Filed: April 2, 2008
    Publication date: August 7, 2008
    Inventors: Ko-Feng Wang, I-Peng Yao, Kun-Lin Chiang
  • Publication number: 20080171493
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The non-woven fabric is made of a long fiber and the elastomer is embedded into the fabric.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Applicant: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Yung-Chang Hung
  • Publication number: 20080064310
    Abstract: The invention relates to a polishing pad having hollow fibers and a method for making the same. The polishing pad comprises a body and a plurality of hollow fibers. The body has a polishing surface. The hollow fibers are located within the body and have an opening on the polishing surface, wherein the hollow area of the section of each hollow fiber is larger than the sectional area of polishing particles in a polishing slurry. Therefore, the polishing slurry and polishing particles achieve a thorough circulation on the polishing pad via the hollow fibers.
    Type: Application
    Filed: September 8, 2006
    Publication date: March 13, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chao-Yuan Tsai
  • Publication number: 20080047205
    Abstract: The present invention relates to a method of producing a polishing pad, comprising steps of: (a) providing a base material comprising a plurality of fibers; said base material having a surface for polishing a substrate, wherein the fibers comprise a core and a cladding surrounding the core, and the cladding comprises a hydrophobic polymer; (b) impregnating the surface of the base material with an elastomer solution; (c) coagulating the elastomer impregnated in the surface of the base material to mold the elastomer and to form a plurality of first continuous pores between the elastomer, and between the elastomer and the fibers; (d) planarizing the surface of the base material; (e) impregnating the surface of the base material and elastomer obtained in the step (d) with a condition polymer solution; and (e) curing the condition polymer impregnated in the surface of the base material and elastomer and partially filling the condition polymer into the first continuous pores to form a plurality of second continuous
    Type: Application
    Filed: September 24, 2007
    Publication date: February 28, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung
  • Patent number: 7316605
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: January 8, 2008
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003932
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Application
    Filed: July 3, 2006
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003927
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Application
    Filed: May 7, 2007
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003934
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Application
    Filed: March 19, 2007
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003933
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Application
    Filed: July 3, 2006
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20080003935
    Abstract: The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
    Type: Application
    Filed: July 3, 2006
    Publication date: January 3, 2008
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Kun-Cheng Sung