Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

Abstract: A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

Abstract: The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

Abstract: A wafer inspection method and inspection apparatus that perform a voltage inspection of a die on a wafer by a probe module. The probe module includes a processing module, a first probe coupled to a first electrode point of the die, and a second probe coupled to a second electrode point of the die. The first probe is coupled to the processing module, and the second probe is grounded. The processing module provides the die with a driving current through the first probe, and obtains an inspection voltage corresponding to the die. The processing module generates an inspection result of the inspection voltage based on two reference voltages respectively representing a high critical threshold value and a low critical threshold value of the die under a normal operation. The inspection result indicates an operating status of the die. Thus, inspection costs are reduced and inspection efficiency is enhanced.

Abstract: A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

Abstract: A testing apparatus for flip chip LEDs includes a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator. The spacing member is configured on a first surface of the transparent substrate. The flexible transparent carrier is removably assembled to the spacing member so that a closed space is formed by the flexible transparent carrier, the spacing member, and the first surface of the transparent substrate. The vacuum generator is connected to the closed space for pumping air out of the closed space, and then a part of the transparent substrate clings to the first surface to form a testing area for loading the flip chip LED.

Abstract: A solar cell testing system includes a multifunctional testing light source, a measuring unit, and an arithmetic unit. The multifunctional testing light source is configured to be switched to output a simulated solar light to a solar cell or asynchronously output a plurality of narrowband lights to the solar cell. The measuring unit is coupled to the solar cell and measures the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights. The arithmetic unit is coupled to the multifunctional testing light source and the measuring unit; it determines the solar cell's conversion efficiency and spectral response based on the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights.

Abstract: A solar cell testing system includes a multifunctional testing light source, a measuring unit, and an arithmetic unit. The multifunctional testing light source is configured to be switched to output a simulated solar light to a solar cell or asynchronously output a plurality of narrowband lights to the solar cell. The measuring unit is coupled to the solar cell and measures the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights. The arithmetic unit is coupled to the multifunctional testing light source and the measuring unit; it determines the solar cell's conversion efficiency and spectral response based on the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights.

Abstract: The invention discloses a light emitting component measuring system and the method thereof which is capable of measuring the optical proprieties of a plurality of the devices under test (DUT). Each DUT is capable of receiving electricity so as to output an initial ray, wherein each initial ray has a first wavelength range. The light emitting component measuring system comprises a filtering device and a sensing device. The filtering device comprises a first filtering portion which can filter a corresponding third wavelength of the said initial rays and output a plurality of first filtered rays simultaneously. Each first filtered ray has a second wavelength range respectively. The said sensing device receives the ray outputted from the filtering device and generates an optical data accordingly.

Abstract: A testing apparatus for flip chip LEDs includes a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator. The spacing member is configured on a first surface of the transparent substrate. The flexible transparent carrier is removably assembled to the spacing member so that a closed space is formed by the flexible transparent carrier, the spacing member, and the first surface of the transparent substrate. The vacuum generator is connected to the closed space for pumping air out of the closed space, and then a part of the transparent substrate clings to the first surface to form a testing area for loading the flip chip LED.

Abstract: The invention discloses an optical measurement system for measuring the optical properties of a device under test (DUT). The optical measurement system includes a DUT, a light measuring module, a light guiding module and an analyzing module. The present invention utilizes the light guiding module to receive an axial ray of the rays emitted by the DUT so as to analyze the optical properties thereof. Thus, the present invention is not only capable of measuring the light intensity of the rays emitted by the DUT, but also capable of obtaining the properties of the axial ray emitted by the DUT.

Abstract: The invention discloses a light emitting component measuring system and the method thereof which is capable of measuring the optical proprieties of a plurality of the devices under test (DUT). Each DUT is capable of receiving electricity so as to output an initial ray, wherein each initial ray has a first wavelength range. The light emitting component measuring system comprises a filtering device and a sensing device. The filtering device comprises a first filtering portion which can filter a corresponding third wavelength of the said initial rays and output a plurality of first filtered rays simultaneously. Each first filtered ray has a second wavelength range respectively. The said sensing device receives the ray outputted from the filtering device and generates an optical data accordingly.

Abstract: A method for testing light-emitting devices in a batch-wise, associated with a system for the same purpose, comprises the steps of: preparing the light-emitting devices on a moving carrier unit in a manner of aligning a predetermined longitudinal direction of the light-emitting devices with a predetermined transportation direction of the moving carrier unit, each of the light-emitting devices further having plural light-emitting elements; transporting orderly the light-emitting devices to pass a test area on a base of the system, in which the base energizes only the light-emitting elements within the test area; and, a solar cell module detecting continuously the energized light-emitting elements within the test area and further forming signals with respect to photo energy received in the test area.

Abstract: A method for testing light-emitting devices in a batch-wise, associated with a system for the same purpose, comprises the steps of: preparing the light-emitting devices on a moving carrier unit in a manner of aligning a predetermined longitudinal direction of the light-emitting devices with a predetermined transportation direction of the moving carrier unit, each of the light-emitting devices further having plural light-emitting elements; transporting orderly the light-emitting devices to pass a test area on a base of the system, in which the base energizes only the light-emitting elements within the test area; and, a solar cell module detecting continuously the energized light-emitting elements within the test area and further forming signals with respect to photo energy received in the test area.

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?umd)/??2,500; with ? being the fluid density, um being the free-stream fluid velocity, d being the pipe distance or diameter, ? being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?umd)/??2,500; with ? being the fluid density, um being the free-stream fluid velocity, d being the pipe distance or diameter, ? being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.