Patents by Inventor Ian A. Spraggs
Ian A. Spraggs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200281097Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.Type: ApplicationFiled: May 15, 2020Publication date: September 3, 2020Inventors: David A. PAKULA, Daniel W. JARVIS, Gregory N. STEPHENS, Ian A. SPRAGGS, James A. BERTIN, Eric M. BENNETT, Simon C. HELMORE, Melissa A. WAH, Matthew D. HILL, Jon F. HOUSOUR, Douglas G. FOURNIER, Christopher S. TOMASETTA
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Patent number: 10701833Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.Type: GrantFiled: September 21, 2017Date of Patent: June 30, 2020Assignee: APPLE INC.Inventors: David A. Pakula, Daniel W. Jarvis, Gregory N. Stephens, Ian A. Spraggs, James A. Bertin, Eric M. Bennett, Simon C. Helmore, Melissa A. Wah, Matthew D. Hill, Jon F. Housour, Douglas G. Fournier, Christopher S. Tomasetta
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Patent number: 10637192Abstract: A dual orientation connector having a connector tab with first and second major opposing sides and a plurality of electrical contacts carried by the connector tab. The plurality of contacts includes a first set of external contacts formed at the first major side and a second set of external contacts formed at the second major side. The first plurality of contacts are symmetrically spaced with the second plurality of contacts and the connector tab is shaped to have 180 degree symmetry so that it can be inserted and operatively coupled to a corresponding receptacle connector in either of two insertion orientations.Type: GrantFiled: August 27, 2018Date of Patent: April 28, 2020Assignee: Apple Inc.Inventors: Albert J. Golko, Mathias W. Schmidt, Eric S. Jol, Jahan Minoo, Ian Spraggs, Cameron Frazier, Fletcher Rothkopf, Jonathan Aase, Wendell Sander, Jeffrey J. Terlizzi
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Patent number: 10631410Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.Type: GrantFiled: September 20, 2017Date of Patent: April 21, 2020Assignee: Apple Inc.Inventors: Corey S. Provencher, Meng Chi Lee, Derek J. Walters, Ian A. Spraggs, Flynn P. Carson, Shakti S. Chauhan, Daniel W. Jarvis, David A. Pakula, Jun Zhai, Michael V. Yeh, Alex J. Crumlin, Dennis R. Pyper, Amir Salehi, Vu T. Vo, Gregory N. Stephens
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Publication number: 20200007670Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.Type: ApplicationFiled: September 12, 2019Publication date: January 2, 2020Inventors: Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah, William A. Counts
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Publication number: 20190369779Abstract: A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.Type: ApplicationFiled: August 19, 2019Publication date: December 5, 2019Inventors: Jonah A. Harley, Peter W. Richards, Brian Q. Huppi, Omar Sze Leung, Dhaval N. Shah, Martin P. Grunthaner, Steven P. Hotelling, Miguel C. Christophy, Vivek Katiyar, Tang Yew Tan, Christopher J. Butler, Erik G. De Jong, Ming Sartee, Rui Qiao, Steven J. Martisauskas, Storrs T. Hoen, Richard Hung Minh Dinh, Lee E. Hooton, Ian A. Spraggs, Sawyer I. Cohen, David A. Pakula
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Patent number: 10455738Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.Type: GrantFiled: September 21, 2017Date of Patent: October 22, 2019Assignee: Apple Inc.Inventors: David A. Pakula, Daniel W. Jarvis, Gregory N. Stephens, Ian A. Spraggs, Vu Thanh Vo, Amir Salehi, Dennis R. Pyper, Alex J. Crumlin, Corey S. Provencher, Derek J. Walters, Michael V. Yeh
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Patent number: 10447834Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.Type: GrantFiled: May 26, 2017Date of Patent: October 15, 2019Assignee: Apple Inc.Inventors: Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah, William A. Counts
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Patent number: 10386970Abstract: A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate.Type: GrantFiled: February 6, 2014Date of Patent: August 20, 2019Assignee: Apple Inc.Inventors: Jonah A. Harley, Peter W. Richards, Brian Q. Huppi, Omar Sze Leung, Dhaval N. Shah, Martin P. Grunthaner, Steven P. Hotelling, Miguel C Christophy, Vivek Katiyar, Tang Yew Tan, Christopher J. Butler, Erik G. de Jong, Ming Sartee, Rui Qiao, Steven J. Martisauskas, Storrs T. Hoen, Richard Hung Minh Dinh, Lee E. Hooton, Ian A. Spraggs, Sawyer I. Cohen, David A. Pakula
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Patent number: 10244659Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.Type: GrantFiled: September 21, 2017Date of Patent: March 26, 2019Assignee: Apple Inc.Inventors: Daniel W. Jarvis, David A. Pakula, David J. Dunsmoor, Ian A. Spraggs, Lee E. Hooton, Marwan Rammah, Matthew D. Hill, Robert F. Meyer, James A. Bertin, Eric M. Bennett, Simon C. Helmore, Melissa A. Wah, Jon F. Housour, Douglas G. Fournier, Christopher S. Tomasetta
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Publication number: 20190041909Abstract: An electronic disclosed herein may include a band formed from metal that combines with a bottom wall formed from a non-metal to form an enclosure that carries internal components. The electronic device may include a transparent cover and a display assembly partially covered by a border having a uniform dimension. The electronic device may include a vision system designed for facial recognition of a user of the electronic device. A bracket assembly may hold the vision system. The bracket assembly may not be affixed to the enclosure and may move relative to the enclosure. The electronic device may include a battery assembly having multiple battery components coupled together. The electronic device may further include a receiver coil for wireless charging of the battery assembly. The electronic device may include a circuit board assembly having stacked circuit boards. The electronic device may further include a dual camera assembly.Type: ApplicationFiled: August 6, 2018Publication date: February 7, 2019Inventors: David A. PAKULA, Daniel W. JARVIS, Shimon ELKAYAM, Brandon R. GARBUS, Christopher S. GRAHAM, Karl Ruben F. LARSSON, Ashley E. FLETCHER, Jared M. KOLE, Eric S. JOL, Aaron A. ORO, Michael D. QUINONES, Gregory N. STEPHENS, Ian SPRAGGS, James A. BERTIN, Simon C. HELMORE, Melissa A. WAH, Matthew D. HILL, Jon F. HOUSOUR, Douglas G. FOURNIER, Christopher S. TOMASETTA
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Publication number: 20180366872Abstract: A dual orientation connector having a connector tab with first and second major opposing sides and a plurality of electrical contacts carried by the connector tab. The plurality of contacts includes a first set of external contacts formed at the first major side and a second set of external contacts formed at the second major side. The first plurality of contacts are symmetrically spaced with the second plurality of contacts and the connector tab is shaped to have 180 degree symmetry so that it can be inserted and operatively coupled to a corresponding receptacle connector in either of two insertion orientations.Type: ApplicationFiled: August 27, 2018Publication date: December 20, 2018Inventors: Albert J. Golko, Mathias W. Schmidt, Eric S. Jol, Jahan Minoo, Ian Spraggs, Cameron Frazier, Fletcher Rothkopf, Jonathan Aase, Wendell Sander, Jeffrey J. Terlizzi
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Patent number: 10156874Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.Type: GrantFiled: May 4, 2016Date of Patent: December 18, 2018Assignee: Apple Inc.Inventors: Lee E. Hooton, Ian A. Spraggs, Marwan Rammah, Seth Reightler, Tyler Kakuda
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Patent number: 10090619Abstract: A dual orientation connector having a connector tab with first and second major opposing sides and a plurality of electrical contacts carried by the connector tab. The plurality of contacts includes a first set of external contacts formed at the first major side and a second set of external contacts formed at the second major side. The first plurality of contacts are symmetrically spaced with the second plurality of contacts and the connector tab is shaped to have 180 degree symmetry so that it can be inserted and operatively coupled to a corresponding receptacle connector in either of two insertion orientations.Type: GrantFiled: December 12, 2017Date of Patent: October 2, 2018Assignee: Apple Inc.Inventors: Albert J. Golko, Mathias W. Schmidt, Eric S. Jol, Jahan Minoo, Ian Spraggs, Cameron Frazier, Fletcher Rothkopf, Jonathan Aase, Wendell Sander, Jeffrey J. Terlizzi
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Patent number: D831025Type: GrantFiled: August 10, 2017Date of Patent: October 16, 2018Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, James A. Bertin, Daniele De Iuliis, Markus Diebel, David J. Dunsmoor, M. Evans Hankey, Matthew David Hill, Julian Hoenig, Richard P. Howarth, Stoyan P. Hristov, Jonathan P. Ive, Julian Jaede, Duncan Robert Kerr, David A. Pakula, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Ian Spraggs, Christopher J. Stringer, Joe Sung Ho Tan, Tang Yew Tan, Clement Tissandier, Melissa A. Wah, Eugene Antony Whang, Rico Zörkendörfer
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Patent number: D832266Type: GrantFiled: August 4, 2017Date of Patent: October 30, 2018Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Daniele De Iuliis, Markus Diebel, Douglas G. Fournier, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Daniel W. Jarvis, Duncan Robert Kerr, Robert F. Meyer, David A. Pakula, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Ian Spraggs, Christopher J. Stringer, Joe Sung Ho Tan, Tang Yew Tan, Clement Tissandier, Eugene Antony Whang, Rico Zörkendörfer
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Patent number: D848999Type: GrantFiled: August 4, 2017Date of Patent: May 21, 2019Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Daniele De Iuliis, Markus Diebel, M. Evans Hankey, Julian Hoenig, Lee E. Hooton, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Daniel W. Jarvis, Duncan Robert Kerr, Robert F. Meyer, David A. Pakula, Michael D. Quinones, Marwan Rammah, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Ian Spraggs, Christopher J. Stringer, Joe Sung Ho Tan, Tang Yew Tan, Clement Tissandier, Eugene Antony Whang, Rico Zörkendörfer
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Patent number: D849010Type: GrantFiled: June 29, 2018Date of Patent: May 21, 2019Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Daniele De Iuliis, Markus Diebel, M. Evans Hankey, Julian Hoenig, Lee E. Hooton, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Daniel W. Jarvis, Duncan Robert Kerr, Robert F. Meyer, David A. Pakula, Michael D. Quinones, Marwan Rammah, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Ian Spraggs, Christopher J. Stringer, Joe Sung Ho Tan, Tang Yew Tan, Clement Tissandier, Eugene Antony Whang, Rico Zörkendörfer
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Patent number: D856338Type: GrantFiled: October 29, 2018Date of Patent: August 13, 2019Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Daniele De Iuliis, Markus Diebel, Douglas G. Fournier, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Daniel W. Jarvis, Duncan Robert Kerr, Robert F. Meyer, David A. Pakula, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Ian Spraggs, Christopher J. Stringer, Joe Sung Ho Tan, Tang Yew Tan, Clement Tissandier, Eugene Antony Whang, Rico Zörkendörfer
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Patent number: D895626Type: GrantFiled: April 2, 2019Date of Patent: September 8, 2020Assignee: Apple Inc.Inventors: Jody Akana, Molly Anderson, Bartley K. Andre, Shota Aoyagi, Anthony Michael Ashcroft, Marine C. Bataille, Jeremy Bataillou, Markus Diebel, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Julian Jaede, Daniel W. Jarvis, Duncan Robert Kerr, Richard H. Koch, Robert F. Meyer, Michael D. Quinones, Peter Russell-Clarke, Benjamin Andrew Shaffer, Mikael Silvanto, Ian Spraggs, Sung-Ho Tan, Christopher S. Tomasetta, Clement Tissandier, Eugene Antony Whang, Rico Zörkendörfer