Patents by Inventor Ian A. Spraggs
Ian A. Spraggs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10015297Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.Type: GrantFiled: September 8, 2016Date of Patent: July 3, 2018Assignee: Apple Inc.Inventors: Lee E. Hooton, Daniel W. Jarvis, Marwan Rammah, Ian A. Spraggs, Nicholas G. Merz
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Publication number: 20180145452Abstract: A dual orientation connector having a connector tab with first and second major opposing sides and a plurality of electrical contacts carried by the connector tab. The plurality of contacts includes a first set of external contacts formed at the first major side and a second set of external contacts formed at the second major side. The first plurality of contacts are symmetrically spaced with the second plurality of contacts and the connector tab is shaped to have 180 degree symmetry so that it can be inserted and operatively coupled to a corresponding receptacle connector in either of two insertion orientations.Type: ApplicationFiled: December 12, 2017Publication date: May 24, 2018Inventors: Albert J. Golko, Mathias W. Schmidt, Eric S. Jol, Jahan Minoo, Ian Spraggs, Cameron Frazier, Fletcher Rothkopf, Jonathan Aase, Wendell Sander, Jeffrey J. Terlizzi
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Publication number: 20180092213Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.Type: ApplicationFiled: September 20, 2017Publication date: March 29, 2018Inventors: Corey S. Provencher, Meng Chi Lee, Derek J. Walters, Ian A. Spraggs, Flynn P. Carson, Shakti S. Chauhan, Daniel W. Jarvis, David A. Pakula, Jun Zhai, Michael V. Yeh, Alex J. Crumlin, Dennis R. Pyper, Amir Salehi, Vu T. Vo, Gregory N. Stephens
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Publication number: 20180084680Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer.Type: ApplicationFiled: September 21, 2017Publication date: March 22, 2018Inventors: Daniel W. JARVIS, David A. PAKULA, David J. DUNSMOOR, Ian A. SPRAGGS, Lee E. HOOTON, Marwan RAMMAH, Matthew D. HILL, Robert F. MEYER, James A. BERTIN, Eric M. BENNETT, Simon C. HELMORE, Melissa A. WAH, Jon F. HOUSOUR, Douglas G. FOURNIER, Christopher S. TOMASETTA
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Publication number: 20180084653Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.Type: ApplicationFiled: May 26, 2017Publication date: March 22, 2018Inventors: Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah, William A. Counts
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Publication number: 20180084636Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.Type: ApplicationFiled: September 21, 2017Publication date: March 22, 2018Inventors: David A. PAKULA, Daniel W. JARVIS, Gregory N. STEPHENS, Ian A. SPRAGGS, Vu Thanh VO, Amir SALEHI, Dennis R. PYPER, Alex J. CRUMLIN, Corey S. PROVENCHER, Derek J. WALTERS, Michael V. YEH
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Publication number: 20180083322Abstract: An electronic device having a battery assembly is disclosed. Unlike traditional battery assemblies that include rectilinear electrodes with two sides of equal length, the battery assemblies described herein may include electrodes having a shape/configuration resembling an L-shape electrode used to form chemical reactions in order to generate electrical energy. However, other shapes/configurations are possible. The shape/configuration of the housing of the battery assembly confirms to the shape/configuration of the electrodes. Further, in order to accommodate an internal component (such as a circuit board assembly), the shape of the battery assembly provides additional space in the electronic device. In order to form the electrodes, the electrodes may undergo a die cutting operation. Also, the housing may include a channel, or reduced dimension, that accommodates a flexible circuit in the electronic device that passes over the battery assembly at the channel.Type: ApplicationFiled: September 21, 2017Publication date: March 22, 2018Inventors: David A. PAKULA, Daniel W. JARVIS, Gregory N. STEPHENS, Ian A. SPRAGGS, James A. BERTIN, Eric M. BENNETT, Simon C. HELMORE, Melissa A. WAH, Matthew D. HILL, Jon F. HOUSOUR, Douglas G. FOURNIER, Christopher S. TOMASETTA
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Patent number: 9871319Abstract: A dual orientation connector having a connector tab with first and second major opposing sides and a plurality of electrical contacts carried by the connector tab. The plurality of contacts includes a first set of external contacts formed at the first major side and a second set of external contacts formed at the second major side. The first plurality of contacts are symmetrically spaced with the second plurality of contacts and the connector tab is shaped to have 180 degree symmetry so that it can be inserted and operatively coupled to a corresponding receptacle connector in either of two insertion orientations.Type: GrantFiled: October 12, 2016Date of Patent: January 16, 2018Assignee: APPLE INC.Inventors: Albert J. Golko, Mathias Schmidt, Eric S. Jol, Jahan Minoo, Ian Spraggs, Cameron Frazier, Fletcher Rothkopf, Jonathan Aase, Wendell Sander, Jeffrey J. Terlizzi
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Patent number: 9844898Abstract: Various processes for creating mirrored features are discussed herein as well as devices that include the mirrored features. One embodiment includes a button having a transparent layer and an opaque layer coupled to the transparent layer. A portion of the transparent layer extends through the opaque layer so that the portion of the transparent layer is flush with a back surface of the opaque layer and generally has a shape of a desired feature. The button also includes a reflective object positioned so that it may be seen through the transparent layer.Type: GrantFiled: September 30, 2011Date of Patent: December 19, 2017Assignee: APPLE INC.Inventors: Matthew D. Hill, Wayne Wei-Cheng Huang, Lee Hua Tan, Nicholas Isaac Reid, Reid Collins, Richard Hung Minh Dinh, Ian A. Spraggs
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Patent number: 9750152Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.Type: GrantFiled: August 11, 2014Date of Patent: August 29, 2017Assignee: Apple Inc.Inventors: Daniel W. Jarvis, Benjamin J. Pope, Jason S. Sloey, Jonathan C. Denby, Ian A. Spraggs, Shayan Malek
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Patent number: 9736283Abstract: An electronic device has a camera assembly disposed in a housing of the electronic device that includes a light source assembly having a primary purpose for illuminating a subject during an imaging operation. The light source assembly includes a light source and a light window. A light block can be applied to lateral surfaces of the light window to prevent light passing through the light window from propagating along an outer surface of the housing, or other components of the electronic device. In some embodiments, the light block can include multiple layers having various reflective and absorptive characteristics.Type: GrantFiled: May 15, 2014Date of Patent: August 15, 2017Assignee: Apple Inc.Inventors: Benjamin J. Pope, Ian A. Spraggs, Richard Hung Minh Dinh, Rasamy Phouthavong, Vincent Yan
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Publication number: 20170071064Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.Type: ApplicationFiled: September 8, 2016Publication date: March 9, 2017Inventors: Lee E. HOOTON, Daniel W. JARVIS, Marwan RAMMAH, Ian A. SPRAGGS, Nicholas G. MERZ
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Publication number: 20170068292Abstract: This application relates to thermal management of a computing device using various features that can dissipate and direct thermal energy. In some embodiments, a thermal insert is set forth for separating a component from a cover glass of the computing device. The thermal insert can be attached to a frame of the computing device by insert molding the thermal insert to the frame. In other embodiments, a graphite strip can be disposed across different surfaces within the computing device in order to direct thermal energy away from a component of the computing device. In yet other embodiments, a thermal spreader and thermally conductive adhesive can be disposed over different surfaces of the computing device. For example, the thermal spreader and thermally conductive adhesive can be used to direct thermal energy away from a backlight of the computing device.Type: ApplicationFiled: May 4, 2016Publication date: March 9, 2017Inventors: Lee E. HOOTON, Ian A. SPRAGGS, Marwan RAMMAH, Seth REIGHTLER, Tyler KAKUDA
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Publication number: 20170033496Abstract: A dual orientation connector having a connector tab with first and second major opposing sides and a plurality of electrical contacts carried by the connector tab. The plurality of contacts includes a first set of external contacts formed at the first major side and a second set of external contacts formed at the second major side. The first plurality of contacts are symmetrically spaced with the second plurality of contacts and the connector tab is shaped to have 180 degree symmetry so that it can be inserted and operatively coupled to a corresponding receptacle connector in either of two insertion orientations.Type: ApplicationFiled: October 12, 2016Publication date: February 2, 2017Applicant: APPLE INC.Inventors: Albert J. Golko, Mathias Schmidt, Eric S. Jol, Jahan Minoo, Ian Spraggs, Cameron Frazier, Fletcher Rothkopf, Jonathan Aase, Wendell Sander, Jeffrey J. Terlizzi
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Publication number: 20170013738Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.Type: ApplicationFiled: September 22, 2016Publication date: January 12, 2017Inventors: Daniel W. JARVIS, Benjamin J. POPE, Jason SLOEY, Jonathan C. DENBY, Ian A. SPRAGGS, Shayan MALEK
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Patent number: 9478905Abstract: A dual orientation connector having a connector tab with first and second major opposing sides and a plurality of electrical contacts carried by the connector tab. The plurality of contacts includes a first set of external contacts formed at the first major side and a second set of external contacts formed at the second major side. The first plurality of contacts are symmetrically spaced with the second plurality of contacts and the connector tab is shaped to have 180 degree symmetry so that it can be inserted and operatively coupled to a corresponding receptacle connector in either of two insertion orientations.Type: GrantFiled: February 5, 2015Date of Patent: October 25, 2016Assignee: Apple Inc.Inventors: Albert J. Golko, Mathias Schmidt, Eric Jol, Jahan Minoo, Ian Spraggs, Cameron Frazier, Fletcher Rothkopf, Jonathan Aase, Wendell Sander, Jeffrey J. Terlizzi
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Patent number: 9472917Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.Type: GrantFiled: August 11, 2014Date of Patent: October 18, 2016Assignee: Apple Inc.Inventors: Daniel W. Jarvis, Benjamin J. Pope, Jason S. Sloey, Jonathan C. Denby, Ian A. Spraggs, Shayan Malek
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Publication number: 20160044816Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.Type: ApplicationFiled: August 11, 2014Publication date: February 11, 2016Inventors: Daniel W. Jarvis, Benjamin J. Pope, Jason S. Sloey, Jonathan C. Denby, Ian A. Spraggs, Shayan Malek
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Patent number: D749591Type: GrantFiled: May 22, 2015Date of Patent: February 16, 2016Assignee: Apple Inc.Inventors: Jody Akana, Bartley K. Andre, Shota Aoyagi, Jeremy Bataillou, Lucy E. Browning, Miguel Christophy, Daniel J. Coster, Daniele De Iuliis, Jonathan Corbin Denby, Richard Hung Minh Dinh, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Daniel W. Jarvis, Duncan Robert Kerr, Matthew Dean Rohrbach, Peter Russell-Clarke, Mikael Silvanto, Jason Sloey, Ian Spraggs, Christopher J. Stringer, Tang Yew Tan, Eugene Antony Whang, Rico Zörkendörfer
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Patent number: D765625Type: GrantFiled: December 1, 2014Date of Patent: September 6, 2016Assignee: Apple Inc.Inventors: Jody Akana, Bartley K. Andre, John B. Ardisana, II, Jeremy Bataillou, Sawyer Isaac Cohen, Daniel J. Coster, Ruchir Dave, Daniele De Iuliis, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Duncan Robert Kerr, Shin Nishibori, David A. Pakula, Scott P. Porter, Matthew Dean Rohrbach, Peter Russell-Clarke, Ashutosh Y. Shukla, Jason Sloey, Ian Spraggs, Christopher J. Stringer, Tang Yew Tan, Eugene Antony Whang, Michael Benjamin Wittenberg, Charles B. Woodhull, Rico Zörkendörfer