Patents by Inventor Ian Davies

Ian Davies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6127545
    Abstract: The invention encompasses a process for making compounds of Formula I useful in the treatment of cyclooxygenase-2 mediated diseases.
    Type: Grant
    Filed: September 18, 1998
    Date of Patent: October 3, 2000
    Assignee: Merck & Co., Inc.
    Inventors: Philip J. Pye, Kai Rossen, Ashok Maliakal, Ralph P. Volante, Jess Sager, Jean-Francois Marcoux, Ian Davies, Edward G. Corley, Daniel Richard Sidler, Robert D. Larsen
  • Patent number: 4698901
    Abstract: A method of fabricating two terminal mesa semiconductor devices comprising etching a surface doped and metal coated silicon slice thereby to form a plurality of silicon frusta each capped by a metal contact pad, covering the frusta side of the slice with a metal contact continuity layer and then with a handle layer formed to lie parallel with that surface of the silicon slice which is remote from the frusta, lapping away the silicon slice to expose parts of the handle layer which extend between the frusta so that the frusta are separated so as to define discrete mesas held together by the handle layer, forming one of the two terminals on a face of the mesas remote from the contact pads, removing the handle layer to reveal the contact pads and bonding each contact pad thereby revealed to the metallized face of a diamond heat sink, one heat sink to each contact pad, which heat sink forms a part of the other of the two terminals of each mesa semiconductor device.
    Type: Grant
    Filed: August 29, 1986
    Date of Patent: October 13, 1987
    Assignee: Plessey Overseas Limited
    Inventors: Ian Davies, Sydney Cotton, Anthony M. Howard
  • Patent number: 4595603
    Abstract: A method of making a diamond heatsink includes securing a number of spaced diamonds to a sacrificial plate and then metallizing them with, for example, a thin layer of gold, silver, copper or aluminium. The plate and the diamonds are subsequently metal plated with a similar metal to the metallization until the diamonds are completely covered. The sacrificial plate is removed and the exposed surface cleaned and polished. Finally the assembly is diced to produce a number of individual heatsink assemblies.
    Type: Grant
    Filed: October 24, 1984
    Date of Patent: June 17, 1986
    Assignee: Plessey Overseas Limited
    Inventors: Ian Davies, Anthony M. Howard