Patents by Inventor Ian Pancham
Ian Pancham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7827930Abstract: An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure. The system also includes a substrate a fluid delivery system that is configured to deliver a processing fluid by use of a spraying process to a substrate mounted in the processing enclosure.Type: GrantFiled: January 26, 2005Date of Patent: November 9, 2010Assignee: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Russell Ellwanger, Ian A. Pancham, Ramakrishna Cheboli, Timothy W. Weidman
-
Patent number: 7654221Abstract: An electroless deposition system and electroless deposition stations are provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate shuttle positioned to transfer substrates between the first and second processing stations. The electroless deposition station also includes various fluid delivery and substrate temperature controlling devices to perform a contamination free and uniform electroless deposition process.Type: GrantFiled: July 6, 2005Date of Patent: February 2, 2010Assignee: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Ian A. Pancham
-
Patent number: 7534298Abstract: An apparatus and a method of controlling an electroless deposition process by directing electromagnetic radiation towards the surface of a substrate and detecting the change in intensity of the electromagnetic radiation at one or more wavelengths reflected off features on the surface of the substrate. In one embodiment the detected end of an electroless deposition process step is measured while the substrate is moved relative to the detection mechanism. In another embodiment multiple detection points are used to monitor the state of the deposition process across the surface of the substrate. In one embodiment the detection mechanism is immersed in the electroless deposition fluid on the substrate. In one embodiment a controller is used to monitor, store, and/or control the electroless deposition process by use of stored process values, comparison of data collected at different times, and various calculated time dependent data.Type: GrantFiled: September 17, 2004Date of Patent: May 19, 2009Assignee: Applied Materials, Inc.Inventors: Arulkumar Shanmugasundram, Manoocher Birang, Ian A. Pancham, Sergey Lopatin
-
Patent number: 7341633Abstract: Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure includes a gas supply positioned in fluid communication with an interior of the processing enclosure, a first fluid processing cell positioned in the enclosure, a first substrate head assembly positioned to support a substrate for processing in the first fluid processing cell, a second fluid processing cell positioned in the enclosure, a second head assembly positioned to support a substrate for processing in the second fluid processing cell, and a substrate shuttle positioned between the first and second fluid processing cells and being configured to transfer substrates between the fluid processing cells and the mainframe robot.Type: GrantFiled: October 14, 2004Date of Patent: March 11, 2008Assignee: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Ian A. Pancham, Sergey Lopatin
-
Patent number: 7323058Abstract: An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure.Type: GrantFiled: November 22, 2004Date of Patent: January 29, 2008Assignee: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Russell Ellwanger, Ian A. Pancham, Ramakrishna Cheboli
-
Patent number: 7311779Abstract: Embodiments of the invention provide a fluid processing method and apparatus. The apparatus includes a substrate support assembly positioned in a processing volume, a disk shaped member positioned in the processing volume in parallel orientation with a substrate supported on the substrate support assembly, a fluid outlet positioned in a central location of the disk shaped member, and a plurality of turbolators positioned on an upper surface of the disk shaped member, the turbolators being configured to generate a uniform turbulent flow of fluid traveling from the fluid outlet to a perimeter of the substrate. The method includes flowing a heated processing fluid over a plurality of turbolators that are positioned under a substrate being processed to control the temperature of the substrate during processing.Type: GrantFiled: October 6, 2003Date of Patent: December 25, 2007Assignee: Applied Materials, Inc.Inventors: Son T. Nguyen, Gary J. Rosen, Ian A. Pancham
-
Publication number: 20070199507Abstract: A method and apparatus for controlling a substrate temperature during an electroless deposition process. The apparatus includes a deposition cell configured to support a substrate at a position above a fluid distribution member. A heated fluid is dispensed from the fluid distribution member and contacts the backside of the substrate, thus heating the substrate. The fluid is dispensed from apertures configured to maintain a constant temperature across the substrate surface. The method includes flowing a heated fluid through a diffusion member against a backside of the substrate in a configuration that is configured to generate a constant processing temperature across the front side or processing side of the substrate.Type: ApplicationFiled: May 2, 2007Publication date: August 30, 2007Inventors: Ian Pancham, Son Nguyen, Gary Rosen
-
Patent number: 7223308Abstract: A method and apparatus for controlling a substrate temperature during an electroless deposition process. The apparatus includes a deposition cell configured to support a substrate at a position above a fluid distribution member. A heated fluid is dispensed from the fluid distribution member and contacts the backside of the substrate, thus heating the substrate. The fluid is dispensed from apertures configured to maintain a constant temperature across the substrate surface. The method includes flowing a heated fluid through a diffusion member against a backside of the substrate in a configuration that is configured to generate a constant processing temperature across the front side or processing side of the substrate.Type: GrantFiled: October 6, 2003Date of Patent: May 29, 2007Assignee: Applied Materials, Inc.Inventors: Ian A. Pancham, Son T. Nguyen, Gary J. Rosen
-
Patent number: 7205233Abstract: A method for fabricating a capping layer with enhanced barrier resistance to both copper and oxygen diffusion, comprises forming a capping layer on a conductive surface of an interconnect, wherein the capping layer comprises cobalt (Co), tungsten (W), rhenium (Re), and at least one of phosphorus (P) and boron (B). In an embodiment of the invention, forming the capping layer comprises exposing the conductive surface to an electroless capping solution comprising a cobalt source, a tungsten source, a rhenium source, and at least one of a phosphorus source and a boron source, and annealing the capping layer.Type: GrantFiled: November 7, 2003Date of Patent: April 17, 2007Assignee: Applied Materials, Inc.Inventors: Sergey Lopatin, Arulkumar Shanmugasundram, Dmitry Lubomirsky, Ian A. Pancham
-
Publication number: 20070062452Abstract: A coil has an integral fastener portion to facilitate fastening the coil to a shield wall to reduce generation of particulates.Type: ApplicationFiled: November 20, 2006Publication date: March 22, 2007Inventors: Ian Pancham, Michael Rosenstein, Leif DeLaurentis, Allen Lau, Praburam Gopalraja, James Gogh
-
Patent number: 7138014Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.Type: GrantFiled: January 28, 2002Date of Patent: November 21, 2006Assignee: Applied Materials, Inc.Inventors: Joseph J. Stevens, Dmitry Lubomirsky, Ian Pancham, Donald J. K. Olgado, Howard E. Grunes, Yeuk-Fai Edwin Mok
-
Publication number: 20050263066Abstract: An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure. The system also includes a substrate a fluid delivery system that is configured to deliver a processing fluid by use of a spraying process to a substrate mounted in the processing enclosure.Type: ApplicationFiled: January 26, 2005Publication date: December 1, 2005Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Russell Ellwanger, Ian Pancham, Ramakrishna Cheboli, Timothy Weidman
-
Publication number: 20050260345Abstract: An electroless deposition system and electroless deposition stations are provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate shuttle positioned to transfer substrates between the first and second processing stations. The electroless deposition station also includes various fluid delivery and substrate temperature controlling devices to perform a contamination free and uniform electroless deposition process.Type: ApplicationFiled: July 6, 2005Publication date: November 24, 2005Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Ian Pancham
-
Publication number: 20050199489Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.Type: ApplicationFiled: March 25, 2005Publication date: September 15, 2005Inventors: Joseph Stevens, Dmitry Lubomirsky, Ian Pancham, Donald Olgado, Howard Grunes, Yeuk-Fai Mok
-
Publication number: 20050181226Abstract: A method and apparatus for electrolessly depositing a multilayer film using a fluid processing solution(s) that can clean and then electrolessly deposit a metal films having discrete or varying composition onto a conductive surface using a single processing cell. The process advantageously includes in-situ cleaning step in order to minimize the formation of oxides on the conductive surfaces, by minimizing or preventing the exposure of the conductive surfaces to oxygen (e.g., air) between the cleaning step and an electroless deposition process step(s). In one aspect, the chemical components used in the fluid processing solution(s) are selected so that the interaction of various chemical components will not drastically change the desirable properties of each of the interacting fluids, generate particles in the fluid lines or on the surface of the substrate, and/or generate a significant amount of heat which can damage the hardware or significantly change the electroless process results.Type: ApplicationFiled: January 22, 2005Publication date: August 18, 2005Inventors: Timothy Weidman, Ian Pancham, Dmitry Lubomirsky, Arulkumar Shanmugasundram, Yosef Shacham-Diamand, Farhad Moghadam
-
Publication number: 20050160990Abstract: An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure.Type: ApplicationFiled: November 22, 2004Publication date: July 28, 2005Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Russell Ellwanger, Ian Pancham, Ramakrishna Cheboli
-
Publication number: 20050101130Abstract: A method for fabricating a capping layer with enhanced barrier resistance to both copper and oxygen diffusion, comprises forming a capping layer on a conductive surface of an interconnect, wherein the capping layer comprises cobalt (Co), tungsten (W), rhenium (Re), and at least one of phosphorus (P) and boron (B). In an embodiment of the invention, forming the capping layer comprises exposing the conductive surface to an electroless capping solution comprising a cobalt source, a tungsten source, a rhenium source, and at least one of a phosphorus source and a boron source, and annealing the capping layer.Type: ApplicationFiled: November 7, 2003Publication date: May 12, 2005Inventors: Sergey Lopatin, Arulkumar Shanmugasundram, Dmitry Lubomirsky, Ian Pancham
-
Publication number: 20050088647Abstract: An apparatus and a method of controlling an electroless deposition process by directing electromagnetic radiation towards the surface of a substrate and detecting the change in intensity of the electromagnetic radiation at one or more wavelengths reflected off features on the surface of the substrate. In one embodiment the detected end of an electroless deposition process step is measured while the substrate is moved relative to the detection mechanism. In another embodiment multiple detection points are used to monitor the state of the deposition process across the surface of the substrate. In one embodiment the detection mechanism is immersed in the electroless deposition fluid on the substrate. In one embodiment a controller is used to monitor, store, and/or control the electroless deposition process by use of stored process values, comparison of data collected at different times, and various calculated time dependent data.Type: ApplicationFiled: September 17, 2004Publication date: April 28, 2005Inventors: Arulkumar Shanmugasundram, Manoocher Birang, Ian Pancham, Sergey Lopatin
-
Publication number: 20050081785Abstract: Embodiments of the invention generally provide a fluid processing platform. The platform includes a mainframe having a substrate transfer robot, at least one substrate cleaning cell on the mainframe, and at least one processing enclosure. The processing enclosure includes a gas supply positioned in fluid communication with an interior of the processing enclosure, a first fluid processing cell positioned in the enclosure, a first substrate head assembly positioned to support a substrate for processing in the first fluid processing cell, a second fluid processing cell positioned in the enclosure, a second head assembly positioned to support a substrate for processing in the second fluid processing cell, and a substrate shuttle positioned between the first and second fluid processing cells and being configured to transfer substrates between the fluid processing cells and the mainframe robot.Type: ApplicationFiled: October 14, 2004Publication date: April 21, 2005Inventors: Dmitry Lubomirsky, Arulkumar Shanmugasundram, Ian Pancham, Sergey Lopatin
-
Publication number: 20050072526Abstract: Embodiments of the invention provide a fluid processing method and apparatus. The apparatus includes a substrate support assembly positioned in a processing volume, a disk shaped member positioned in the processing volume in parallel orientation with a substrate supported on the substrate support assembly, a fluid outlet positioned in a central location of the disk shaped member, and: a plurality of turbolators positioned on an upper surface of the disk shaped member, the turbolators being configured to generate a uniform turbulent flow of fluid traveling from the fluid outlet to a perimeter of the substrate. The method includes flowing a heated processing fluid over a plurality of turbolators that are positioned under a substrate being processed to control the temperature of the substrate during processing.Type: ApplicationFiled: October 6, 2003Publication date: April 7, 2005Inventors: Son Nguyen, Gary Rosen, Ian Pancham