Abstract: A computer-implemented method for vision transforming includes, for each of one or more channels of each of a set of tiles of an image: splitting the channel into at least a first channel portion and a second channel portion; processing the first channel portion using depthwise convolution; processing the second channel portion with multi-head self-attention; and combining the processed first channel portion and the processed second channel portion; and identifying an object in the image at least partially based on the combined processed first channel portion and processed second channel portion for each of the one or more channels of each of the set of tiles of the image.

Abstract: Aspects of this disclosure relate to a cancelling interference at an output of a power amplifier. An interference sensing circuit in a signal path between the power amplifier and an antenna can generate an interfering power signal. An interference cancellation loop can receive the interfering power signal and provide a cancellation signal to a transmit signal path that includes the power amplifier to thereby suppress interference at the output of the power amplifier. In certain embodiments, the interference cancellation loop includes an amplifier and a phase shifter. Related systems and methods are disclosed.

Abstract: A food preservative having antimicrobial and antioxidant activity and a method of fabrication. The food preservative includes an inner core including an extract of pomegranate pools and onion pools, and an outer coating of chia nano particles. The outer costing encapsulates the inner core.

Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first dielectric layer disposed over the upper surface of the semiconductor substrate, and a first current-carrying electrode and a second current-carrying electrode formed over the semiconductor substrate within openings formed in the first dielectric layer. A control electrode is formed over the semiconductor substrate and disposed between the first current-carrying electrode and a second current-carrying electrode and over the first dielectric layer. A first conductive element is formed over the first dielectric layer, adjacent the control electrode and between the control electrode and the second current-carrying electrode. A second dielectric layer is disposed over the control electrode and over the first conductive element. A second conductive element is disposed over the second dielectric layer and over the first conductive element.

Abstract: A transistor die includes input and output terminals and a source through-substrate via (TSV) between the input and output terminals. First and second primary drain contacts extend from the output terminal toward the input terminal past first and second sides, respectively, of the source TSV. An ancillary region is located adjacent to the source TSV, and boundaries of the ancillary region are defined by the source TSV, the first and second drain contacts, and one of the input terminal or the output terminal. The transistor further includes a primary transistor element, including a primary drain contact, a primary source contact, and a primary gate structure, located outside of the first ancillary region, and an ancillary transistor element, including an ancillary drain contact, an ancillary source contact, and an ancillary gate structure, located within the ancillary region.

Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first dielectric layer, a first current-carrying electrode, and a second current-carrying electrode formed over the semiconductor substrate. A control electrode is formed over the semiconductor substrate and disposed between the first current-carrying electrode and the second current-carrying electrode. A conductive element formed over the first dielectric layer, adjacent the control electrode, and between the control electrode and the second current-carrying electrode, includes a first region formed a first distance from the upper surface of the semiconductor substrate and a second region formed a second distance from the upper surface of the semiconductor substrate. An insulating region is formed between the control electrode and the conductive element.

Abstract: The present disclosure provides a thermomechanical actuator and a cleaning system implementing the thermomechanical actuator. The thermomechanical actuator includes a solar heat collector (SHC) housing shape memory alloy springs connected between a piston movably disposed therein and one end of the SHC. A cable extending from the piston through an opposite end of the SHC is connected to a bias load that develops returning force on the springs. In presence of solar radiation, the springs contract and cause linear movement of the piston in a direction of contraction and, in absence of the solar radiation, the springs expand and cause linear movement of the piston in direction of expansion. Useful power and work is extracted in form of the cleaning system from such linear movement of the piston.

Abstract: A device includes a semiconductor substrate, a source metallization over an active area of the semiconductor substrate, a through-substrate via electrically connected to the source metallization, and an input bond pad formed in the semiconductor substrate and spaced apart from the active area. The input bond pad is electrically connected to a set of gate structures. The device includes a first inductive coil over the semiconductor substrate between a first portion of the source metallization and a second portion of the source metallization and a first capacitor over the semiconductor substrate between the first portion of the source metallization and the second portion of the source metallization. The first inductive coil and the first capacitor are connected in series between the input bond pad and the through-substrate via.

Abstract: Methods for selectively entrapping particles are disclosed. In some embodiments. a method for selectively entrapping particles includes providing a substrate at least partially submerged in a solution including a solute and solvent, where particles are dispersed in the solution. An interfacial layer may be formed on a surface of the substrate from the solute, for example spontaneously. The solute may be a polymer binder. The particles may then be entrapped in the interfacial layer. Thus, the particles may be dispersed in the solution and entrapped out of the solution. Entrapping may include applying a balance of viscous force and centrifugal force to the particles.

Abstract: A device having a reference transistor fabricated within the same semiconductor substrate as a primary transistor (e.g., configured for use in a radiofrequency amplifier or other active circuit) has a shared metallization area coupled to a current terminal of both transistors configured to shield a control terminal of the reference transistor from coupling of alternating current interference from alternating currents within the primary transistor.

Abstract: A transistor includes a semiconductor die with an active region and one or more non-active regions that do not overlap or overlie the active region. The transistor further includes a group of multiple transistor fingers in the active region. One or more source vias are located adjacent to sides of the group of transistor fingers. One or more source manifolds are located in the non-active region(s), and the source manifold(s) electrically connect the source via(s) with at least one source region of the multiple transistor fingers.

Abstract: The present disclosure provides a thermomechanical actuator and a cleaning system implementing the thermomechanical actuator. The thermomechanical actuator includes a solar heat collector (SHC) housing shape memory alloy springs connected between a piston movably disposed therein and one end of the SHC. A cable extending from the piston through an opposite end of the SHC is connected to a bias load that develops returning force on the springs. In presence of solar radiation, the springs contract and cause linear movement of the piston in a direction of contraction and, in absence of the solar radiation, the springs expand and cause linear movement of the piston in direction of expansion. Useful power and work is extracted in form of the cleaning system from such linear movement of the piston.

Abstract: The present disclosure provides a thermomechanical actuator and a cleaning system implementing the thermomechanical actuator. The thermomechanical actuator includes a solar heat collector (SHC) housing shape memory alloy springs connected between a piston movably disposed therein and one end of the SHC. A cable extending from the piston through an opposite end of the SHC is connected to a bias load that develops returning force on the springs. In presence of solar radiation, the springs contract and cause linear movement of the piston in a direction of contraction and, in absence of the solar radiation, the springs expand and cause linear movement of the piston in direction of expansion. Useful power and work is extracted in form of the cleaning system from such linear movement of the piston.

Abstract: Methods and devices for generating a customized video segment from a video are disclosed. The video is partitioned into video segments. For each respective video segment, a respective set of scores is computed, where each score represents a respective content feature in the respective video segment. A respective weighted aggregate score is computed for each respective video segment by applying, to each respective set of scores, a common set of weight values. A selected video segment is outputted as the customized video segment, where the selected video segment is selected from one or more high-ranked video segments having high-ranked weighted aggregate scores.

Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first dielectric layer disposed over the upper surface of the semiconductor substrate, and a first current-carrying electrode and a second current-carrying electrode formed over the semiconductor substrate within openings formed in the first dielectric layer. A control electrode is formed over the semiconductor substrate and disposed between the first current-carrying electrode and a second current-carrying electrode and over the first dielectric layer. A first conductive element is formed over the first dielectric layer, adjacent the control electrode and between the control electrode and the second current-carrying electrode. A second dielectric layer is disposed over the control electrode and over the first conductive element. A second conductive element is disposed over the second dielectric layer and over the first conductive element.

Abstract: The present disclosure provides a thermomechanical actuator and a cleaning system implementing the thermomechanical actuator. The thermomechanical actuator includes a solar heat collector (SHC) housing shape memory alloy springs connected between a piston movably disposed therein and one end of the SHC. A cable extending from the piston through an opposite end of the SHC is connected to a bias load that develops returning force on the springs. In presence of solar radiation, the springs contract and cause linear movement of the piston in a direction of contraction and, in absence of the solar radiation, the springs expand and cause linear movement of the piston in direction of expansion. Useful power and work is extracted in form of the cleaning system from such linear movement of the piston.

Abstract: Embodiments of systems and methods for managing packet transmissions between the base station and a user equipment (UE) may include analyzing, by a base station, one or more conditions of a wireless link between the base station and the UE in response to receiving Web Real-Time Communication (WebRTC) packets for transmission to the UE, such as over the Stream Control Transmission Protocol (SCTP), and selecting a mode for transmitting the WebRTC packets to the UE based on whether the one or more conditions of the wireless link between the base station and the UE meets a respective condition threshold.

Abstract: The present disclosure provides a thermomechanical actuator and a cleaning system implementing the thermomechanical actuator. The thermomechanical actuator includes a solar heat collector (SHC) housing shape memory alloy springs connected between a piston movably disposed therein and one end of the SHC. A cable extending from the piston through an opposite end of the SHC is connected to a bias load that develops returning force on the springs. In presence of solar radiation, the springs contract and cause linear movement of the piston in a direction of contraction and, in absence of the solar radiation, the springs expand and cause linear movement of the piston in direction of expansion. Useful power and work is extracted in form of the cleaning system from such linear movement of the piston.

Abstract: Methods, systems, and media for image searching are described. Images comprising one query image and a plurality of candidate images are received. For each candidate image, a first model similarity measure from an output of a first model configured for scene classification to perceive scenes in the images is determined. Further, for each candidate image of the plurality of candidate images, a second model similarity measure from the output of a second model configured for attribute classification to perceive attributes in the images is determined. For each candidate image of the plurality of candidate images, a similarity agglomerate index of a weighted aggregate of the first model similarity measure and the second model similarity measure is computed. The plurality of candidate images based on the respective similarity agglomerate index of each candidate image are ranked and a first ranked candidate images corresponding to the searched images are generated.

Abstract: An embodiment of a semiconductor device includes a semiconductor substrate, a first dielectric layer disposed over the upper surface of the semiconductor substrate, and a first current-carrying electrode and a second current-carrying electrode formed over the semiconductor substrate within openings formed in the first dielectric layer. A control electrode is formed over the semiconductor substrate and disposed between the first current-carrying electrode and a second current-carrying electrode and over the first dielectric layer. A first conductive element is formed over the first dielectric layer, adjacent the control electrode and between the control electrode and the second current-carrying electrode. A second dielectric layer is disposed over the control electrode and over the first conductive element. A second conductive element is disposed over the second dielectric layer and over the first conductive element.