Abstract: A field-effect-controllable semiconductor component has at least one source zone and at least one drain zone of a first conductivity type, and at least one body zone of a second conductivity type. The body zone is provided between the source zone and the drain zone. In each case at least a first and a second region of the second conductivity type are provided in a channel zone. The first region has a first doping concentration and the second region has a second doping concentration, which is lower than the first doping concentration. The combination of the two regions produces a semiconductor component threshold voltage greater than zero and the on resistance is lower than that merely due to a channel zone doped with the first or second doping concentration.

Abstract: A three-transistor SRAM memory cell includes a bistable field-effect transistor having a fully depleted floating channel region and a hysteretic gate voltage characteristic curve. The bistable field-effect transistor has a gate to be connected to a first bit line for the purpose of writing to the memory cell and a second channel terminal to be connected to a second bit line for the purpose of reading from the memory cell. The two bit lines can be identical. The connection between the bit lines and the bistable transistor can be effected through first and second respective transistors which are each controlled by a respective word line.

Abstract: In its gate region (10), a silicon MOS technology component has a surface structure (6) having edges and/or vertices at which inversion regions, suitable as quantum wires or quantum dots, are preferentially formed when a gate voltage is applied. The surface structure is preferably formed as a silicon pyramid (6) by local molecular beam epitaxy.

Abstract: As a result of deposition from different directions through a mask, a layer can be applied last in a surface-wide form underneath the mask. In this arrangement, the mask is separated by a cavity from the base in the coating region and is firmly joined to it outside the coating region. This process is advantageous, in particular, for the SGFET (suspended-gate field-effect transistor) used as gas sensor. In this process, the mask also forms the gate and the sensitive layer is not subjected to any further process after the deposition. The mask may then remain open or be closed by depositing such a large amount that the openings in the mask are grown over laterally, or by depositing an additional layer at an oblique angle. This process is also suitable for producing micromechanical membranes.

Abstract: A method for manufacturing an electrically conductive tip for field emission cathodes of vacuum electronic components includes forming the tip of doped silicon by molecular beam epitaxy of doped silicon through an opening of a mask and onto a substrate of monocrystalline silicon. The molecular beam epitaxy also produces a doped silicon layer on the surface of the mask.

Abstract: Vapor sources for vacuum evaporators in which the evaporation rate has hitherto been adjusted by varying the temperature of the vessel containing the evaporative substances, have a very large time constant, and an approximately exponential control characteristic. The invention substantially reduces the time constant in an effusion evaporator cell by providing that the rate is adjusted by means of a mechanical slide, preferably of boron nitride or graphite, placed in front of the vapor escape aperture or apertures of the evaporator vessel.

Abstract: A field effect transistor includes a semiconductor substrate of a first conductivity having a source zone and a drain zone of an opposite, second conductivity spaced apart therein and extending to the surface thereof. A surface channel adjoins the surface, is of the second conductivity, and extends in an area located between the source and drain zones. A gate electrode is carried above the surface channel, either on an insulator, or directly on the surface to form a Schottky junction. A second zone lies beneath the surface below or in overlapping relation to the surface channel and extends between the drain and source zones. The second channel is doped with dopant particles whose energy level in the forbidden band of the semiconductor substrate, at an operating temperature T, lies at a distance of more than 1/2 kT from the conduction band edge and valence band edge of the semiconductor substrate.

Abstract: A magnetic field sensitive diode including a silicon body, an n-injecting contact electrode and a p-injecting contact electrode located at spaced portions of the body, the body having opposed parallel surfaces having different recombination rates with respect to pairs of free charge carriers, the surface having the lower recombination rate consisting of silicon dioxide, the n-injecting contact electrode consisting of diffused in lithium, with substantially all of the acceptors in the silicon body being compensated by incorporated lithium ions, the silicon dioxide surfaces being essentially free of lithium. The invention also relates to a method of producing the improved structure.