Patents by Inventor Igor Markovsky
Igor Markovsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10623722Abstract: A head-up display system comprises a microprojector, first and second viewer optics, a redirection optic, and an electronic controller. Switchable electronically between first and second optical states, the redirection optic is configured to receive a display image from the microprojector, to convey the display image, in the first optical state, to the first viewer optic, and to convey the display image, in the second optical state, to the second viewer optic. The electronic controller is configured to, during a first interval, switch and maintain the redirection optic in the first optical state and cause the microprojector to form the display image based on first image data. The electronic controller is further configured to, during a second interval, switch and maintain the redirection optic in the second optical state and cause the microprojector to form the display image based on second image data.Type: GrantFiled: May 13, 2016Date of Patent: April 14, 2020Assignee: MICROSOFT TECHNOLOGY LICENSING, LLCInventors: Igor Markovsky, Michael Nikkhoo
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Patent number: 10616999Abstract: A printed circuit board (PCB) incorporates at least one damping layer or section. The at least one damping layer is incorporated in the PCB to absorb vibrations or oscillations that may be conveyed to the PCB. Such vibrations or oscillations may be generated by one or more electrical components coupled to the PCB. The damping layer is disposed to prevent the PCB from audibly vibrating when the electrical components associated with the PCB are caused to vibrate or pulsate under a voltage load.Type: GrantFiled: May 31, 2018Date of Patent: April 7, 2020Assignee: Microsoft Technology Licensing, LLCInventors: Brian J. Toleno, Marianne Elizabeth La Ford, Michael Nikkhoo, Igor Markovsky
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Patent number: 10606083Abstract: A perspiration dissipating support assembly for head-mounted-display (HMD) devices. Variations of the perspiration dissipating support assembly disclosed herein enable supporting forces for an HMD device to be spread over a large portion of a user's head while facilitating dissipation of both liquid perspiration and vapor perspiration via respective dedicated dissipation mechanisms. In some embodiments, the perspiration dissipating support assembly includes a vapor-permeable contact layer that contacts the user's head and a vapor-permeable spacer that provides a Moisture Vapor Transmission Rate on the order of several times greater than that of the vapor-permeable contact layer. The vapor-permeable contact layer may have wicking properties that tend to draw perspiration (e.g., via capillary action resulting from a particular technical-weave pattern) away from the user's head and into the vapor-permeable spacer through which the perspiration evaporates into the ambient environment.Type: GrantFiled: April 27, 2018Date of Patent: March 31, 2020Assignee: Microsoft Technology Licensing, LLCInventors: Tzu-Yuan Lin, Brian J. Toleno, Igor Markovsky, Erin Elizabeth Hurbi, Michael Nikkhoo
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Publication number: 20200057477Abstract: Techniques of managing heat within an electronic device include providing a vapor chamber as an external surface of an electronic device. For example, when the electronic device includes a thin notebook computer (e.g., an “ultrabook”), the vapor chamber may be, in its entirety or at least a part of, the d-case (i.e., the bottom cover or exterior surface of the laptop, opposite the keyboard and/or trackpad when the notebook computer is open). Such a vapor chamber may be very thin (as thin as 0.3 mm), while being about 50% more stiff and 50× more thermally conductive as aluminum, which may be used as the d-case in conventional notebook computers.Type: ApplicationFiled: August 14, 2018Publication date: February 20, 2020Inventors: James Cooper, Kenneth Ryan Loo, Igor Markovsky
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Publication number: 20190377189Abstract: A housing, including mounting features for directly mounted components, is formed by curing carbon fiber reinforced polymer (CFRP) and a molding compound (MC) such as a sheet molding compound (SMC) or a bulk molding compound (BMC). SMC or BMC may be used depending on the implementation. This forms a housing with mounting features in a thermoset manner, in which the weight of a product such as a head mounted display (which incorporates the housing comprising the mounting features) is reduced, and any orientation issues or problems are significantly reduced.Type: ApplicationFiled: June 11, 2018Publication date: December 12, 2019Inventors: Brian J. TOLENO, Igor MARKOVSKY, Michael NIKKHOO, Joseph Daniel TAYLOR, Michael Neil BEERMAN, Marianne Elizabeth LAFORD
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Publication number: 20190373717Abstract: A printed circuit board (PCB) incorporates at least one damping layer or section. The at least one damping layer is incorporated in the PCB to absorb vibrations or oscillations that may be conveyed to the PCB. Such vibrations or oscillations may be generated by one or more electrical components coupled to the PCB. The damping layer is disposed to prevent the PCB from audibly vibrating when the electrical components associated with the PCB are caused to vibrate or pulsate under a voltage load.Type: ApplicationFiled: May 31, 2018Publication date: December 5, 2019Inventors: Brian J. TOLENO, Marianne Elizabeth LA FORD, Michael NIKKHOO, Igor MARKOVSKY
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Publication number: 20190353431Abstract: A thermodynamic system includes a compensational wick geometry to enhance fluid flow between a condenser region and an evaporator region. Geometric features are modulated between a condenser region and an evaporator region to increase capillary forces within wicking structures without excessively increasing hydraulic resistance to the liquid flowing through these return-path wicking structures. The thermodynamic system may include a liquid flow path having channels extending from the condenser region to the evaporator region. At various segments of the channels, individual cavity sizes are reduced to induce capillary action toward the evaporator region. Various geometric features compensate for these cavity size reductions, to mitigate the effects of increased resistances to liquid flow.Type: ApplicationFiled: May 18, 2018Publication date: November 21, 2019Inventors: Shahar BEN-MENAHEM, Igor MARKOVSKY, Tzu-Yuan LIN, Michael NIKKHOO
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Publication number: 20190353901Abstract: A pad shape for a support assembly is optimized to provide universal fitting characteristics to Head-Mounted Display (HMD) devices. The pad shape enables a display of a single HMD device to be reliably aligned within multiple users' fields-of-view notwithstanding significant variations of shape and size between these users' heads. Optimal positioning of the display within the multiple users' fields-of-view may be achieved by positionally constraining the HMD device against a portion of the head that varies relatively slightly as compared to other portions of the head. The contact pad includes a curved region having a shape defined by a high order polynomial that corresponds to an empirically determined best fit surface. Empirically determining one or both of the best fit surface or the high order polynomial may include aligning a plurality of “forehead” point clouds that map the geometries of a sample set of users' foreheads.Type: ApplicationFiled: May 18, 2018Publication date: November 21, 2019Inventors: Igor MARKOVSKY, Shahar BEN-MENAHEM, Michael NIKKHOO, Tzu-Yuan LIN
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Publication number: 20190331928Abstract: A perspiration dissipating support assembly for head-mounted-display (HMD) devices. Variations of the perspiration dissipating support assembly disclosed herein enable supporting forces for an HMD device to be spread over a large portion of a user's head while facilitating dissipation of both liquid perspiration and vapor perspiration via respective dedicated dissipation mechanisms. In some embodiments, the perspiration dissipating support assembly includes a vapor-permeable contact layer that contacts the user's head and a vapor-permeable spacer that provides a Moisture Vapor Transmission Rate on the order of several times greater than that of the vapor-permeable contact layer. The vapor-permeable contact layer may have wicking properties that tend to draw perspiration (e.g., via capillary action resulting from a particular technical-weave pattern) away from the user's head and into the vapor-permeable spacer through which the perspiration evaporates into the ambient environment.Type: ApplicationFiled: April 27, 2018Publication date: October 31, 2019Inventors: Tzu-Yuan LIN, Brian J. TOLENO, Igor MARKOVSKY, Erin Elizabeth HURBI, Michael NIKKHOO
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Patent number: 10375845Abstract: Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions.Type: GrantFiled: January 6, 2017Date of Patent: August 6, 2019Assignee: Microsoft Technology Licensing, LLCInventors: Erin Elizabeth Hurbi, Michael Nikkhoo, Igor Markovsky, Brian Joseph Toleno
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Patent number: 10187977Abstract: An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.Type: GrantFiled: June 29, 2015Date of Patent: January 22, 2019Assignee: MICROSOFT TECHNOLOGY LICENSING, LLCInventors: Igor Markovsky, Michael Nikkhoo, Andriy Pletenetskyy, Erin Hurbi
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Patent number: 10156726Abstract: The examples disclosed herein are related to graphene-based materials on see-through optical displays. One example provides, a computing device, including a see-through display system including an optical component through which a surrounding environment is viewable, an electrical component disposed on a user-facing side of the optical component, and a graphene-based layer disposed on the optical component, the graphene-based layer comprising a greater thickness of a graphene-based material on a portion closer to the electrical component and a lesser thickness of a graphene-based material on a portion farther from the electrical component.Type: GrantFiled: June 29, 2015Date of Patent: December 18, 2018Assignee: MICROSOFT TECHNOLOGY LICENSING, LLCInventors: Erin Hurbi, Igor Markovsky, Michael Nikkhoo
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Publication number: 20180341286Abstract: Disclosed is a fit system for improving users' comfort with wearable articles, such as head-worn articles. The fit system includes a lattice of collapsible beams that can be constructed of elastomer foam located at the interface between the wearable article and a part of the user's body. The collapsible beam construction provides a non-linear relationship between the amount of force or pressure applied on the body part and the amount of compression of the foam.Type: ApplicationFiled: May 23, 2017Publication date: November 29, 2018Inventors: Igor MARKOVSKY, Tzu-Yuan LIN, Vijay BOOVARAGAVAN, Michael NIKKHOO, Brian TOLENO
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Patent number: 10080317Abstract: An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component.Type: GrantFiled: June 29, 2016Date of Patent: September 18, 2018Assignee: Microsoft Technology Licensing, LLCInventors: Brian J. Toleno, Igor Markovsky
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Publication number: 20180199455Abstract: Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions.Type: ApplicationFiled: January 6, 2017Publication date: July 12, 2018Inventors: Erin Elizabeth Hurbi, Michael Nikkhoo, Igor Markovsky, Brian Joseph Toleno
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Publication number: 20180053630Abstract: The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.Type: ApplicationFiled: October 25, 2017Publication date: February 22, 2018Inventors: Kartik Ramaswamy, Igor Markovsky, Zhijang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
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Publication number: 20180007818Abstract: An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component.Type: ApplicationFiled: June 29, 2016Publication date: January 4, 2018Inventors: Brian J. TOLENO, Igor MARKOVSKY
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Publication number: 20170343418Abstract: An apparatus including a palette body, a plurality of heat distribution plates mounted on the body and positioned adjacent each other, a plurality of insulators positioned intermediate the adjacently positioned heat distribution plates, and a plurality of thermal camera calibration reference swatches including a near-ideal blackbody reference swatch, a diffuse reflective reference swatch, and a first material of the device under testing reference swatch, each reference swatch being mounted on a corresponding one of the heat distribution plates and thermally insulated from other reference swatches by the insulators.Type: ApplicationFiled: May 27, 2016Publication date: November 30, 2017Inventors: Erin Hurbi, Michael Nikkhoo, Igor Markovsky, Shahar Ben-Menahem
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Patent number: 9824862Abstract: The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.Type: GrantFiled: November 20, 2014Date of Patent: November 21, 2017Assignee: Applied Materials, Inc.Inventors: Kartik Ramaswamy, Igor Markovsky, Zhigang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
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Publication number: 20170332070Abstract: A head-up display system comprises a microprojector, first and second viewer optics, a redirection optic, and an electronic controller. Switchable electronically between first and second optical states, the redirection optic is configured to receive a display image from the microprojector, to convey the display image, in the first optical state, to the first viewer optic, and to convey the display image, in the second optical state, to the second viewer optic. The electronic controller is configured to, during a first interval, switch and maintain the redirection optic in the first optical state and cause the microprojector to form the display image based on first image data. The electronic controller is further configured to, during a second interval, switch and maintain the redirection optic in the second optical state and cause the microprojector to form the display image based on second image data.Type: ApplicationFiled: May 13, 2016Publication date: November 16, 2017Inventors: Igor Markovsky, Michael Nikkhoo