Patents by Inventor Igor Markovsky

Igor Markovsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200341584
    Abstract: A method includes: placing a first physical object at each of a first plurality of locations on a trackpad; while the first object is at each of the first plurality of locations, registering respective first readings from each of a second plurality of force sensors of the trackpad, the first plurality greater than the second plurality; selecting a first plurality of sensitivity parameters for the trackpad based at least in part on the first readings; and providing the first plurality of sensitivity parameters to force sensing circuitry of the trackpad, the force sensing circuitry coupled to the second plurality of force sensors.
    Type: Application
    Filed: April 29, 2019
    Publication date: October 29, 2020
    Inventors: Jianxun Wang, Igor Markovsky, Debanjan Mukherjee
  • Patent number: 10782534
    Abstract: A Near-Eye-Display (NED) device having a housing shell that is integrated with molded boss clusters for precision mounting of hardware components. The techniques disclosed herein include forming a housing shell directly over one or more pre-molded boss clusters that have been inserted into cavities of a housing shell mold core. For example, with the pre-molded boss clusters already inserted into the cavities, a selected housing shell material such as a thermosetting epoxy resin impregnated carbon fiber reinforced (CFRP) fabric may be thermal compression molded over the housing shell mold core. Individual ones of the pre-molded boss clusters include one or more “three-dimensional (3D)” bosses for mounting various hardware components of the NED device. The bosses may protrude from an inner surface of the housing shell and may provide interior mounting features without affecting the appearance of the outer surface of the housing shell.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: September 22, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Brian J. Toleno, Michael Nikkhoo, Michael Neil Beerman, Marianne E. Laford, Igor Markovsky, Simon Hodgson
  • Patent number: 10623722
    Abstract: A head-up display system comprises a microprojector, first and second viewer optics, a redirection optic, and an electronic controller. Switchable electronically between first and second optical states, the redirection optic is configured to receive a display image from the microprojector, to convey the display image, in the first optical state, to the first viewer optic, and to convey the display image, in the second optical state, to the second viewer optic. The electronic controller is configured to, during a first interval, switch and maintain the redirection optic in the first optical state and cause the microprojector to form the display image based on first image data. The electronic controller is further configured to, during a second interval, switch and maintain the redirection optic in the second optical state and cause the microprojector to form the display image based on second image data.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: April 14, 2020
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Igor Markovsky, Michael Nikkhoo
  • Patent number: 10616999
    Abstract: A printed circuit board (PCB) incorporates at least one damping layer or section. The at least one damping layer is incorporated in the PCB to absorb vibrations or oscillations that may be conveyed to the PCB. Such vibrations or oscillations may be generated by one or more electrical components coupled to the PCB. The damping layer is disposed to prevent the PCB from audibly vibrating when the electrical components associated with the PCB are caused to vibrate or pulsate under a voltage load.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: April 7, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Brian J. Toleno, Marianne Elizabeth La Ford, Michael Nikkhoo, Igor Markovsky
  • Patent number: 10606083
    Abstract: A perspiration dissipating support assembly for head-mounted-display (HMD) devices. Variations of the perspiration dissipating support assembly disclosed herein enable supporting forces for an HMD device to be spread over a large portion of a user's head while facilitating dissipation of both liquid perspiration and vapor perspiration via respective dedicated dissipation mechanisms. In some embodiments, the perspiration dissipating support assembly includes a vapor-permeable contact layer that contacts the user's head and a vapor-permeable spacer that provides a Moisture Vapor Transmission Rate on the order of several times greater than that of the vapor-permeable contact layer. The vapor-permeable contact layer may have wicking properties that tend to draw perspiration (e.g., via capillary action resulting from a particular technical-weave pattern) away from the user's head and into the vapor-permeable spacer through which the perspiration evaporates into the ambient environment.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: March 31, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Tzu-Yuan Lin, Brian J. Toleno, Igor Markovsky, Erin Elizabeth Hurbi, Michael Nikkhoo
  • Publication number: 20200057477
    Abstract: Techniques of managing heat within an electronic device include providing a vapor chamber as an external surface of an electronic device. For example, when the electronic device includes a thin notebook computer (e.g., an “ultrabook”), the vapor chamber may be, in its entirety or at least a part of, the d-case (i.e., the bottom cover or exterior surface of the laptop, opposite the keyboard and/or trackpad when the notebook computer is open). Such a vapor chamber may be very thin (as thin as 0.3 mm), while being about 50% more stiff and 50× more thermally conductive as aluminum, which may be used as the d-case in conventional notebook computers.
    Type: Application
    Filed: August 14, 2018
    Publication date: February 20, 2020
    Inventors: James Cooper, Kenneth Ryan Loo, Igor Markovsky
  • Patent number: 10375845
    Abstract: Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: August 6, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Erin Elizabeth Hurbi, Michael Nikkhoo, Igor Markovsky, Brian Joseph Toleno
  • Patent number: 10187977
    Abstract: An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: January 22, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Igor Markovsky, Michael Nikkhoo, Andriy Pletenetskyy, Erin Hurbi
  • Patent number: 10156726
    Abstract: The examples disclosed herein are related to graphene-based materials on see-through optical displays. One example provides, a computing device, including a see-through display system including an optical component through which a surrounding environment is viewable, an electrical component disposed on a user-facing side of the optical component, and a graphene-based layer disposed on the optical component, the graphene-based layer comprising a greater thickness of a graphene-based material on a portion closer to the electrical component and a lesser thickness of a graphene-based material on a portion farther from the electrical component.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: December 18, 2018
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Erin Hurbi, Igor Markovsky, Michael Nikkhoo
  • Patent number: 10080317
    Abstract: An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: September 18, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Brian J. Toleno, Igor Markovsky
  • Publication number: 20180199455
    Abstract: Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions.
    Type: Application
    Filed: January 6, 2017
    Publication date: July 12, 2018
    Inventors: Erin Elizabeth Hurbi, Michael Nikkhoo, Igor Markovsky, Brian Joseph Toleno
  • Publication number: 20180053630
    Abstract: The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.
    Type: Application
    Filed: October 25, 2017
    Publication date: February 22, 2018
    Inventors: Kartik Ramaswamy, Igor Markovsky, Zhijang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
  • Publication number: 20170343418
    Abstract: An apparatus including a palette body, a plurality of heat distribution plates mounted on the body and positioned adjacent each other, a plurality of insulators positioned intermediate the adjacently positioned heat distribution plates, and a plurality of thermal camera calibration reference swatches including a near-ideal blackbody reference swatch, a diffuse reflective reference swatch, and a first material of the device under testing reference swatch, each reference swatch being mounted on a corresponding one of the heat distribution plates and thermally insulated from other reference swatches by the insulators.
    Type: Application
    Filed: May 27, 2016
    Publication date: November 30, 2017
    Inventors: Erin Hurbi, Michael Nikkhoo, Igor Markovsky, Shahar Ben-Menahem
  • Patent number: 9824862
    Abstract: The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: November 21, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Kartik Ramaswamy, Igor Markovsky, Zhigang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
  • Publication number: 20170332070
    Abstract: A head-up display system comprises a microprojector, first and second viewer optics, a redirection optic, and an electronic controller. Switchable electronically between first and second optical states, the redirection optic is configured to receive a display image from the microprojector, to convey the display image, in the first optical state, to the first viewer optic, and to convey the display image, in the second optical state, to the second viewer optic. The electronic controller is configured to, during a first interval, switch and maintain the redirection optic in the first optical state and cause the microprojector to form the display image based on first image data. The electronic controller is further configured to, during a second interval, switch and maintain the redirection optic in the second optical state and cause the microprojector to form the display image based on second image data.
    Type: Application
    Filed: May 13, 2016
    Publication date: November 16, 2017
    Inventors: Igor Markovsky, Michael Nikkhoo
  • Patent number: 9726962
    Abstract: The techniques disclosed herein provide an enhanced mount for a camera module. The mount comprises at least a first side and a second side. The sides are formed to enable contact with at least a portion of the camera module. The sides are configured with openings to enable a fastening material, such as an adhesive, to secure the camera module to the mount. Openings within the mount enable the use of a fastening material to secure the camera module to at least one surface of the mount while allowing the camera module and at least one surface to maintain the mechanical contact. In some configurations, one or more openings are formed such that a contraction of the fastening material pulls the camera module toward at least one surface of the mount.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: August 8, 2017
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Ravi Nalla, Michael Nikkhoo, Igor Markovsky
  • Publication number: 20160377872
    Abstract: The examples disclosed herein are related to graphene-based materials on see-through optical displays. One example provides, a computing device, including a see-through display system including an optical component through which a surrounding environment is viewable, an electrical component disposed on a user-facing side of the optical component, and a graphene-based layer disposed on the optical component, the graphene-based layer comprising a greater thickness of a graphene-based material on a portion closer to the electrical component and a lesser thickness of a graphene-based material on a portion farther from the electrical component.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Erin Hurbi, Igor Markovsky, Michael Nikkhoo
  • Publication number: 20160381790
    Abstract: An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Igor Markovsky, Michael Nikkhoo, Andriy Pletenetskyy, Erin Hurbi
  • Publication number: 20160375600
    Abstract: Examples are disclosed that relate to heat-based cutting of an adhesive joint of a device. One disclosed example provides a device, comprising an adhesive joint connecting a first component and a second component via an adhesive layer, and a cutting affordance incorporated within the device and positioned within the adhesive joint or adjacent the adhesive joint.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Igor Markovsky, Michael Nikkhoo, Scott Francis Fullam
  • Publication number: 20150075719
    Abstract: The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.
    Type: Application
    Filed: November 20, 2014
    Publication date: March 19, 2015
    Inventors: Kartik Ramaswamy, Igor Markovsky, Zhigang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye