Patents by Inventor Igor Markovsky

Igor Markovsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8920597
    Abstract: The disclosure pertains to a capactively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a folded structure and symmetrical power distribution.
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: December 30, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Kartik Ramaswamy, Igor Markovsky, Zhigang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
  • Publication number: 20120043023
    Abstract: The disclosure pertains to a capactively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a folded structure and symmetrical power distribution.
    Type: Application
    Filed: March 14, 2011
    Publication date: February 23, 2012
    Applicant: Applied Materials, Inc.
    Inventors: Kartik Ramaswamy, Igor Markovsky, Zhigang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
  • Publication number: 20110151590
    Abstract: A method, a system and a computer readable medium for integrated in-vacuo repair of low-k dielectric thin films damaged by etch and/or strip processing. A repair chamber is integrated onto a same platform as a plasma etch and/or strip chamber to repair a low-k dielectric thin film without breaking vacuum between the damage event and the repair event. UV radiation may be provided on the integrated etch/repair platform in any combination of before, after, or during the low-k repair treatment to increase efficacy of the repair treatment and/or stability of repair.
    Type: Application
    Filed: July 29, 2010
    Publication date: June 23, 2011
    Applicant: Applied Materials, Inc.
    Inventors: James D. Carducci, Srinivas D. Nemani, Hairong Tang, Hui Sun, Igor Markovsky, Ezra R. Gold, Iwalani S. Kaya, Ellie Y. Yieh, Chunlei Zhang, Kenneth S. Collins, Michael D. Armacost, Ajit Balakrishna, Thorsten B. Lill