Abstract: The techniques disclosed herein provide an enhanced mount for a camera module. The mount comprises at least a first side and a second side. The sides are formed to enable contact with at least a portion of the camera module. The sides are configured with openings to enable a fastening material, such as an adhesive, to secure the camera module to the mount. Openings within the mount enable the use of a fastening material to secure the camera module to at least one surface of the mount while allowing the camera module and at least one surface to maintain the mechanical contact. In some configurations, one or more openings are formed such that a contraction of the fastening material pulls the camera module toward at least one surface of the mount.

Abstract: An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap.

Abstract: The examples disclosed herein are related to graphene-based materials on see-through optical displays. One example provides, a computing device, including a see-through display system including an optical component through which a surrounding environment is viewable, an electrical component disposed on a user-facing side of the optical component, and a graphene-based layer disposed on the optical component, the graphene-based layer comprising a greater thickness of a graphene-based material on a portion closer to the electrical component and a lesser thickness of a graphene-based material on a portion farther from the electrical component.

Abstract: Examples are disclosed that relate to heat-based cutting of an adhesive joint of a device. One disclosed example provides a device, comprising an adhesive joint connecting a first component and a second component via an adhesive layer, and a cutting affordance incorporated within the device and positioned within the adhesive joint or adjacent the adhesive joint.

Abstract: The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.

Abstract: The disclosure pertains to a capactively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a folded structure and symmetrical power distribution.

Abstract: The disclosure pertains to a capactively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a folded structure and symmetrical power distribution.

Abstract: A method, a system and a computer readable medium for integrated in-vacuo repair of low-k dielectric thin films damaged by etch and/or strip processing. A repair chamber is integrated onto a same platform as a plasma etch and/or strip chamber to repair a low-k dielectric thin film without breaking vacuum between the damage event and the repair event. UV radiation may be provided on the integrated etch/repair platform in any combination of before, after, or during the low-k repair treatment to increase efficacy of the repair treatment and/or stability of repair.