Abstract: This disclosure provides systems, methods and apparatus including a power generating and a power saving device having a plurality of shutters and a plurality of photovoltaic (PV) devices. In one aspect, each of the plurality of shutters is configured to move laterally in the plane of the shutter by the action of one or more electrostatic actuators. The array of shutters can control the amount of ambient light that is transmitted through the device. Additionally, the array of shutters can shield or expose the array of the PV devices to ambient sunlight to generate PV power.

Abstract: This disclosure provides systems, methods and apparatus for electromechanical systems (EMS) device packages having integrated sensors. In one aspect, electrodes within a packaged EMS device can be used in conjunction with an electrode disposed on another substrate within the EMS device package to form one or more capacitive sensors. The capacitive sensor may be used to determine the relative deformation of substrates within the EMS device package, which can in turn be used as part of a pressure, touch, mass, or impact measuring system.

Abstract: This disclosure provides systems, methods and apparatus for mitigating or reducing stiction in electromechanical systems devices. The systems and methods described herein include a piezo-electric layer disposed over at least a portion of the deformable region of the electromechanical systems devices. To reduce or mitigate stiction, a restorative mechanical force is generated by reverse piezo-electric effect to return the deformable region of the electromechanical systems devices to the un-deformed state.

Abstract: A method and system for providing a MEMS device with a portion exposed to an outside environment are disclosed. The method comprises bonding a handle wafer to a device wafer to form a MEMS substrate with a dielectric layer disposed between the handle and device wafers. The method includes lithographically defining at least one standoff on the device wafer and bonding the at least one standoff to an integrated circuit substrate to form a sealed cavity between the MEMS substrate and the integrated circuit substrate. The method includes defining at least one opening in the handle wafer, standoff, or integrated circuit substrate to expose a portion of the to expose a portion of the device wafer to the outside environment.

Abstract: A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.

Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

Abstract: Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration.

Abstract: The displacement sensor employing a magnetoresistive effect laminate structure consisting of a bottom ferromagnetic layer with a field oriented in one direction, a middle non-magnetic layer, and a top softer magnetic layer. The top softer magnetic layer has two regions of opposing magnetic fields separated by a domain wall, where the magnetic field in one region is aligned with the bottom layer magnetic field. The resistance of the laminate structure changes as the location of the domain wall changes. In one improvement, the domain wall is induced by a pair of opposing semicylindrical magnets magnetized along their semicylindrical surface, forming parallel field lines and leading to a stronger domain wall. In another improvement, there are four laminate structures in an electrical bridge configuration. The bridge is excited by an alternating current source and the output is synchronously measured.