Abstract: A swing body engages with a driving end roller of a linearly moved driving slider at a driving end section. The swing body engages with a guide groove in a driven slider at a driven end section. The driven slider is coupled to a gap filler plate by a driven end roller changeable in installation position in a predetermined direction. A gap filler has an inverse motion preventive structure that, when the gap filler plate is in either a fully protruded state or a fully stored state, enables only forward motion transfer from the driving slider to the swing body. The guide groove is formed in a direction orthogonal or almost orthogonal to forward and backward movement directions of the gap filler plate. The predetermined direction and the direction of the guide groove are parallel to each other in the fully stored state.

Abstract: A first link mechanism section converts linear motion of a driving slider into swing motion of a swing end roller. A second link mechanism section swings in cooperation with the swing end roller on a roller contact surface of a second link lever section, and an output end roller changeable in attachment position presses a driven slider fixed to a gap filler plate. In a fully protruded state and a fully stored state of the gap filler plate, the direction of acting force of the roller contact surface pressing the swing end roller aligns with a straight line connecting the swing end roller and a swing shaft of a first link lever section.

Abstract: A first link mechanism section converts linear motion of a driving slider into swing motion of a swing end roller, and swings the swing end roller in cooperation with a second link mechanism section. An output end roller of the second link mechanism section engages in a guide groove in a driven slider fixed to a gap filler plate to move the gap filler plate linearly. In a fully protruded state and a fully stored state of the gap filler plate, the direction of acting force of the roller contact surface pressing the swing end roller aligns with a straight line connecting the swing end roller and a swing shaft of a first link lever section to act as a lock. The guide groove is formed orthogonal or almost orthogonal to movement directions of the gap filler plate.

Abstract: A swing body engages with a driving end roller of a linearly moved driving slider at a driving end section. The swing body engages with a guide groove in a driven slider at a driven end section. The driven slider is coupled to a gap filler plate by a driven end roller changeable in installation position in a predetermined direction. A gap filler has an inverse motion preventive structure that, when the gap filler plate is in either a fully protruded state or a fully stored state, enables only forward motion transfer from the driving slider to the swing body. The guide groove is formed in a direction orthogonal or almost orthogonal to forward and backward movement directions of the gap filler plate. The predetermined direction and the direction of the guide groove are parallel to each other in the fully stored state.

Abstract: A first link mechanism section converts linear motion of a driving slider into swing motion of a swing end roller. A second link mechanism section swings in cooperation with the swing end roller on a roller contact surface of a second link lever section, and an output end roller changeable in attachment position presses a driven slider fixed to a gap filler plate. In a fully protruded state and a fully stored state of the gap filler plate, the direction of acting force of the roller contact surface pressing the swing end roller aligns with a straight line connecting the swing end roller and a swing shaft of a first link lever section.

Abstract: A first link mechanism section converts linear motion of a driving slider into swing motion of a swing end roller, and swings the swing end roller in cooperation with a second link mechanism section. An output end roller of the second link mechanism section engages in a guide groove in a driven slider fixed to a gap filler plate to move the gap filler plate linearly. In a fully protruded state and a fully stored state of the gap filler plate, the direction of acting force of the roller contact surface pressing the swing end roller aligns with a straight line connecting the swing end roller and a swing shaft of a first link lever section to act as a lock. The guide groove is formed orthogonal or almost orthogonal to movement directions of the gap filler plate.

Abstract: A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.

Abstract: Disclosed is a connection sheet for a solar battery cell electrode, which is a polymer sheet for use in the connection between an electrode for extracting an electric power from a solar battery cell and a wiring member through an electrically conductive adhesive material by heating and pressurizing, and which is intercalated between a heating/pressurizing member and the wiring member upon use.

Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler.

Abstract: Disclosed is a connection sheet for a solar battery cell electrode, which is a polymer sheet for use in the connection between an electrode for extracting an electric power from a solar battery cell and a wiring member through an electrically conductive adhesive material by heating and pressurizing, and which is intercalated between a heating/pressurizing member and the wiring member upon use.

Abstract: A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.

Abstract: This invention relates to a suitable electrostatic chuck to hold a substrate during the manufacture of a semiconductor integrated circuit having excellent cooling performance and insulation performance, and a low level of particulate generation, which is comprised of an electrostatic chuck, comprising a metal substrate, a first insulating layer of silicone rubber formed directly or via an adhesive layer on the metal substrate and having a thermal conductivity of 0.5 W/mK or more, an electrically conducting pattern formed directly or via an adhesive layer on this first insulating layer, a second insulating layer of an insulating polyimide film formed directly or via an adhesive layer on this electrically conducting pattern, and a third insulating layer formed directly or via an adhesive layer on this second insulating layer, wherein this third insulating layer is a silicone rubber containing reinforcing silica, this layer not containing any thermally conductive filler having an average particle size of 0.

Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

Abstract: An electrostatic chuck comprises an insulating layer with an electrode embedded therein and having a surface to come in contact with a workpiece to be held. Formed on the insulating layer surface is a silicone rubber layer which is filled with reinforcing silica, but free of another filler having an average particle size of at least 0.5 ?m. The ESC allows for an intimate contact with a wafer and has an improved cooling capacity.

Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

Abstract: This invention relates to a suitable electrostatic chuck to hold a substrate during the manufacture of a semiconductor integrated circuit having excellent cooling performance and insulation performance, and a low level of particulate generation, which is comprised of an electrostatic chuck, comprising a metal substrate, a first insulating layer of silicone rubber formed directly or via an adhesive layer on the metal substrate and having a thermal conductivity of 0.5 W/mK or more, an electrically conducting pattern formed directly or via an adhesive layer on this first insulating layer, a second insulating layer of an insulating polyimide film formed directly or via an adhesive layer on this electrically conducting pattern, and a third insulating layer formed directly or via an adhesive layer on this second insulating layer, wherein this third insulating layer is a silicone rubber containing reinforcing silica, this layer not containing any thermally conductive filler having an average particle size of 0.

Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler.

Abstract: An electrostatic chuck comprises an insulating layer with an electrode embedded therein and having a surface to come in contact with a workpiece to be held. Formed on the insulating layer surface is a silicone rubber layer which is filled with reinforcing silica, but free of another filler having an average particle size of at least 0.5 ?m. The ESC allows for an intimate contact with a wafer and has an improved cooling capacity.

Abstract: An electromagnetic wave-absorbing composition is obtained by dispersing in a base polymer a magnetic powder coated with electrically insulating inorganic fines and optionally, a heat conductive powder. The composition has a high breakdown voltage, and can be applied to any adequate site within electronic equipment without a need to pay substantial attention to short-circuits.