Abstract: An electromagnetic wave (EM) absorber is constructed by integrally laminating an EM-absorbing layer having an EM-absorbing filler dispersed in a silicone resin on at least one surface of an EM-reflecting layer having an electrically conductive filler dispersed in a silicone resin. It has satisfactory EM-absorbing and shielding abilities and is workable, flexible, weather resistant and heat resistant due to the nature of the silicone resin itself. The use of the silicone resin in both the EM-absorbing and reflecting layers ensures that a firm bond is established between the layers. In a preferred embodiment wherein a heat conductive filler is blended, the absorber has a satisfactory heat transfer ability as well.

Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Abstract: An electromagnetic wave-absorbing composition is obtained by dispersing in a base polymer a magnetic powder coated with electrically insulating inorganic fines and optionally, a heat conductive powder. The composition has a high breakdown voltage, and can be applied to any adequate site within electronic equipment without a need to pay substantial attention to short-circuits.

Abstract: A silicone rubber composition comprising a soft magnetic powder, an optional heat conductive powder, and a surface treating agent selected from (a) an organopolysiloxane containing at least one alkoxy radical, hydroxyl radical or functional organic radical in a molecule, (b) a titanate coupling agent, and (c) an aluminum coupling agent is easily workable and flexible and has an ability to absorb electromagnetic waves and optionally, a heat transfer ability. Placement of the composition in an electronic equipment suppresses electromagnetic noise.

Abstract: An electromagnetic wave (EM) absorber is constructed by integrally laminating an EM-absorbing layer having an EM-absorbing filler dispersed in a silicone resin on at least one surface of an EM-reflecting layer having an electrically conductive filler dispersed in a silicone resin. It has satisfactory EM-absorbing and shielding abilities and is workable, flexible, weather resistant and heat resistant due to the nature of the silicone resin itself. The use of the silicone resin in both the EM-absorbing and reflecting layers ensures that a firm bond is established between the layers. In a preferred embodiment wherein a heat conductive filler is blended, the absorber has a satisfactory heat transfer ability as well.

Abstract: A silicone rubber composition comprising a soft magnetic powder, an optional heat conductive powder, and a surface treating agent selected from (a) an organopolysiloxane containing at least one alkoxy radical, hydroxyl radical or functional organic radical in a molecule, (b) a titanate coupling agent, and (c) an aluminum coupling agent is easily workable and flexible and has an ability to absorb electromagnetic waves and optionally, a heat transfer ability. Placement of the composition in an electronic equipment suppresses electromagnetic noise.

Abstract: There is disclosed a jig for producing a pellicle comprising a support frame having an opening, and an adhesive layer provided at periphery of the opening, wherein the adhesive layer is composed of a polymer material having a glass transition temperature within a range of 0° C. to 300° C. The jig of the present invention can be repeatedly used without reforming the adhesive layer after use.