Abstract: A method of forming a silicon oxide film, comprising the steps of: —providing a treatment substrate within a reaction chamber; —purging the gas within the reaction chamber by feeding an inert gas into the chamber under reduced pressure at a substrate temperature of 50 to 4000 C, —adsorbing, at the same temperatures and under reduced pressure, a silicon compound on the treatment substrate by pulsewise introduction of a gaseous silicon compound into the reaction chamber, —purging, at the same temperatures and under reduced pressure, the unadsorbed silicon compound in the reaction chamber with an inert gas, —at the same temperatures and under reduced pressure, introducing a pulse of ozone-containing mixed gas into the reaction chamber and producing silicon oxide by an oxidation reaction with the silicon compound adsorbed on the treatment substrate; and—repeating steps 1) to 4) if necessary to obtain the desired thickness on the substrate.

Abstract: The invention provides a molding die in which a whole or a part of an exclusive portion forming a cavity can be swiftly changed while leaving a general portion in a molding machine. A fixed insert, a movable insert, a pressing plate and a slide core which correspond to an exclusive portion can be automatically attached to and detached from a fixed main die, a movable main die, a pressing rod and a slide holder which correspond to a general portion by an attaching and detaching mechanism. Further, the fixed insert, the movable insert, the pressing plate and the slide core can be integrated in a die close state by a connection mechanism.

Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Abstract: An abnormality detection circuit detects abnormality relating to ground fault in secondary winding circuitry of transformer, non-grounding fault of transformer assembly casing or false connection of the AC power source to the transformer assembly in reverse polarity. An interrupter circuit turns a switch off in response to detection of the abnormality by the abnormality detection circuit to interrupt the supply of the AC power to the transformer. When the supply of the AC power is interrupted, the switch is connected to a restart circuit, whereupon the circuit is activated to allow a charging current to flow to a capacitor, which is connected in series in a drive current path of a drive circuit with a time delay on the order of 0.5 to 1.0 second which is determined by a delay circuit thereof. The charging current drives a restoring circuit, which controls the interrupter circuit to its restoring condition temporally so that the switch is turned to its “on” condition only once.

Abstract: The invention provides a molding die in which a whole or a part of an exclusive portion forming a cavity can be swiftly changed while leaving a general portion in a molding machine. A fixed insert, a movable insert, a pressing plate and a slide core which correspond to an exclusive portion can be automatically attached to and detached from a fixed main die, a movable main die, a pressing rod and a slide holder which correspond to a general portion by an attaching and detaching mechanism. Further, the fixed insert, the movable insert, the pressing plate and the slide core can be integrated in a die close state by a connection mechanism.

Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Abstract: An abnormality detection circuit 22 delivers a detected abnormality relating to a transformer 11. An interrupter circuit 23 turns a switch 16 off to interrupt the supply of the power to the transformer 11. When the supply of the power is interrupted, the switch 16 is connected to a restart circuit 31, whereupon the circuit 31 is activated to allow a charging current to flow to a capacitor, which is connected in series in a drive current path of a drive circuit 32 with a time delay on the order of 0.5 to 1.0 second which is determined by a delay circuit thereof. The charging current drives a restoring circuit 33, which controls the interrupter circuit 23 so that the switch 16 is turned on.

Abstract: A method for engraving and/or etching comprising the steps of: (a) a process for exposing, to light, a layer of a water-soluble resin composition of a laminated photo-sensitive film which comprises a supporting sheet, a image mask-protection layer peelablly adhered to the supporting sheet and a layer of a water-soluble resin composition having photocrosslinkability to thus cause crosslinking of the exposed area of the resin layer to thereby form a predetermined pattern on the resin layer; (b) a process for dissolving out the non-crosslinked portion of the layer of the water-soluble photo-sensitive resin composition by developing the layer with water to thus from an image-carrying mask which is constituted from the crosslinked area of the photo-sensitive resin composition remaining on the image mask-protection layer; (c) a process for adhering the photo-sensitive laminate film on which the images are formed to the surface of a material to be processed; (d) a process for peeling off the supporting sheet from th

Abstract: A method for engraving and/or etching comprising the steps of: (a) a process for exposing, to light, a layer of a water-soluble resin composition of a laminated photo-sensitive film which comprises a supporting sheet, a image mask-protection layer peelablly adhered to the supporting sheet and a layer of a water-soluble resin composition having photocrosslinkability to thus cause crosslinking of the exposed area of the resin layer to thereby form a predetermined pattern on the resin layer; (b) a process for dissolving out the non-crosslinked portion of the layer of the water-soluble photo-sensitive resin composition by developing the layer with water to thus from an image-carrying mask which is constituted from the crosslinked area of the photo-sensitive resin composition remaining on the image mask-protection layer; (c) a process for adhering the photo-sensitive laminate film on which the images are formed to the surface of a material to be processed; (d) a process for peeling off the supporting sheet from th

Abstract: A method for engraving and/or etching comprising the steps of: (a) a process for exposing, to light, a layer of a water-soluble resin composition of a laminated photosensitive film which comprises a supporting sheet, a image mask-protection layer peelablly adhered to the supporting sheet and a layer of a water-soluble resin composition having photocrosslinkability to thus cause crosslinking of the exposed area of the resin layer to thereby form a predetermined pattern on the resin layer; (b) a process for dissolving out the non-crosslinked portion of the layer of the water-soluble photo-sensitive resin composition by developing the layer with water to thus from an image-carrying mask which is constituted from the crosslinked area of the photo-sensitive resin composition remaining on the image mask-protection layer; (c) a process for adhering the photo-sensitive laminate film on which the images are formed to the surface of a material to be processed; (d) a process for peeling off the supporting sheet from the

Abstract: A numerical control apparatus for machining non-circular workpieces such as a cam and the like is disclosed. In the present invention, roughing profile data and finishing profile data are generated from lift data regulating the shape of non-circular workpiece. The roughing profile data are obtained from roughing lift data. The roughing lift data are generated as changing smoothly such that the deviation from the lift data regulating the finished shape presents within the tolerance of allowance at finishing, and quadratic differential components related to the rotational angle are smaller than the predetermined value. Machinings are performed by the roughing profile data at roughing and by the finishing profile data at finishing. As a result, the high-speed machinings are possible and the machining cycle time can be shortened.

Abstract: A numerical control apparatus for machining non-circular workpieces such as a cam and the like has been disclosed. The cam and the like are used in changing the operation from rotational to linear motion. In designing the shape of the cam and the like, lift data prescribing the relationship between the rotational and linear motions is used. The lift data is given by the position sequence on the linear motion corresponding to a number of discrete rotational angles. Also, the tolerance of the positions is given from a functional aspect. The lift data is converted into profile data prescribing the shape of the cam and the like after being smoothed within the tolerance by a regression analysis, and machining of the non-circular workpieces is effected according to the profile data.

Abstract: A numerically controlled machine tool for machining a non-circular workpiece according to profile data. The numerical controller of the machine tool memorizes the ideal profile data calculated from the ideal final shape of the workpiece, and the execution profile data calculated from the ideal profile data and compensated for position error due to the follow delay of the machine tool. The machine tool is controlled according to the execution profile data during grinding the workpiece with cut-in feed and spark-out grinding. The numerical controller has the capability of measuring position change of the main spindle and the tool slide during spark-out grinding. Then, the numerical controller ascertains whether or not the follow delays of the main spindle and the tool slide are within a prescribed tolerance depending on the measured position change and the ideal profile data.

Abstract: The corrosion resistance of an insoluble anode for use under high current condition, which anode may be made from iron or copper for example, is improved by coating the anode with an alloy of lead, tin and indium.

Abstract: A method for grinding a work having a cylindrical portion and a couple of shoulder portions extending at right angles from the opposite ends of the cylindrical portion, the method comprising the steps of:(a) rotating the work about the axis of the cylindrical portion;(b) rotating a cylindrical grinding wheel with a width smaller than the space between the shoulder portions of the work about an axis parallel with the axis of the cylindrical portion;(c) feeding the grinding wheel relative to the work along an oblique path inclined to one direction with respect to the rotational axis of the grinding wheel, thereby simultaneously grinding one of the shoulders and a contiguous cylindrical portion; and(d) feeding the grinding wheel relative to the work along an oblique parth inclined to the other direction with respect to the rotational axis of the grinding wheel, thereby simultaneously grinding the other one of the shoulders and the remainder of the cylindrical portion.

Abstract: A grinding machine is provided wherein a pair of wheel slides are disposed respectively at both sides of a work support to be movable toward and away from the work table in a first direction. The wheel slides respectively carry turrets thereon in such a manner that each of the turrets is rotationally indexed about and slidable along an axis thereof extending in a second direction perpendicular to the first direction. Each of the turrets carries a plurality of grinding wheels which are rotatable about respective axes extending in the second direction, and when rotationally indexed selectively presents the grinding wheels to a machining station. The position of a selected one of the grinding wheels relative to a workpiece on the work support is adjusted in the first direction through the movement of each wheel slide and in the second direction through the movement of each turrets.

Abstract: A resinoid-bonded grinding wheel employing hard abrasives such as cubic boron nitride or diamond is formed with a support member made of a vitrified grinding wheel. The support member has sealing layers on the surfaces thereof for avoiding the penetration of coolant into the support member. A method for forming the wheel includes mounting a grinding element on a radial peripheral surface portion of the support member and applying a sealing layer to the remaining surface portions of the grinding element for preventing penetration of the coolant into the support member and generation of vibrations in the grinding wheel during operation due to rotational imbalance caused by the presence of coolant within the support member.

Abstract: A resinoid-bonded grinding wheel employing the ultra-hard abrasives such as cubic boron nitride or diamond are formed with a support member which is made of a heat insulating material such as ceramics for preventing a thermal expansion of the grinding wheel and maintaining a precision grinding operation.