Abstract: A memory device includes a substrate, an active layer spaced apart from a surface of the substrate and laterally oriented in a first direction and including an opened first side, a closed second side, and a channel layer between the first side and the second side, and a word line laterally oriented in a second direction crossing the first direction while surrounding the channel layer.

Abstract: A memory device includes a substrate, an active layer spaced apart from a surface of the substrate and laterally oriented in a first direction and including an opened first side, a closed second side, and a channel layer between the first side and the second side, and a word line laterally oriented in a second direction crossing the first direction while surrounding the channel layer.

Abstract: A reinforced structural member includes a structural member having a hole and having a closed, and/or partially closed, cross-section, and a reinforcement fixed to the structural member. A portion of the reinforcement may be inserted into the structural member through the hole, and the hole and the reinforcement may be configured to align with a mount portion of an associated component when the associated component is mounted on the structural member.

Abstract: An embodiment rear side structure for a vehicle includes a rear side member extending in a longitudinal direction of the vehicle, a shock absorber mounting member connected to the rear side member, and a rear wheelhouse panel connected to the shock absorber mounting member, wherein the shock absorber mounting member and the rear wheelhouse panel are joined so that the shock absorber mounting member and the rear wheelhouse panel form a wheel arch.

Abstract: A vehicle front structure includes: a pair of front side members disposed on the front of the vehicle; a pair of damper housings connected to the pair of front side members, respectively; and a connection member connecting the pair of front side members and the pair of damper housings.

Abstract: An image signal processor includes a statistic data generating unit for receiving an image signal from an external device, an image processing unit for receiving the image signal, and a direct memory access (DMA) module connected to the statistic data generating unit and the image processing unit. The statistic data generating unit performs first image pre-processing on the image signal and generates first statistic data based on the image signal subjected to the first image pre-processing. The DMA module stores the first statistic data therein and provides the stored first statistic data to the image processing unit. The image processing unit performs second image pre-processing on the image signal and performs image processing on the image signal based on the first statistic data.

Abstract: A vehicle body structure includes: a front pillar; a front side member located in front of the front pillar and extending in a longitudinal direction of the vehicle; a side sill connected to a bottom end of the front pillar; and a rear lower member connecting the front side member, the side sill, and the front pillar, where the rear lower member includes a front connection portion connected to a rear portion of the front side member, and a rear connection portion connected to a lower portion of the front pillar and a front portion of the side sill, and the rear connection portion includes an upper engagement wall joined to the front pillar, and a lower engagement wall joined to the side sill.

Abstract: An image signal processor includes a shared circuit, a first circuit, and a second circuit. The shared circuit processes input image data. The first circuit provides a first algorithm for processing the input image data and is used by the shared circuit to process the input image data at a first operation mode in a first shooting environment. The second circuit provides a second algorithm for processing the input image data and is used by the shared circuit to process the input image data at a second operation mode different from the first operation mode in a second shooting environment different from the first shooting environment.

Abstract: A vehicle side member includes: a main member portion which extends in a longitudinal direction of a vehicle; a front-side mounting portion which is one-piece construction with a front portion of the main member portion; a rear-side mounting portion which is one-piece construction with a rear portion of the main member portion; and a damper mounting portion which is one-piece construction with the main member portion, and in which a top end of a damper is received and mounted.

Abstract: A semiconductor device includes a stack structure including conductive layers and insulating layers, which are alternately stacked; an opening including a first opening penetrating the stack structure and second openings protruding from the first opening; and a channel layer including channel regions located in the second openings and impurity regions located in the first opening, the impurity regions having an impurity concentration higher than that of the channel regions.

Abstract: A vehicle front structure includes: a pair of front side members disposed on the front of the vehicle; a pair of damper housings connected to the pair of front side members, respectively; and a connection member connecting the pair of front side members and the pair of damper housings.

Abstract: An embodiment rear side structure for a vehicle includes a rear side member extending in a longitudinal direction of the vehicle, a shock absorber mounting member connected to the rear side member, and a rear wheelhouse panel connected to the shock absorber mounting member, wherein the shock absorber mounting member and the rear wheelhouse panel are joined so that the shock absorber mounting member and the rear wheelhouse panel form a wheel arch.

Abstract: An image signal processor includes a shared circuit, a first circuit, and a second circuit. The shared circuit processes input image data. The first circuit provides a first algorithm for processing the input image data and is used by the shared circuit to process the input image data at a first operation mode in a first shooting environment. The second circuit provides a second algorithm for processing the input image data and is used by the shared circuit to process the input image data at a second operation mode different from the first operation mode in a second shooting environment different from the first shooting environment.

Abstract: A memory device includes a substrate, an active layer spaced apart from a surface of the substrate and laterally oriented in a first direction and including an opened first side, a closed second side, and a channel layer between the first side and the second side, and a word line laterally oriented in a second direction crossing the first direction while surrounding the channel layer.

Abstract: A vehicle side member includes: a main member portion which extends in a longitudinal direction of a vehicle; a front-side mounting portion which is one-piece construction with a front portion of the main member portion; a rear-side mounting portion which is one-piece construction with a rear portion of the main member portion; and a damper mounting portion which is one-piece construction with the main member portion, and in which a top end of a damper is received and mounted.

Abstract: An image signal processor includes a shared circuit, a first circuit, and a second circuit. The shared circuit processes input image data. The first circuit provides a first algorithm for processing the input image data and is used by the shared circuit to process the input image data at a first operation mode in a first shooting environment. The second circuit provides a second algorithm for processing the input image data and is used by the shared circuit to process the input image data at a second operation mode different from the first operation mode in a second shooting environment different from the first shooting environment.

Abstract: An electronic device is disclosed. The electronic device includes a camera, a communication module, and a processor. The processor is operably coupled with the camera and the communication module. The processor is configured to obtain a first image corresponding to an external object using the camera. The processor is also configured to generate a second image smaller in data size than the first image using the first image. The processor is further configured to transmit the second image to an external electronic device through the communication module. The processor is also configured to receive correction area information from the external electronic device through the communication module. The correction area information is based on information associated with an image area identified from the second image. The processor is further configured to perform correction using the first image based on at least part of the correction area information.

Abstract: According to various embodiments, an electronic device can comprise: a camera including groups of photoelectric conversion elements; and at least one processor configured so as to generate, by using the camera, a first image in which each of the groups corresponds to one corresponding pixel, determine whether a preset condition is satisfied, and generate, by using the camera, a second image in which each of the groups corresponds to a plurality of corresponding pixels, if the preset condition is satisfied.

Abstract: A semiconductor device includes a stack structure including conductive layers and insulating layers, which are alternately stacked; an opening including a first opening penetrating the stack structure and second openings protruding from the first opening; and a channel layer including channel regions located in the second openings and impurity regions located in the first opening, the impurity regions having an impurity concentration higher than that of the channel regions.

Abstract: A semiconductor device includes a stack structure including conductive layers and insulating layers, which are alternately stacked; an opening including a first opening penetrating the stack structure and second openings protruding from the first opening; and a channel layer including channel regions located in the second openings and impurity regions located in the first opening, the impurity regions having an impurity concentration higher than that of the channel regions.