Abstract: A reinforced structural member includes a structural member having a hole and having a closed, and/or partially closed, cross-section, and a reinforcement fixed to the structural member. A portion of the reinforcement may be inserted into the structural member through the hole, and the hole and the reinforcement may be configured to align with a mount portion of an associated component when the associated component is mounted on the structural member.

Abstract: An image signal processor includes a statistic data generating unit for receiving an image signal from an external device, an image processing unit for receiving the image signal, and a direct memory access (DMA) module connected to the statistic data generating unit and the image processing unit. The statistic data generating unit performs first image pre-processing on the image signal and generates first statistic data based on the image signal subjected to the first image pre-processing. The DMA module stores the first statistic data therein and provides the stored first statistic data to the image processing unit. The image processing unit performs second image pre-processing on the image signal and performs image processing on the image signal based on the first statistic data.

Abstract: A memory device includes a substrate, an active layer spaced apart from a surface of the substrate and laterally oriented in a first direction and including an opened first side, a closed second side, and a channel layer between the first side and the second side, and a word line laterally oriented in a second direction crossing the first direction while surrounding the channel layer.

Abstract: The semiconductor device include a horizontal layer spaced apart from a lower structure to extend along a direction parallel to the lower structure; a first conductive line extending along a direction perpendicular to the lower structure and coupled to one end of the horizontal layer; a data storage element coupled to the other end of the horizontal layer; and a second conductive line extending along a direction across the horizontal layer, wherein the second conductive line comprises: a high work function electrode; and a low work function electrode having a cup shape laterally oriented and disposed adjacent to the first conductive line and having a lower work function than the high work function electrode.

Abstract: A semiconductor device may include a peripheral circuit portion, a memory cell array disposed over the peripheral circuit portion and including a vertical conductive line, a bonding pad structure between the peripheral circuit portion and the memory cell array, a dielectric pad layer configured to cover the top of the vertical conductive line of the memory cell array, and a higher-level pad that is coupled to the vertical conductive line through the dielectric pad layer.

Abstract: A semiconductor device may include: a lower structure; a horizontal layer spaced apart from the lower structure and extending along a direction parallel to the lower structure; a vertical conductive line extending along a direction perpendicular to the lower structure and coupled to a first side end of the horizontal layer; a data storage element coupled to a second side end of the horizontal layer; and a horizontal conductive line extending along a direction crossing the horizontal layer and including a sloped side facing the vertical conductive line.

Abstract: A semiconductor device includes: a vertical conductive line; a horizontal layer oriented horizontally from the vertical conductive line; a horizontal conductive line crossing the horizontal layer; and a data storage element in contact with the horizontal layer, wherein the data storage element includes: a first electrode including a first cylinder that is in contact with an edge of an upper portion of the horizontal layer and a second cylinder that is in contact with an edge of a lower portion of the horizontal layer; a second electrode disposed over the first electrode; and a dielectric layer between the first electrode and the second electrode, and the second electrode includes: a sharing portion disposed in a gap between the first cylinder and the second cylinder; inner portions disposed on an inner surface of the first cylinder and an inner surface of the second cylinder; and outer portions disposed over the first cylinder and below the second cylinder.

Abstract: A vehicle chassis includes a pair of rear side members disposed on a rear floor of a vehicle so as to extend in a longitudinal direction of the vehicle while being spaced apart in a transverse direction of the vehicle. The pair of rear side members is manufactured in a casting process A cross member is configured to extend in the transverse direction of the vehicle and is manufactured in an extrusion process. The cross member is inserted into a mold when the rear side members are cast such that both ends of the cross member are connected to the rear side members disposed on both sides, respectively.

Abstract: A vehicle body structure includes: a front pillar; a front side member located in front of the front pillar and extending in a longitudinal direction of the vehicle; a side sill connected to a bottom end of the front pillar; and a rear lower member connecting the front side member, the side sill, and the front pillar, where the rear lower member includes a front connection portion connected to a rear portion of the front side member, and a rear connection portion connected to a lower portion of the front pillar and a front portion of the side sill, and the rear connection portion includes an upper engagement wall joined to the front pillar, and a lower engagement wall joined to the side sill.

Abstract: A memory device includes a substrate, an active layer spaced apart from a surface of the substrate and laterally oriented in a first direction and including an opened first side, a closed second side, and a channel layer between the first side and the second side, and a word line laterally oriented in a second direction crossing the first direction while surrounding the channel layer.

Abstract: A memory device includes a substrate, an active layer spaced apart from a surface of the substrate and laterally oriented in a first direction and including an opened first side, a closed second side, and a channel layer between the first side and the second side, and a word line laterally oriented in a second direction crossing the first direction while surrounding the channel layer.

Abstract: A reinforced structural member includes a structural member having a hole and having a closed, and/or partially closed, cross-section, and a reinforcement fixed to the structural member. A portion of the reinforcement may be inserted into the structural member through the hole, and the hole and the reinforcement may be configured to align with a mount portion of an associated component when the associated component is mounted on the structural member.

Abstract: An embodiment rear side structure for a vehicle includes a rear side member extending in a longitudinal direction of the vehicle, a shock absorber mounting member connected to the rear side member, and a rear wheelhouse panel connected to the shock absorber mounting member, wherein the shock absorber mounting member and the rear wheelhouse panel are joined so that the shock absorber mounting member and the rear wheelhouse panel form a wheel arch.

Abstract: A vehicle front structure includes: a pair of front side members disposed on the front of the vehicle; a pair of damper housings connected to the pair of front side members, respectively; and a connection member connecting the pair of front side members and the pair of damper housings.

Abstract: An image signal processor includes a statistic data generating unit for receiving an image signal from an external device, an image processing unit for receiving the image signal, and a direct memory access (DMA) module connected to the statistic data generating unit and the image processing unit. The statistic data generating unit performs first image pre-processing on the image signal and generates first statistic data based on the image signal subjected to the first image pre-processing. The DMA module stores the first statistic data therein and provides the stored first statistic data to the image processing unit. The image processing unit performs second image pre-processing on the image signal and performs image processing on the image signal based on the first statistic data.

Abstract: A vehicle body structure includes: a front pillar; a front side member located in front of the front pillar and extending in a longitudinal direction of the vehicle; a side sill connected to a bottom end of the front pillar; and a rear lower member connecting the front side member, the side sill, and the front pillar, where the rear lower member includes a front connection portion connected to a rear portion of the front side member, and a rear connection portion connected to a lower portion of the front pillar and a front portion of the side sill, and the rear connection portion includes an upper engagement wall joined to the front pillar, and a lower engagement wall joined to the side sill.

Abstract: An image signal processor includes a shared circuit, a first circuit, and a second circuit. The shared circuit processes input image data. The first circuit provides a first algorithm for processing the input image data and is used by the shared circuit to process the input image data at a first operation mode in a first shooting environment. The second circuit provides a second algorithm for processing the input image data and is used by the shared circuit to process the input image data at a second operation mode different from the first operation mode in a second shooting environment different from the first shooting environment.

Abstract: A vehicle side member includes: a main member portion which extends in a longitudinal direction of a vehicle; a front-side mounting portion which is one-piece construction with a front portion of the main member portion; a rear-side mounting portion which is one-piece construction with a rear portion of the main member portion; and a damper mounting portion which is one-piece construction with the main member portion, and in which a top end of a damper is received and mounted.

Abstract: A semiconductor device includes a stack structure including conductive layers and insulating layers, which are alternately stacked; an opening including a first opening penetrating the stack structure and second openings protruding from the first opening; and a channel layer including channel regions located in the second openings and impurity regions located in the first opening, the impurity regions having an impurity concentration higher than that of the channel regions.

Abstract: A vehicle front structure includes: a pair of front side members disposed on the front of the vehicle; a pair of damper housings connected to the pair of front side members, respectively; and a connection member connecting the pair of front side members and the pair of damper housings.