Abstract: A heat sink plate having a structure in which two or more kinds of materials are laminated, includes: a core layer in the thickness direction of the heat sink plate; and cover layers covering a top surface and a bottom surface of the core layer; wherein the cover layers comprise a material containing copper, wherein the core layer is formed of a matrix having a first thermal expansion coefficient and a plurality of layers extending in parallel along the thickness direction of the core layer in a lattice form in the matrix, wherein the plurality of layers are made of an alloy having a second thermal expansion coefficient.

Abstract: Provided are a transparent display device and a method for controlling same. This transparent display device comprises: a sensor which measures the color properties of light that is incident to the transparent display device; a light control unit which is configured so as to control the amount of light that is incident to the rear surface of the transparent display unit and penetrates a plurality of penetration units; and a transparent display panel which comprises a control unit configured so as to correct color distortion by making a comparison with a preset threshold value on the basis of the measured color properties and correcting the image to be displayed on a plurality of pixels, the transparent display panel displaying the corrected input image.

Abstract: A heat-dissipating plate comprises a core layer; and two cover layers formed by being laminated on the top and bottom face of the core layer, wherein, the core layer is composed of a composite material in which a carbon phase is composited in a Cu matrix, the cover layer is composed of a Mo—Cu alloy, and the thermal conductivity in the thickness direction of the heat-dissipating plate is at least 300 W/mK, and the thermal expansion coefficient of the heat-dissipating plate in a direction perpendicular to the thickness direction is at most 9×10-6/K.

Abstract: Provided are a transparent display device and a method for controlling same. This transparent display device comprises: a sensor which measures the colour properties of light that is incident to the transparent display device; a light control unit which is configured so as to control the amount of light that is incident to the rear surface of the transparent display unit and penetrates a plurality of penetration units; and a transparent display panel which comprises a control unit configured so as to correct colour distortion by making a comparison with a preset threshold value on the basis of the measured colour properties and correcting the image to be displayed on a plurality of pixels, the transparent display panel displaying the corrected input image.

Abstract: A package stack includes a first package, a second package, first solder balls and a molding member. The first package includes a first package substrate, a first semiconductor chip on the first package substrate and connecting pads. The second package includes a second package substrate and a second semiconductor chip on the second package substrate. The second package is disposed over the first package. The first solder balls are in contact with the connecting pads and a bottom of a peripheral portion of the second package substrate. The molding member covers an upper surface of the second package substrate and the second semiconductor chip. A portion of the molding member overlapping the first solder balls has a thickness smaller than a thickness of another portion of the molding member.

Abstract: A package stack includes a first package, a second package, first solder balls and a molding member. The first package includes a first package substrate, a first semiconductor chip on the first package substrate and connecting pads. The second package includes a second package substrate and a second semiconductor chip on the second package substrate. The second package is disposed over the first package. The first solder balls are in contact with the connecting pads and a bottom of a peripheral portion of the second package substrate. The molding member covers an upper surface of the second package substrate and the second semiconductor chip. A portion of the molding member overlapping the first solder balls has a thickness smaller than a thickness of another portion of the molding member.

Abstract: A bulk nanocomposite thermoelectric material including: a plurality of grains of a thermoelectric material; and a metal nanolayer on a boundary of the plurality of grains, wherein the metal nanolayer is crystalline, and a glass transition temperature and a crystallization temperature of the nanometal are lower than a melting point of the thermoelectric material.

Abstract: A display device includes a plurality of gate lines and a plurality of data lines crossing each other on a first substrate, to define a pixel; a first thin film transistor in a portion where the gate lines and the data lines cross each other; a plurality of position detection lines on the first substrate, the position detection lines spaced a constant distance from the data lines and crossing the gate lines; a second thin film transistor for detecting a position, in a portion on the first substrate where the gate lines and the position detection lines cross each other; a protrusion pattern protruding from a second substrate and corresponding to a drain electrode of the second thin film transistor; and a transparent conductive layer on the protrusion pattern, electrically connected to the drain electrode when touching.

Abstract: A bulk thermoelectric material having a structure in which migration of carriers is not inhibited but phonons are scattered is described. The bulk thermoelectric material includes: a bulk crystalline thermoelectric material matrix; and nanoparticles coated with a conductive material within the thermoelectric material matrix.

Abstract: A bulk thermoelectric material includes a matrix, the matrix including a crystalline thermoelectric material; and metal oxide particles disposed in the matrix at a grain boundary or within a crystal structure of the crystalline thermoelectric material.

Abstract: An image quality analysis method and an image quality analysis system for a display device are provided. The image quality analysis method and image quality analysis system provides a quantitative determination of image quality for display devices, thereby providing an objective and fair evaluation criterion.

Abstract: An image quality analysis method and an image quality analysis system for a display device are provided. The image quality analysis method and image quality analysis system provides a quantitative determination of image quality for display devices, thereby providing an objective and fair evaluation criterion.

Abstract: A masking film adhering method for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table.

Abstract: A masking film adhering method and apparatus for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table.