Abstract: The present invention relates to an ALD thin film with reverse resistivity, and a method for manufacturing the same, and more particularly, to a thin film with reverse resistivity obtained by depositing a specific precursor and a reactant using ALD, and a method for manufacturing the same.

Abstract: A method of transmitting power by a wireless power transmitter, the method including sequentially transmitting a sensing signal a plurality of times to a wireless power receiver through a plurality of transmission coils to sense the presence of the wireless power receiver; identifying transmission coils that receive a signal strength indictor transmitted by the wireless power receiver in response to the plurality of sensing signals; and selecting, as a power transmission coil, the transmission coil that has received the signal strength indicator having the largest amount or the largest value among the transmission coils that have received the signal strength indicator, receiving a plurality of packets including a foreign object detection (FOD) status packet from the wireless power receiver; determining whether a foreign object is present in a charging area of the wireless power transmitter on the basis of the FOD status packet; and transmitting, to the wireless power receiver, a response signal indicating whe

Abstract: A method of transmitting power by a wireless power transmitter, the method including receiving a plurality of packets including a foreign object detection (FOD) status packet from a wireless power receiver; determining whether a foreign object is present in a charging area of the wireless power transmitter on the basis of the FOD status packet; and transmitting, to the wireless power receiver, a response signal indicating whether the foreign object is present in the charging area of the wireless power transmitter on the basis of a result of the determination, wherein the response signal is determined using a measured peak frequency of a power signal transmitted by the wireless power transmitter and a reference peak frequency included in the FOD status packet received from the wireless power receiver, wherein the plurality of packets further include at least one of a signal strength packet, an end power transfer packet, a power control hold-off packet, a control error packet, a renegotiation packet, an eight-b

Abstract: An electroluminescent device and a production method for the electroluminescent device. The electroluminescent device includes: a first electrode and a second electrode spaced apart from each other, a light emitting layer disposed between the first electrode and the second electrode, an electron transport layer disposed between the light emitting layer and the second electrode, and an organic layer. The light emitting layer includes a semiconductor nanoparticle, and the electron transport layer includes a metal oxide nanoparticle. The organic layer includes a polymer material as described herein in the organic layer.

Abstract: An electroluminescent device and a method for making the device. The electroluminescent device includes a first electrode, a second electrode, a light emitting layer disposed between the first electrode and the second electrode, an electron transport layer disposed between the light emitting layer and the second electrode, and an organic layer. The light emitting layer includes a semiconductor nanoparticle, the electron transport layer includes a metal oxide nanoparticle, and the metal oxide nanoparticles have sizes of 1 nm or more and 50 nm or less. The organic layer includes a polymer, and the polymer includes a repeat unit with a hydroxy group.

Abstract: A quantum homomorphic encryption method performed by a computing device is provided. The method may comprise creating a first qubit state that includes ancilla qubits, by performing quantum error correction encoding on data, creating a second qubit state that includes the first qubit state, by grouping the first qubit state and encrypting the second qubit state by performing a random permutation on the second qubit state.

Abstract: A driving belt inspection device and method for a wafer transfer module is disclosed. The driving belt inspection device for a wafer transfer module includes: a data receiving unit for receiving current data of a motor connected to a driving belt; a calculation unit for calculating the rate of change of instantaneous current of the motor according to the received current data and acquiring a calculated value for inspection according to the calculated rate of change of instantaneous current of the motor; and a result determination unit for determining, if the calculated value is lower than a first reference value, that the driving belt is in a normal operation state, and determining, if the calculated value is higher than a second reference value, that the driving belt is in an abnormal operation state.

Abstract: A method of producing a light emitting device includes: forming a light emitting layer including a semiconductor nanoparticle on a first electrode; forming an electron transport layer including a metal oxide nanoparticle on the light emitting layer; forming a thin film conductor on the electron transport layer; placing the electron transport layer, the thin film conductor, and an acid material together in a space defined by a container; and keeping the defined space at a post-treatment temperature of greater than or equal to about 40° C. and less than or equal to about 200° C. The light emitting layer is configured to emit a first light when a voltage is applied, a thickness of the thin film conductor is greater than or equal to about 1 nm and less than 100 nm, and the acid material includes a polymeric acid, a non-polymeric carboxylic acid compound, or a combination thereof.

Abstract: The high-quality casting device for producing a thick aluminum part includes: a mold having a movable mold and a fixed mold coming into close contact with each other to form a cavity; a platen having a movable platen on which the movable mold is mounted and a fixed platen on which the fixed mold is mounted; an upper tie bar and a lower tie bar connected to the platen; a high-pressure squeeze platen connected to the upper tie bar and the lower tie bar; a squeeze pressurizer located on the high-pressure squeeze platen to pressurize a molten metal filled into the cavity; a sprue adapted to pour the molten metal into the cavity of the mold; a pouring ladle attached to the mold to pour the molten metal into the sprue; and a casting extractor located on one side of the mold to extract the casting solidified inside the cavity.

Abstract: A moisture detection circuit for serial bus connectors includes: a current digital-to-analog converter that receives a first digital signal indicating a current reference value and outputs an analog current with a magnitude corresponding to that of the first digital signal to a terminal of the serial bus connector; a voltage digital-to-analog converter that receives a second digital signal indicating a voltage reference value and outputs an analog voltage with a magnitude corresponding to that of the second digital signal; a comparator that compares a voltage of the terminal with a voltage output by the voltage digital-to-analog converter; and a controller that provides a first digital signal indicating the current reference value to the current digital-to-analog converter and provides a second digital signal indicating the voltage reference value to the voltage digital-to-analog converter to determine presence or absence of moisture adhering to the terminal based on comparison results of the comparator.

Abstract: A method of transmitting motion information for metaverse concert includes: generating, by a performance directing system, original motion information including frames where performer's action is recorded; generating processed motion information having a lower frames per second (FPS) than the original motion information; generating verified motion information by extracting information on position on a part of performer's body in the original motion information; transmitting the verified motion information to an audience client system; receiving the verified motion information; generating, by the audience client system, restored motion information having the same FPS as the original motion information by adding predicted frames for the removed frames to the processed motion information; verifying whether there is an error in the restored motion information; modifying and supplementing the restored motion information when there is the error; and assigning motion to a virtual character based on the supplemented

Abstract: A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the shield is attached to the substrate and includes a second opening. An encapsulant is deposited over the substrate and semiconductor die. The encapsulant extends into the first opening and a first area between the shield and substrate while a second area over the photosensitive circuit remains devoid of the encapsulant.

Abstract: A semiconductor device has a photonic semiconductor die and a lens mounted onto the photonic semiconductor die. The photonic semiconductor die and lens are singulated prior to mounting the lens onto the photonic semiconductor die. An adhesive bead is formed on the photonic semiconductor die to seal a cavity between the lens and photonic semiconductor die. The photonic semiconductor die and lens are disposed into a storage media for transporting the photonic semiconductor die to a semiconductor packaging facility. The photonic semiconductor and lens are disposed on a substrate after mounting the lens onto the photonic semiconductor die. An encapsulant is deposited over the substrate, lens, and photonic semiconductor die.

Abstract: A semiconductor device has a semiconductor die including a photonic circuit. A first adhesive bead is deposited over the semiconductor die around the photonic circuit. A second adhesive bead is deposited over the first adhesive bead. An inner edge of the second adhesive bead is offset toward the photonic circuit relative to an inner edge of the first adhesive bead. A lens is disposed over the second adhesive bead. An encapsulant is deposited over the semiconductor die and lens.

Abstract: A semiconductor package is disclosed. The package includes a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die region. A die having first and second major die surfaces is attached onto the die region. The second major die surface is attached to the die region. The first major die surface includes a sensor region and a cover adhesive region surrounding the sensor region. The package also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the sensor region. The protective cover includes a recessed structure on the second major cover surface.

Abstract: A method of receiving power of a wireless power receiver, including a signal transmission phase of transmitting a signal including an FOD status packet to a wireless power transmitter; a power reception phase of receiving a first power from the wireless power transmitter when a NAK response indicating that a foreign object is present in the charging area of the wireless power transmitter is received from the wireless power transmitter, or receiving a second power from the wireless power transmitter when an ACK response indicating that the foreign object is not present in the charging area of the wireless power transmitter is received from the wireless power transmitter, in response to the FOD status packet; a phase of transmitting a reception power packet including information on reception power intensity to the wireless power transmitter; and a phase of receiving a signal including information on a result of determining whether the foreign object is present in the charging area from the wireless power transm

Abstract: Multi-chip image sensor semiconductor packages and methods for forming such packages are disclosed. A multi-chip package includes at least one cover covering a sensor die. Some multi-chip packages include multiple covers for covering each sensor die. In one multi-chip packages, a single cover covers multiple sensor chips.

Abstract: A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die region with a die attached thereto. An encapsulant is disposed to cover the encapsulation region of the package substrate. A protective cover is disposed over the die and attached to the encapsulant. The cover is attached to the encapsulant using a mold material.

Abstract: A wireless power transmitter of transmitting power to a wireless power receiver, including a controller configured to determine whether a foreign object is present in a charging area of the wireless power transmitter; and a transmission part configured to transmit a wireless power according to whether the foreign object is present, wherein the controller receives a signal including an FOD status packet from the wireless power receiver, determines whether the foreign object is present in a charging area of the wireless power transmitter based on the FOD status packet; wherein the controller is set to operate in a first power transfer mode when it is determined that the foreign object is present in the charging area, or to operate in a second power transfer mode when it is determined that the foreign object is not present in the charging area; wherein the controller receives a reception power packet including information on the reception power intensity from the wireless power receiver, determines the reception

Abstract: A heating apparatus for an aerosol-forming article includes: a housing that accommodates at least a portion of the aerosol-forming article; a power circuit that delivers power to a heat-generating body for heating the aerosol-forming article; a controller that controls the power circuit to adjust the heating temperature of the aerosol-forming article; a temperature sensor that detects the temperature of the housing and outputs an analog signal corresponding to the detected temperature; and an oscillator that outputs the signal of the frequency corresponding to the magnitude of the analog signal output by the temperature sensor; wherein the controller detects a user's puff or adjusts the heating temperature of the aerosol-forming article based on the frequency of the signal output by the oscillator.