Abstract: Reliable plasma dicing of a wafer with a die attach film (DAF) to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dicing mask. A combination of plama dicing and laser cutting is employed. Plasma is employed to etch the wafer while laser is employed to cut the DAF.

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The protective cover is supported by a standoff structure disposed on the die and below the protective cover. An encapsulant is disposed to cover the package substrate while leaving the top package surface exposed.

Abstract: Disclosed herein are a surgical navigation instrument having a needle electrode depth adjusting structure for detecting impedance and a high frequency energy control method using the same. The present invention can detect impedance of tissues while applying a pilot signal to an electrode of a high frequency needle according to impedance conditions of the tissues to detect impedance of the tissues, and determine an applied amount of high frequency energy output to high frequency needles according to the detected impedance, thereby reducing patients' pains, maximizing treatment effect, and reducing treatment time according to high frequency energy applied to various depths at the same treatment point when performing a surgical procedure with the same or different treatment parameters according to disease symptoms while selecting the insertion number of high frequency needles, which can be adjusted in penetration depth, into the skin.

Abstract: Disclosed herein is a surgical navigation instrument having a temperature sensor. The surgical navigation instrument can easily perform an autoclave action to remove microorganisms using saturated steam with respect to a part which can be contaminated during treatment, and enhance convenience in replacement of a grip part and the electrodes of the handpiece which are consumables, since a handpiece and electrodes are detachably screw-coupled with each other.

Abstract: The present disclosure relates to plasma dicing of wafer. More specifically, the present disclosure is directed to frame masks and methods for plasma dicing wafers utilizing frame masks. The frame mask includes a mask frame, wherein the mask frame includes a top ring mask support and a side ring mask support. A plurality of mask segments suspended from the top ring mask support by segment supports, the mask segments are configured to define dicing channels on a blank wafer. The frame mask is configured to removably sit onto a frame lift assembly in a plasma chamber of a plasma dicing tool, when fitted onto the frame lift assembly, the mask segments are disposed above a wafer on a wafer ring frame for plasma dicing. The mask frame is configured to enable flow of plasma therethrough to the wafer to etch the wafer to form dicing channels defined by the mask segments.

Abstract: Disclosed are polypropylene thermoplastic resin composition containing a high crystalline homo polypropylene resin, a long glass fiber reinforced material, a modified polypropylene resin, and a nucleating agent having a structure including amino azobenzene or a derivative thereof.

Abstract: An apparatus, circuit, and method for controlling a service access in a packet data communication system are provided. The method includes broadcasting information related to whether a service access to a specific service is possible.

Abstract: A wireless power receiver including a transmitter configured to transmit to a wireless power transmitter, a foreign object detection status packet including a mode bit field indicating whether a foreign object detection status packet includes a reference peak frequency of the wireless power receiver, in which the reference peak frequency is pre-assigned to the wireless power receiver; and a receiver configured to receive from the wireless power transmitter, a response indicating the foreign object is present or not present in a charging area of the wireless power transmitter, wherein the response is determined based on a comparison of a measured peak frequency of a power signal transmitted by the wireless power transmitter and an adaptable threshold frequency adapted based on the reference peak frequency included in the foreign object detection status packet from the wireless power receiver.

Abstract: A semiconductor package is disclosed. The package includes a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die region. A die having first and second major die surfaces is attached onto the die region. The second major die surface is attached to the die region. The first major die surface includes a sensor region and a cover adhesive region surrounding the sensor region. The package also includes a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the sensor region. The protective cover includes a cover attached to the first major die surface, the cover includes top and bottom major cover surfaces and side cover surfaces.

Abstract: The present invention relates to a foreign substance detection method, and an apparatus and a system therefor. A foreign substance detection method in a wireless power transmitter, according to an embodiment of the present invention, may comprise the steps of: if an object placed in a charging area is detected, searching for a current peak frequency with a maximum quality factor value in an available frequency band; receiving, from a wireless power receiver, a foreign substance detection state packet including a reference peak frequency; determining a foreign substance detection reference frequency on the basis of the reference peak frequency; and determining whether or not a foreign substance is present by comparing the current peak frequency with the foreign substance detection reference frequency. Therefore, the present invention has an advantage of being capable of detecting a foreign substance more effectively and accurately.

Abstract: A method of controlling a power receiver. The method includes entering a negotiation phase with a power transmitter including transmitting a foreign object detection status packet including at least one of a reference quality factor and a reference quality factor peak frequency to the power transmitter, and receiving a NAK response from the power transmitter indicating the power transmitter has detected the foreign object is present based on the foreign object detection status packet or receiving an ACK response from the power transmitter indicating the power transmitter has detected the foreign object is not present based on the foreign object detection status packet; and entering a power transfer phase including receiving a first power from the power transmitter in response to the received NAK response and receiving a second power greater than the first power in response to the received ACK response.

Abstract: The present disclosure relates to a motor driver and a method of driving a motor capable of driving a motor with optimum efficiency. The method of driving the brushless direct current (BLDC) motor may include an initial driving operation, a test operation of adjusting a turn-on time and a transition time in the test mode step by step, driving the BLDC motor by applying the adjusted turn-on time and the adjusted transition time, and detecting a driving error of the BLDC motor, an operation of repeating the test operation when the driving error is not detected in the test operation, and an operation of setting the turn-on time and the transition time, which are adjusted in an operation just before the driving error is detected, as a turn-on time and a transition time in an optimum driving mode.

Abstract: A semiconductor package is disclosed. The package includes a sensor die which is disposed on a package substrate. A cover structure is attached to a cover adhesive surrounding the sensor die, forming a cavity above the sensor die. The cover structure includes a primary cover structure and a secondary cover structure surrounding the primary cover structure. The secondary cover structure is configured to protect the primary cover structure from damage during packaging. The package also includes an encapsulant. The encapsulant covers side surfaces of the cover structure, sides of the cover adhesive, and exposed portions of the package substrate, leaving the first major cover surface exposed.

Abstract: A quantum dot-polymer composite film includes: a plurality of quantum dots, wherein a quantum dot of the plurality of quantum dots includes an organic ligand on a surface of a the quantum dot; a cured product of a photopolymerizable monomer including a carbon-carbon unsaturated bond; and a residue including a residue of a high-boiling point solvent, a residue of a polyvalent metal compound, or a combination thereof.

Abstract: An air guide apparatus for a vehicle includes a front wheel housing at least partially surrounding a front wheel, and having an air outlet which is open to the front wheel, a first vane assembly including a plurality of first vanes which are tiltable in a position adjacent to the air outlet, and a first driving mechanism by which the plurality of first vanes are driven, and a second vane assembly including a plurality of second vanes which are tiltable in a position adjacent to the plurality of first vanes, and a second driving mechanism by which the plurality of second vanes are driven.

Abstract: Some example embodiments relate to a super resolution scanning electron microscope (SEM) image implementing device and/or a method thereof. Provided a super resolution scanning electron microscope (SEM) image implementing device comprising a processor configured to crop a low resolution SEM image to generate a first cropped image and a second cropped image, to upscale the first cropped image and the second cropped image to generate a first upscaled image and a second upscaled image, and to cancel noise from the first upscaled image and the second upscaled image to generate a first noise canceled image and a second noise canceled image.

Abstract: A semiconductor device has a substrate. A semiconductor die with a photosensitive circuit is disposed over the substrate. A lens comprising a protective layer is disposed over the photosensitive circuit. An encapsulant is deposited over the substrate, semiconductor die, and lens. The protective layer is removed after depositing the encapsulant.

Abstract: A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through the groove to separate the semiconductor die. The semiconductor die are disposed over a carrier with a distance of 500 micrometers (?m) or less between semiconductor die. The encapsulant covers a sidewall of the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while the encapsulant remains devoid of the fan-in interconnect structure. A portion of the encapsulant is removed from a non-active surface of the semiconductor die. The device is singulated through the encapsulant while leaving encapsulant disposed covering a sidewall of the semiconductor die. The encapsulant covering the sidewall includes a thickness of 50 ?m or less.

Abstract: Disclosed is a system for transmitting and receiving safety information, which generates first safety information about a control target and second safety information representing the occurrence or not of an error in the control target by using one microcontroller. The system includes a first slave controller generating first safety information and second safety information by using sensing data obtained from a control target and a master controller receiving the first safety information and the second safety information from the first slave controller through a wireless channel. When an error occurs in the first slave controller, the first slave controller transmits the second safety information to a second slave controller, and the second slave controller transmits the second safety information, received from the first slave controller, to the master controller.

Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.