Patents by Inventor Il Ro LEE

Il Ro LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186070
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Application
    Filed: February 13, 2024
    Publication date: June 6, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok YI, Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Il Ro LEE, Byung Woo KANG, San KYEONG, Hae Sol KANG
  • Patent number: 11935703
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Patent number: 11798747
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: October 24, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
  • Patent number: 11651901
    Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 ?m.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: May 16, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Il Ro Lee, Jung Min Kim, Hong Je Choi, Sang Wook Lee, Seon Ho Park, Jeong Ryeol Kim, Bon Seok Koo
  • Patent number: 11636984
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: April 25, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Publication number: 20230066593
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Application
    Filed: October 24, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok YI, Il Ro LEE, Chang Hak CHOI, Bon Seok KOO, Jung Min KIM, Byung Woo KANG, San KYEONG
  • Patent number: 11508522
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: November 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
  • Patent number: 11469051
    Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hye Han, Jung Min Kim, Jae Seok Yi, Hye Jin Park, Byung Woo Kang, Jeong Ryeol Kim, Bon Seok Koo, Il Ro Lee
  • Publication number: 20220262571
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Application
    Filed: April 29, 2022
    Publication date: August 18, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok YI, Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Il Ro LEE, Byung Woo KANG, San KYEONG, Hae Sol KANG
  • Patent number: 11393630
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Publication number: 20220165500
    Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 ?m.
    Type: Application
    Filed: August 31, 2021
    Publication date: May 26, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Il Ro Lee, Jung Min Kim, Hong Je Choi, Sang Wook Lee, Seon Ho Park, Jeong Ryeol Kim, Bon Seok Koo
  • Publication number: 20220093337
    Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.
    Type: Application
    Filed: April 16, 2021
    Publication date: March 24, 2022
    Inventors: Ji Hye HAN, Jung Min KIM, Jae Seok YI, Hye Jin PARK, Byung Woo KANG, Jeong Ryeol KIM, Bon Seok KOO, Il Ro LEE
  • Publication number: 20210193391
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Application
    Filed: April 24, 2020
    Publication date: June 24, 2021
    Inventors: Jae Seok YI, Il Ro LEE, Chang Hak CHOI, Bon Seok KOO, Jung Min KIM, Byung Woo KANG, San KYEONG
  • Publication number: 20210074481
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Application
    Filed: March 30, 2020
    Publication date: March 11, 2021
    Inventors: Jae Seok YI, Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Il Ro LEE, Byung Woo KANG, San KYEONG, Hae Sol KANG
  • Patent number: 10720280
    Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: July 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Ho Shin, Woong Do Jung, Young Seok Yoon, Dong Sik Yoo, No Il Park, Seung Mo Lim, Il Ro Lee
  • Patent number: 10468187
    Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: November 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Ho Shin, Woong Do Jung, Young Seok Yoon, Dong Sik Yoo, No Il Park, Seung Mo Lim, Il Ro Lee
  • Publication number: 20190295772
    Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.
    Type: Application
    Filed: June 10, 2019
    Publication date: September 26, 2019
    Inventors: Hyun Ho SHIN, Woong Do JUNG, Young Seok YOON, Dong Sik YOO, No Il PARK, Seung Mo LIM, Il Ro LEE
  • Patent number: 10381337
    Abstract: A capacitor includes a plurality of cells each including a capacitance formation portion in which a plurality of trenches are positioned and a margin portion disposed around the capacitance formation portion. The cell includes three or more dielectric layers disposed in the capacitance formation portion and extending in the trenches, and three or more electrode layers sequentially stacked with dielectric layers interposed therebetween and extending in the trenches. At least first and second electrode layers have opposite polarities and each include a lead electrode extending from the capacitance formation portion to the margin portion. A lead electrode of the first electrode layer is disposed in a first region disposed to one side of a central portion of a cell, and a lead electrode of the second electrode layer is disposed in a second region disposed on another side of a central portion of the cell.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: August 13, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Ho Shin, Woong Do Jung, Jong Suk Han, Dong Sik Yoo, Jeong Hoon Ryou, No Il Park, Seung Mo Lim, Il Ro Lee
  • Patent number: 10199166
    Abstract: A capacitor includes: a substrate including a plurality of trenches and a capacitance formation portion, and a margin portion disposed around the capacitance formation portion; dielectric layers disposed on one surface of the substrate and filling the trenches; a plurality of first electrode layers each disposed on one surface of the dielectric layer and each including a first lead portion led out from the capacitance formation portion to the margin portion; and a plurality of second electrode layers each disposed on one surface of the dielectric layer to face the first electrode layer with each of the dielectric layers interposed therebetween, and each including a second lead portion led out from the capacitance formation portion to the margin portion, wherein the first and second lead portions of the plurality of first and second electrode layers are stacked in a stepped shape inclined in a direction from the margin portion to the capacitance formation portion.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: No Il Park, Byeong Cheol Moon, Il Ro Lee, Hyun Ho Shin, Seung Mo Lim, In Young Kang
  • Publication number: 20180350790
    Abstract: A capacitor includes a plurality of cells each including a capacitance formation portion in which a plurality of trenches are positioned and a margin portion disposed around the capacitance formation portion. The cell includes three or more dielectric layers disposed in the capacitance formation portion and extending in the trenches, and three or more electrode layers sequentially stacked with dielectric layers interposed therebetween and extending in the trenches. At least first and second electrode layers have opposite polarities and each include a lead electrode extending from the capacitance formation portion to the margin portion. A lead electrode of the first electrode layer is disposed in a first region disposed to one side of a central portion of a cell, and a lead electrode of the second electrode layer is disposed in a second region disposed on another side of a central portion of the cell.
    Type: Application
    Filed: December 4, 2017
    Publication date: December 6, 2018
    Inventors: Hyun Ho SHIN, Woong Do JUNG, Jong Suk HAN, Dong Sik YOO, Jeong Hoon RYOU, No IL PARK, Seung Mo LIM, IL Ro LEE