Abstract: A capacitor includes: a substrate including a plurality of trenches and a capacitance formation portion, and a margin portion disposed around the capacitance formation portion; dielectric layers disposed on one surface of the substrate and filling the trenches; a plurality of first electrode layers each disposed on one surface of the dielectric layer and each including a first lead portion led out from the capacitance formation portion to the margin portion; and a plurality of second electrode layers each disposed on one surface of the dielectric layer to face the first electrode layer with each of the dielectric layers interposed therebetween, and each including a second lead portion led out from the capacitance formation portion to the margin portion, wherein the first and second lead portions of the plurality of first and second electrode layers are stacked in a stepped shape inclined in a direction from the margin portion to the capacitance formation portion.

Abstract: A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of first vias connects the first electrode layers and the first electrode pad to each other. Each of a plurality of second vias connects the second electrode layers and the second electrode pad to each other. A separation slit is disposed to penetrate from an upper surface of the body and extend to the substrate, and the pluralities of first and second vias are disposed symmetrically with respect to the separation slit.