Patents by Inventor Il Ho Kim

Il Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250190298
    Abstract: A method of operating a computing device includes performing a pre-boot memory test on a memory by a BIOS (Basic Input/Output System), recording, in a log, memory fail information generated as a result of performing the pre-boot memory test by the BIOS, and performing a page offline operation using the memory fail information, after an operating system (OS) of the computing device is installed.
    Type: Application
    Filed: July 16, 2024
    Publication date: June 12, 2025
    Inventors: Jong Won JEONG, Sung-Joon KIM, Il Ho KIM, Won Jae SHIN, Ho-Young LEE, Jin Hun JEONG
  • Patent number: 11285701
    Abstract: A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: March 29, 2022
    Assignees: THEGOODSYSTEM CORP., DOWA METALTECH CO., LTD.
    Inventors: Meoung-whan Cho, Il-ho Kim, Seog-woo Lee, Young-suk Kim, Hiroto Narieda, Tomotsugu Aoyama
  • Patent number: 10964669
    Abstract: A semiconductor package includes a chip stack having a plurality of semiconductor chips vertically stacked on a package substrate. A stress-equalizing chip is disposed on the chip stack, the stress-equalizing chip providing means to reduce the variation in the electrical characteristics of the plurality of semiconductor chips. An encapsulant is disposed on the package substrate and is configured to cover at least a portion of the chip stack. Each of the plurality of semiconductor chips is electrically connected to the package substrate. The stress-equalizing chip is not electrically connected to the substrate or to the plurality of semiconductor chips.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Il Ho Kim
  • Publication number: 20200290316
    Abstract: A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.
    Type: Application
    Filed: February 25, 2020
    Publication date: September 17, 2020
    Inventors: Meoung-whan CHO, Il-ho KIM, Seog-woo LEE, Young-suk KIM, Hiroto NARIEDA, Tomotsugu AOYAMA
  • Patent number: 10777484
    Abstract: A heat sink plate having a structure in which two or more kinds of materials are laminated, includes: a core layer in the thickness direction of the heat sink plate; and cover layers covering a top surface and a bottom surface of the core layer; wherein the cover layers comprise a material containing copper, wherein the core layer is formed of a matrix having a first thermal expansion coefficient and a plurality of layers extending in parallel along the thickness direction of the core layer in a lattice form in the matrix, wherein the plurality of layers are made of an alloy having a second thermal expansion coefficient.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: September 15, 2020
    Assignee: THE GOODSYSTEM CORP.
    Inventors: Il-ho Kim, Meoung-whan Cho, Young-suk Kim
  • Publication number: 20200020668
    Abstract: A semiconductor package includes a chip stack having a plurality of semiconductor chips vertically stacked on a package substrate. A stress-equalizing chip is disposed on the chip stack, the stress-equalizing chip providing means to reduce the variation in the electrical characteristics of the plurality of semiconductor chips. An encapsulant is disposed on the package substrate and is configured to cover at least a portion of the chip stack. Each of the plurality of semiconductor chips is electrically connected to the package substrate. The stress-equalizing chip is not electrically connected to the substrate or to the plurality of semiconductor chips.
    Type: Application
    Filed: November 20, 2018
    Publication date: January 16, 2020
    Inventor: IL HO KIM
  • Publication number: 20190115279
    Abstract: A heat sink plate having a structure in which two or more kinds of materials are laminated, includes: a core layer in the thickness direction of the heat sink plate; and cover layers covering a top surface and a bottom surface of the core layer; wherein the cover layers comprise a material containing copper, wherein the core layer is formed of a matrix having a first thermal expansion coefficient and a plurality of layers extending in parallel along the thickness direction of the core layer in a lattice form in the matrix, wherein the plurality of layers are made of an alloy having a second thermal expansion coefficient.
    Type: Application
    Filed: October 11, 2018
    Publication date: April 18, 2019
    Applicant: THE GOODSYSTEM CORP.
    Inventors: Il-ho KIM, Meoung-whan CHO, Young-suk KIM
  • Patent number: 10217392
    Abstract: Provided are a transparent display device and a method for controlling same. This transparent display device comprises: a sensor which measures the color properties of light that is incident to the transparent display device; a light control unit which is configured so as to control the amount of light that is incident to the rear surface of the transparent display unit and penetrates a plurality of penetration units; and a transparent display panel which comprises a control unit configured so as to correct color distortion by making a comparison with a preset threshold value on the basis of the measured color properties and correcting the image to be displayed on a plurality of pixels, the transparent display panel displaying the corrected input image.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: February 26, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: Byung Chun Yu, Eui Yeol Oh, Chae Youl Cho, Ki Pyo Hong, Joo Young An, Il Ho Kim
  • Publication number: 20180328677
    Abstract: A heat-dissipating plate comprises a core layer; and two cover layers formed by being laminated on the top and bottom face of the core layer, wherein, the core layer is composed of a composite material in which a carbon phase is composited in a Cu matrix, the cover layer is composed of a Mo—Cu alloy, and the thermal conductivity in the thickness direction of the heat-dissipating plate is at least 300 W/mK, and the thermal expansion coefficient of the heat-dissipating plate in a direction perpendicular to the thickness direction is at most 9×10-6/K.
    Type: Application
    Filed: September 6, 2016
    Publication date: November 15, 2018
    Applicant: THE GOODSYSTEM CORP.
    Inventors: Il-ho KIM, Meoung-whan CHO, Young-suk KIM
  • Publication number: 20150371579
    Abstract: Provided are a transparent display device and a method for controlling same. This transparent display device comprises: a sensor which measures the colour properties of light that is incident to the transparent display device; a light control unit which is configured so as to control the amount of light that is incident to the rear surface of the transparent display unit and penetrates a plurality of penetration units; and a transparent display panel which comprises a control unit configured so as to correct colour distortion by making a comparison with a preset threshold value on the basis of the measured colour properties and correcting the image to be displayed on a plurality of pixels, the transparent display panel displaying the corrected input image.
    Type: Application
    Filed: December 30, 2013
    Publication date: December 24, 2015
    Inventors: Byung Chun YU, Eui Yeol OH, Chae Youl CHO, Ki Pyo HONG, Joo Young AN, Il Ho KIM
  • Publication number: 20140342501
    Abstract: A package stack includes a first package, a second package, first solder balls and a molding member. The first package includes a first package substrate, a first semiconductor chip on the first package substrate and connecting pads. The second package includes a second package substrate and a second semiconductor chip on the second package substrate. The second package is disposed over the first package. The first solder balls are in contact with the connecting pads and a bottom of a peripheral portion of the second package substrate. The molding member covers an upper surface of the second package substrate and the second semiconductor chip. A portion of the molding member overlapping the first solder balls has a thickness smaller than a thickness of another portion of the molding member.
    Type: Application
    Filed: July 31, 2014
    Publication date: November 20, 2014
    Inventor: Il-Ho KIM
  • Publication number: 20130049227
    Abstract: A package stack includes a first package, a second package, first solder balls and a molding member. The first package includes a first package substrate, a first semiconductor chip on the first package substrate and connecting pads. The second package includes a second package substrate and a second semiconductor chip on the second package substrate. The second package is disposed over the first package. The first solder balls are in contact with the connecting pads and a bottom of a peripheral portion of the second package substrate. The molding member covers an upper surface of the second package substrate and the second semiconductor chip. A portion of the molding member overlapping the first solder balls has a thickness smaller than a thickness of another portion of the molding member.
    Type: Application
    Filed: July 3, 2012
    Publication date: February 28, 2013
    Inventor: Il-Ho KIM
  • Patent number: D853977
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: July 16, 2019
    Assignee: THE GOODSYSTEM CO., LTD.
    Inventors: Il-ho Kim, Meoung-whan Cho, Young-suk Kim
  • Patent number: D863389
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: October 15, 2019
    Inventors: Seung Won Kwak, In Sik Oh, Jeong Wook Choi, Il Ho Kim, Mi Ri Kwak, Tae Ri Kang, Dan Bi Kim
  • Patent number: D865302
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 29, 2019
    Assignee: FASHION FACTORY CO. LTD.
    Inventor: Il Ho Kim
  • Patent number: D869267
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: December 10, 2019
    Inventors: Jae Sung Ju, Bum Suk Ho, Seung Won Kwak, In Sik Oh, Jeong Wook Choi, Il Ho Kim, Mi Ri Kwak, Tae Ri Kang, Dan Bi Kim
  • Patent number: D966631
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: October 11, 2022
    Inventors: Keum Kyu Jeon, Il Ho Kim
  • Patent number: D977748
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: February 7, 2023
    Inventor: Il Ho Kim
  • Patent number: D977749
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: February 7, 2023
    Inventor: Il Ho Kim
  • Patent number: D977750
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: February 7, 2023
    Inventor: Il Ho Kim