Patents by Inventor Imad Yousif
Imad Yousif has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230335376Abstract: Apparatus provide plasma to a processing volume of a chamber. The Apparatus may comprise a plurality of plasma sources, each with at least a dielectric tube inlet which is at least partially surrounded by a conductive tube which is configured to be connected to RF power to generate plasma and a gas inlet positioned opposite the dielectric tube inlet for a process gas and a dielectric tube directly connected to each of the plurality of plasma sources where the dielectric tube is configured to at least partially contain plasma generated by the plurality of plasma sources and to release radicals generated in the plasma via holes in the dielectric tube.Type: ApplicationFiled: April 19, 2022Publication date: October 19, 2023Inventors: Yang YANG, Fernando SILVEIRA, Kartik RAMASWAMY, Yue GUO, A N M Wasekul AZAD, Imad YOUSIF
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Patent number: 11728141Abstract: A gas distribution hub for a plasma chamber. The hub has a nozzle including a plurality of inner gas injection passage and a plurality of outer gas injection passages. The first plurality of gas injection passages are angularly spaced-apart arcuate channels at a first radial distance from a center of the hub, and the second plurality of gas injection passages are angularly spaced apart arcuate channels at a different second radial distance from the center of the hub.Type: GrantFiled: February 1, 2022Date of Patent: August 15, 2023Assignee: Applied Materials, Inc.Inventors: Yan Rozenzon, Kyle Tantiwong, Imad Yousif, Vladimir Knyazik, Bojenna Keating, Samer Banna
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Patent number: 11574831Abstract: Examples of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One example provides a hoop assembly for use in a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein. A hoop body mates with the confinement ring. The hoop body is slanted to reduce a thickness across a diameter of the hoop body. Three or more lifting fingers are attached to the hoop body and extend downwards. Each of the three or more lifting fingers has a contact tip positioned radially inward from the hoop body to form a substrate support surface below and spaced apart from the confinement region.Type: GrantFiled: September 10, 2020Date of Patent: February 7, 2023Assignee: Applied Materials, Inc.Inventors: Jared Ahmad Lee, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Publication number: 20220319904Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.Type: ApplicationFiled: June 17, 2022Publication date: October 6, 2022Inventors: Michael R. RICE, Yogananda SARODE VISHWANATH, Sunil SRINIVASAN, Rajinder DHINDSA, Steven E. BABAYAN, Olivier LUERE, Denis M. KOOSAU, Imad YOUSIF
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Patent number: 11393710Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a substrate support assembly includes a height-adjustable edge ring, and the substrate support assembly is located within a process chamber. The substrate support assembly includes an electrostatic chuck, an edge ring positioned on a portion of the electrostatic chuck, and one or more actuators to adjust the height of the edge ring via one or more push pins. The height-adjustable edge ring can be used to compensate for erosion of the edge ring over time. In addition, the height-adjustable edge ring can be removed from the process chamber via a slit valve opening without venting and opening the process chamber. The height-adjustable edge ring can be tilted by the one or more actuators in order to improve azimuthal uniformity at the edge of the substrate.Type: GrantFiled: January 6, 2017Date of Patent: July 19, 2022Assignee: Applied Materials, Inc.Inventors: Michael R. Rice, Yogananda Sarode Vishwanath, Sunil Srinivasan, Rajinder Dhindsa, Steven E. Babayan, Olivier Luere, Denis M. Koosau, Imad Yousif
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Publication number: 20220157562Abstract: A gas distribution hub for a plasma chamber. The hub has a nozzle including a plurality of inner gas injection passage and a plurality of outer gas injection passages.Type: ApplicationFiled: February 1, 2022Publication date: May 19, 2022Inventors: Yan Rozenzon, Kyle Tantiwong, Imad Yousif, Vladimir Knyazik, Bojenna Keating, Samer Banna
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Patent number: 11244811Abstract: An annular lid plate of a plasma reactor has upper and lower layers of gas distribution channels distributing gas along equal length paths from gas supply lines to respective gas distribution passages of a ceiling gas nozzle.Type: GrantFiled: December 19, 2018Date of Patent: February 8, 2022Assignee: Applied Materials, Inc.Inventors: Yan Rozenzon, Kyle Tantiwong, Imad Yousif, Vladimir Knyazik, Bojenna Keating, Samer Banna
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Patent number: 11177136Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: GrantFiled: September 26, 2019Date of Patent: November 16, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Jared Ahmad Lee, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Patent number: 11171008Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: GrantFiled: December 17, 2019Date of Patent: November 9, 2021Assignee: Applied Materials, Inc.Inventors: Jared Ahmad Lee, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Patent number: 11139150Abstract: A gas injection system includes (a) a side gas plenum, (b) a plurality of N gas inlets coupled to said side gas plenum, (c) plural side gas outlets extending radially inwardly from said plenum, (d) an N-way gas flow ratio controller having N outputs coupled to said N gas inlets respectively, and (e) an M-way gas flow ratio controller having M outputs, respective ones of said M outputs coupled to said tunable gas nozzle and a gas input of said N-way gas flow ratio controller.Type: GrantFiled: August 29, 2019Date of Patent: October 5, 2021Assignee: Applied Materials, Inc.Inventors: Yan Rozenzon, Kyle Tantiwong, Imad Yousif, Vladimir Knyazik, Bojenna Keating, Samer Banna
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Publication number: 20200411350Abstract: Examples of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One example provides a hoop assembly for use in a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein. A hoop body mates with the confinement ring. The hoop body is slanted to reduce a thickness across a diameter of the hoop body. Three or more lifting fingers are attached to the hoop body and extend downwards. Each of the three or more lifting fingers has a contact tip positioned radially inward from the hoop body to form a substrate support surface below and spaced apart from the confinement region.Type: ApplicationFiled: September 10, 2020Publication date: December 31, 2020Inventors: Jared Ahmad LEE, Martin Jeffrey SALINAS, Paul B. REUTER, Imad YOUSIF, Aniruddha PAL
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Patent number: 10825708Abstract: Process kit components for use with a substrate support of a process chamber are provided herein. In some embodiments, a process kit ring may include a ring shaped body having an outer edge, an inner edge, a top surface and a bottom, wherein the outer edge has a diameter of about 12.473 inches to about 12.479 inches and the inner edge has a diameter of about 11.726 inches to about 11.728 inches, and wherein the ring shaped body has a height of about 0.116 to about 0.118 inches; and a plurality of protrusions disposed on the top surface of the ring shaped body, each of the plurality of protrusions disposed symmetrically about the ring shaped body.Type: GrantFiled: October 12, 2012Date of Patent: November 3, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Valentin Todorow, Samer Banna, Imad Yousif, Albert Wang, Gary Leray
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Publication number: 20200152425Abstract: Embodiments disclosed herein relate to a substrate processing chamber component assembly with plasma resistant seal. In one embodiment, the semiconductor processing chamber component assembly includes a first semiconductor processing chamber component, a second semiconductor processing component, and a sealing member. The sealing member has a body formed substantially from polytetrafluoroethylene (PTFE). The sealing member provides a seal between the first and second semiconductor processing chamber components. The body includes a first surface, a second surface, a first sealing surface, and a second sealing surface. The first surface is configured for exposure to a plasma processing region. The second surface is opposite the first surface. The first sealing surface and the second sealing surface extend between the first surface and the second surface. The first sealing surface contacts the first semiconductor processing chamber component.Type: ApplicationFiled: November 13, 2018Publication date: May 14, 2020Inventors: Vahid FIROUZDOR, Imad YOUSIF, Steven E. BABAYAN, Rajinder DHINDSA, Changhun LEE, Khoi DOAN, John Anthony O'MALLEY, III
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Publication number: 20200126802Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: ApplicationFiled: December 17, 2019Publication date: April 23, 2020Inventors: Jared Ahmad LEE, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Publication number: 20200066563Abstract: Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.Type: ApplicationFiled: November 4, 2019Publication date: February 27, 2020Inventors: Jared Ahmad LEE, Martin Jeff SALINAS, Paul B. REUTER, Imad YOUSIF, Aniruddha PAL
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Publication number: 20200027742Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: ApplicationFiled: September 26, 2019Publication date: January 23, 2020Inventors: Jared Ahmad LEE, Martin Jeffrey SALINAS, Paul B. REUTER, Imad YOUSIF, Aniruddha PAL
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Publication number: 20190385824Abstract: A gas injection system includes (a) a side gas plenum, (b) a plurality of N gas inlets coupled to said side gas plenum, (c) plural side gas outlets extending radially inwardly from said plenum, (d) an N-way gas flow ratio controller having N outputs coupled to said N gas inlets respectively, and (e) an M-way gas flow ratio controller having M outputs, respective ones of said M outputs coupled to said tunable gas nozzle and a gas input of said N-way gas flow ratio controller.Type: ApplicationFiled: August 29, 2019Publication date: December 19, 2019Inventors: Yan Rozenzon, Kyle Tantiwong, Imad Yousif, Vladimir Knyazik, Bojenna Keating, Samer Banna
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Patent number: 10468282Abstract: Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the present invention provides a hoop assembly for using a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein, and three or more lifting fingers attached to the hoop. The three or more lifting fingers are configured to support a substrate outside the inner volume of the confinement ring.Type: GrantFiled: April 26, 2018Date of Patent: November 5, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Jared Ahmad Lee, Martin Jeff Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Patent number: 10453694Abstract: Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.Type: GrantFiled: February 29, 2012Date of Patent: October 22, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Jared Ahmad Lee, Martin Jeffrey Salinas, Paul B. Reuter, Imad Yousif, Aniruddha Pal
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Patent number: 10410841Abstract: A gas injection system includes (a) a side gas plenum, (b) a plurality of N gas inlets coupled to said side gas plenum, (c) plural side gas outlets extending radially inwardly from said plenum, (d) an N-way gas flow ratio controller having N outputs coupled to said N gas inlets respectively, and (e) an M-way gas flow ratio controller having M outputs, respective ones of said M outputs coupled to said tunable gas nozzle and a gas input of said N-way gas flow ratio controller.Type: GrantFiled: May 24, 2018Date of Patent: September 10, 2019Assignee: Applied Materials, Inc.Inventors: Yan Rozenzon, Kyle Tantiwong, Imad Yousif, Vladimir Knyazik, Bojenna Keating, Samer Banna