Abstract: The limit structure for the hook of the pneumatic tool, and the area that is preset on the pneumatic tool has a cylinder hook assembly part that can be covered by a loop cover of the hook. A ring groove is placed on the circumferential area of the hook assembly part, and radial through holes are located at two radial spaced locations on the loop cover, so the center line of the through hole can pin through the ring groove. The through fixer goes through the radial through hole and through the corresponding ring groove, and the hook reaches the combination of limit state that is rotatable by locking the middle of these two through fixers in the ring groove. With this structure, it helps the limit structure for the hook of the pneumatic tool to achieve practical effects of simpler production and more convenient assembling.

Abstract: The present invention provides a structure of the inner head housing, which is placed inside the nail tip cover. The structure includes a movable base of the air-resistant ring, which is placed inside the slot of the fixed liner ring. The resilient component is used to support the movable base towards the direction of the cylinder under normal circumstances. The fixed liner ring is a single component; therefore, it is easy to process and make it smooth. The inner side of the nail tip cover does not need to be processed; therefore, it greatly reduces cost of processing and becomes more practical.

Abstract: A compound of formula [I]: X—R[I] wherein X represents the group: and R is either (i) represented by the formula [II] wherein n is 1 or 2, and the or each R7 group is independently selected from the group consisting of hydrogen and halogen atoms, cyano, nitro, mercapto, carbonyl and sulfone groups, and optionally substituted alkyl, haloalkyl, hydroxyalkyl, aryl, alkoxy, aryloxy, alkylamino, arylamino, alkylthio, arylthio, ester, siloxy, cyclic hydrocarbon and heterocyclic groups; or (ii) is selected from the group consisting of optionally substituted alkyl, hydroxyalkyl, aryl, cyclic hydrocarbon and heterocyclic groups; wherein in each case R1–R6 are each independently selected from the group consisting of hydrogen and halogen atoms, cyano, nitro, mercapto, carbonyl and sulfone groups, and optionally substituted alkyl, haloalkyl, hydroxyalkyl, aryl, alkoxy, aryloxy, alkylamino, arylamino, alkylthio, arylthio, ester, siloxy, cyclic hydrocarbon and heterocyclic groups.

Abstract: A method of removing contaminants from a silicon wafer after chemical-mechanical polishing (CMP). After a copper chemical-mechanical polishing and a subsequent barrier chemical-mechanical polishing operation, an aqueous solution of ozone in de-ionized water is applied to clean the silicon wafer so that contaminants on the wafer are removed. Alternatively, an ozone/de-ionized water buffer-polishing process is conducted after copper and barrier CMP and then the wafer is cleaned using a chemical solution or de-ionized water. Alternatively, an ozone/de-ionized water buffer-polishing process is conducted after both copper-CMP and barrier-CMP and then the wafer is cleaned using a chemical solution or de-ionized water.

Abstract: A method is disclosed for forming at least one image sensor with improved sensitivity along with at least one transistor device. The method comprises forming at least a portion of the transistor device on a substrate, forming the image sensor by doping a predetermined area separated from the transistor device by a minimum predetermined distance, forming an etch stop layer for covering a contact area of the transistor device, removing at least a portion of the etch stop layer in the predetermined area for exposing the image sensor, and covering the image sensor and the transistor device by at least one transparent protection layer.

Abstract: Exemplary compositions and methods for reducing hexavalent chromium in cementitious compositions involve the use of a liquid additive composition, comprising stannous chloride. Along with the stannous chloride may be used at least one co-additive comprising an antioxidant, oxygen scavenger, or mixture thereof, and/or at least one agent comprising a cement grinding aid, cement quality improver, or mixture thereof.

Abstract: A process for fabricating a pad frame for an integrated circuit package includes building up metal on selective portions of a first side of a substrate to define a plurality of contact pads disposed in a first layer of dielectric material, depositing a metal seed layer on an exposed side of the contact pads and the dielectric material, applying a second metal layer on the metal seed layer, selectively etching the second metal layer and the metal seed layer to provide pad frame circuitry, and building up metal on selective portions of the pad frame circuitry to define a plurality of die connect pads separated by a second layer of dielectric material, the die connect pads being electrically connected to the contact pads by the pad frame circuitry.

Abstract: A method for forming an end surface of a heat pipe and the structure thereof are disclosed. Firstly, the mold module is provided for placing the heat pipe therein. The mold module includes a mold chamber to receive the heat pipe. Then, an extruding shaft is pushed forward into the mold chamber from an end of the mold module. Next, the ends of the heat pipe are compressed via the extruding shaft to render the end surface of the heat pipe depressed from outside to inside. Thereby, the heat pipe with a non-protrudent end surface is obtained. As such, the volume occupied by the useless segment of the heat pipe is effectively reduced, or, the heat pipe having a certain length to cooperate with more heat dissipating fins.

Abstract: A metal-insulator-metal capacitor formed in a multilevel semiconductor device utilizes the copper interconnect levels of the semiconductor device as parts of the capacitor. A lower capacitor plate consists of a copper interconnect level and a first metal layer formed on the copper interconnect level by selective deposition methods. The upper capacitor plate includes the same pattern as the capacitor dielectric, the pattern having an area less than the area of the lower capacitor plate. The upper capacitor plate is formed of a second metal layer. The first and second metal layers may each be formed of cobalt, tungsten, nickel, molybdenum, or a combinations of one of the aforementioned elements with boron and/or phosphorus. Conductive vias provide contact from the upper capacitor plate and lower capacitor plate, to interconnect levels.

Abstract: A semiconductor memory apparatus which can restrict a refresh operation for a period when an internal clock is synchronized with an external clock. The semiconductor memory apparatus includes a refresh control unit that disables a refresh command signal which is applied during a period when an enable signal is enabled but a lock-completion signal is not enabled in response to the enable signal outputted from a mode register, the lock-completion signal outputted from a clock synchronizing unit, and the refresh command signal outputted from a command decoder. The clock synchronizing unit can stably complete a locking operation within a predetermined time regardless of power-supply noise and so on.

Abstract: An apparatus for generating a spread spectrum clock with constant spread ratio includes a resistance-capacitance oscillator which is used for generating a first clock signal. In addition, the present invention further includes a spread spectrum charge pump circuit, a loop filter, and a voltage controlled oscillator (VCO). The spread spectrum charge pump circuit generates a spread spectrum current according to the first clock signal for changing/discharging the loop filter, so as to make the loop filter generate a control voltage. The VCO generates a control current and a spread spectrum clock signal according to the control voltage. The VCO feeds the control current back to the spread spectrum charge pump circuit to generate the spread spectrum current.

Abstract: A furniture includes a main frame having a periphery provided with a plurality of hollow pipes, a front panel pivotally mounted on a front portion of the main frame 1, a top panel mounted on a top of the main frame, a bottom panel mounted on a bottom of the main frame, and three side panels mounted on three side walls of the main frame respectively. Thus, each of the side panels is mounted between the respective hollow pipes, and the hollow pipes are connected with each other by the mounting blocks, so that the main frame is assembled and disassembled easily and quickly, thereby facilitating a user mounting and dismantling the main frame.

Abstract: A power supply system is disclosed to include a fuel cell, and a base member, which has a receptacle type connection interface for receiving the fuel cell, a plurality of powered USB connectors for receiving different electronic apparatus and providing different voltages to the connected electronic apparatus, and a powered USB hub electrically connected between the connection interface and the powered USB connectors for controlling supply of different voltages from the fuel cell to the powered USB connectors and transmission of signal among the electronic apparatus being respectively connected to the powered USB connectors.

Abstract: A method and apparatus for inhibiting the flow of a flowable adhesive material disposed adjacent to a substrate. A chip component is disposed adjacent to a substrate and a plurality of nanoparticles are disposed and cured adjacent to the substrate and proximate to the chip component. The nanoparticles possess surface properties that make them substantially immiscible with a flowable adhesive. The band of nanoparticles will inhibit the flow of a flowable adhesive material disposed between the chip and the nanoparticles, in a direction bounded by the plurality of nanoparticles, while adhesive flow in the direction of the component is promoted.

Abstract: A partial-via-first dual-damascene method using a tri-layer resist method forms a first via hole through partial thickness of a dielectric layer, and forms a tri-layer resist structure on the dielectric layer to fill the first via hole with the bottom photoresist layer. A dry development process is performed to transfer a first opening on the top photoresist layer to the middle layer and the bottom photoresist layer, and expose the first via hole again, and remove the top photoresist layer. A dry etching process is then performed to form a second via hole under the first via hole and a trench over the second via hole. Finally a wet striping process is used to remove the remainder of the photoresist layer.

Abstract: A spray gun with containers can be supplemented with additives, which are dispersed into the water flow and sprayed out together. A pistol shaped gun has a spout at the front end of the gun and at least one container inside the gun for storing additives. A mixing duct inside the gun communicates with the spout for sufficiently stirring the additives within the water flow. An inlet hose is led from the second end of the gun to the mixing duct. The inlet hose is kept an eccentric position in opposite to the spout with a distance. Branched tubes are connected among the inlet hose and the containers respectively. Valves inside the branched tubes are coordinated with the button outside the gun to control the water flow.

Abstract: Multi-type air conditioner comprising an outdoor unit installed in an outdoor, comprising a compressor, a refrigerant flow controlling part connected to a discharge end of the compressor for guiding the refrigerant proper to operation conditions selectively, an outdoor heat exchanger connected to the refrigerant flow controlling part, a defrosting device at a side of the outdoor heat exchanger, and a piping system connected between the parts, a plurality of indoor units each installed in a room and having an indoor heat exchanger and an electronic expansion valve having one end connected to one end of the indoor heat exchanger, and a distributor between the outdoor unit and the indoor units for selectively guiding refrigerant from the outdoor unit to the plurality of indoor units proper to operation conditions, and guiding the refrigerant passed through the indoor units to the outdoor unit again.

Abstract: A method for electroplating low-resistance metal wire for resolving the problem to fabricate the metal wire on large-area substrate through the technology of photolithographing and etching in the prior art. Then the invention improves the RC-delay characteristic of circuit on large-area substrate and reduces the number of masks for processing of a structure of gate overlap lightly-doped drain (source) (GOLDD).