Patents by Inventor In Gyu Han

In Gyu Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Grid array type lead frame having lead ends in different planes
    Patent number: 6150709
    Abstract: The invention relates to a grid array type lead frame having a plurality of leads classified into groups by length. The leads extend to respective lead ends, in each of which at least one different plane direction-converting lead part and/or at least one identical plane direction-converting lead part is formed by at least one bending part, whereby the lead ends are distributed in a grid array. The invention also includes a grid array type lead frame, which is as small as or similar to that of semiconductor chip in area while the lead ends are arrayed on one plane, and are at a farther distance away from neighboring ones but in a higher number per area, in such a manner that they form a grid array.
    Type: Grant
    Filed: December 1, 1998
    Date of Patent: November 21, 2000
    Assignees: Anam Semiconductor Inc., Amkor Technology, Inc.
    Inventors: Won Sun Shin, Byung Joon Han, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han
  • Lead end grid array semiconductor package
    Patent number: 5866939
    Abstract: The invention relates to a grid array type lead frame having a plurality of leads classified into groups by length forming a lead end grid array semiconductor package. The leads extend to respective lead ends, in each of which at least one different plane direction-converting lead part and/or at least one identical plane direction-converting lead part is formed by at least one bending part, whereby the lead ends are distributed in a grid array. The invention includes a lead end grid array semiconductor package employing the grid array type lead frame, which is as small as or similar to that of semiconductor chip in area while the lead ends are arrayed on one plane, farther distant way from neighboring ones but in a higher number per area, in such a manner that they form a grid array.
    Type: Grant
    Filed: December 31, 1996
    Date of Patent: February 2, 1999
    Assignees: Anam Semiconductor Inc., Amkor Technology, Inc.
    Inventors: Won Sun Shin, Byung Joon Han, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han
  • Chip mounting plate construction of lead frame for semiconductor package
    Patent number: 5661338
    Abstract: A chip mounting plate construction of lead frames for semiconductor packages which provides a chip mounting plate having a greatly reduced area to obtain a small bonding area between the chip mounting plate and a semiconductor chip mounted on the chip mounting plate, thereby capable of minimizing thermal strain generated at the chip mounting plate due to a thermal expansion thereof. The chip mounting plate is constructed to have a smaller area than the semiconductor chip, to have a central opening, or to have recesses.
    Type: Grant
    Filed: December 12, 1995
    Date of Patent: August 26, 1997
    Assignees: Anam Industrial Co., Ltd., Amkor Electronics, Inc.
    Inventors: Youn Cheol Yoo, Hee Yeoul Yoo, Jeong Lee, Doo Hyun Park, In Gyu Han