Patents by Inventor In Han

In Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8926797
    Abstract: Process for the production of paper, board and cardboard having high dry strength by addition of (a) at least one trivalent cation in the form of a salt, (b) at least one water-soluble cationic polymer and (c) at least one water-soluble amphoteric polymer to the paper stock, draining of the paper stock with sheet formation and subsequent drying of the paper products, the water-soluble cationic polymer (b) being selected from the group consisting of the (i) polymers comprising vinylamine units and (ii) polymers comprising ethylenimine units.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: January 6, 2015
    Assignee: BASF SE
    Inventors: Christian Jehn-Rendu, Ellen Krueger, Hans-Joachim Haehnle, Martin Ruebenacker, Norbert Schall, Thomas Muehlenbernd
  • Patent number: 8927102
    Abstract: A metal suboxide having a specific surface area of greater than or equal to about 1.5 m2/g is prepared by preparing a metal suboxide precursor, and heat-treating the metal suboxide precursor.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: January 6, 2015
    Assignees: Samsung Electronics Co., Ltd., Postech Academy-Industry Foundation
    Inventors: Dong Jin Ham, Bok Soon Kwon, Hyun Seok Kim, Joon Seon Jeong, Hyo Rang Kang, Jae Sung Lee, Sueng Hoon Han, Gang Hong Bae
  • Patent number: 8930794
    Abstract: The present inventions are related to systems and methods for validating retry features in LDPC decoders and in systems incorporating LDPC decoders. For example, a data processing circuit is disclosed that includes a low density parity check decoder and is operable to correct errors in a data set. The data processing circuit includes at least one retry feature operable to assist in correcting the errors that are not corrected without the at least one retry feature. A retry validation circuit in the data processing circuit is operable to inject errors in the data set to trigger the at least one retry feature.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: January 6, 2015
    Assignee: LSI Corporation
    Inventors: Yang Han, Shaohua Yang
  • Patent number: 8927760
    Abstract: The present invention relates to colchicine derivatives expressed in chemical formula 1, or to pharmaceutically acceptable salts thereof, to a method for preparing said derivatives, and to a pharmaceutical composition comprising said derivatives. The colchicine derivatives according to the present invention exhibit superior immunomodulatory effects as compared with conventional immunomodulators or colchicines, and therefore can be valuably used as an immunomodulator for modulating an acute or chronic immune response in organ transplantation.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: January 6, 2015
    Assignee: The Asan Foundation
    Inventors: Duck Jong Han, Sung-eun Yoo, Jeehee Suh
  • Patent number: 8927750
    Abstract: The present invention provides acyloxy- and phosphoryloxy-butadiene-Fe(CO)3 complexes which can deliver carbon monoxide to a physiological target, wherein release of carbon monoxide can be enzymatically-triggered. The present invention also provides for methods of manufacturing the enzymatically-triggered carbon monoxide releasing molecules and methods for their use.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: January 6, 2015
    Assignees: Universitaet Zu Koeln, Universitaet Regensburg
    Inventors: Hans-Guenther Schmalz, Steffen Romanski, Sabine Amslinger, Benito Yard, Birgit Kraus
  • Patent number: 8929124
    Abstract: A resistive memory device includes a resistive memory cell, and a read/program circuit configured to program the resistive memory cell from a first state to a second state. The read/program circuit reads a resistance in the first state of the resistive memory cell and adjusts a compliance current supplied to the resistive memory cell according to the read resistance during the program operation.
    Type: Grant
    Filed: February 13, 2013
    Date of Patent: January 6, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae Han Kim, Cheon An Lee
  • Patent number: 8929711
    Abstract: One embodiment of the present invention provides a signal-recording system. During operation, the system receives a wideband multi-channel radio frequency (RF) signal, which includes a plurality of single-channel RF signals modulated at different carrier frequencies. The system down-converts the received wideband multi-channel RF signal to baseband, and records the down-converted signal.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: January 6, 2015
    Assignee: Aviacomm Inc.
    Inventors: Tao Li, Hans Wang, Shih Hsiung Mo, Binglei Zhang
  • Patent number: 8929145
    Abstract: Provided is a programming method of a nonvolatile memory device. The nonvolatile memory device includes a substrate and a plurality of memory cells which are stacked in the direction perpendicular to the substrate.
    Type: Grant
    Filed: October 1, 2013
    Date of Patent: January 6, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Changhyun Lee, Jinman Han, Doogon Kim, Sunghoi Hur, Jongin Yun
  • Patent number: 8927333
    Abstract: A package-on-package arrangement for maintaining die alignment during a reflow operation is provided. A first top die has a first arrangement of solder bumps. A bottom package has a first electrical arrangement to electrically connect to the first arrangement of solder bumps. A die carrier has a plurality of mounting regions defined on its bottom surface, wherein the first top die is adhered to the die carrier at a first of the plurality of mounting regions. One of a second top die and a dummy die having a second arrangement of solder bumps is also fixed to the die carrier at a second of the plurality of mounting regions of the die carrier. The first and second arrangements of solder bumps are symmetric to one another, therein balancing a surface tension during a reflow operation, and generally fixing an orientation of the die carrier with respect to the bottom package.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: January 6, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Shu Lin, Yu-Ling Tsai, Han-Ping Pu
  • Patent number: 8929091
    Abstract: A method of manufacturing a printed circuit board (PCB) having an embedded bare chip includes attaching a tape to one side of an insulated substrate having a penetration hole formed therein, and attaching the bare chip onto the tape inside the penetration hole such that electrode pads of the bare chip face the tape; filling up the penetration hole with a filler, and removing the tape; laminating a metal layer onto a surface of the filler and the insulated substrate from which the tape is removed; and forming electrode bumps by removing portions of the metal layer. The forming of electrode bumps further includes simultaneously removing portions of the metal layer and forming an circuit pattern on one side of the insulated substrate. The circuit pattern is formed directly on the upper side of the insulated substrate and the electrode bumps are formed on the surface of the electrode pads.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: January 6, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung-Jin Han, Hyung-Tae Kim, Moon-Il Kim, Jae-Kul Lee, Doo-Hwan Lee
  • Patent number: 8928054
    Abstract: A touch substrate includes a base substrate, a sensing element and a switching element. The sensing element is disposed over the base substrate, senses infrared light, and includes a sensing semiconductor pattern. The switching element is electrically connected to the sensing element, includes a material substantially the same as a material of the sensing semiconductor pattern, and includes a switching semiconductor pattern having a thickness different from a thickness of the sensing semiconductor pattern.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: January 6, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sang-Youn Han, Mi-Seon Seo, Sung-Hoon Yang
  • Patent number: 8928222
    Abstract: A an organic electroluminescent display device includes an array substrate including a driving thin film transistor in a pixel region on a first substrate; an opposing substrate including an organic electroluminescent diode in the pixel region on a second substrate; an adhesive layer filling a space between the array substrate and the opposing substrate; and a connection spacer to electrically connect the organic electroluminescent diode with the driving thin film transistor.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: January 6, 2015
    Assignee: LG Display Co., Ltd.
    Inventors: Myung-Seop Kim, Jeong-Dae Seo, Jong-Moo Lee, Hyun-Ju Choi, Chang-Wook Han, Yoon-Heung Tak
  • Patent number: 8926748
    Abstract: A matting agent useful for the preparation of matted coatings comprising, inorganic oxide particulates; and wax coated on the inorganic oxide particulates, wherein the wax possesses a crystallinity of about 50% or more and said wax is present in an amount ranging from 15 wt % to 30 wt % based on a total weight of said matting agent.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: January 6, 2015
    Assignee: Grace GmbH & Co. KG
    Inventors: Hans-Rudolf Lehnert, Markus Kretzschmar
  • Patent number: 8926242
    Abstract: A device for securing a mobile device in an aircraft cabin includes a first connection element having a bar receiving member. The device further has a second connection element which includes a bar which is suitable for co-operating with the bar receiving member of the first connection element, the bar being moveable between an unlocking position and a locking position, in which the bar of the second connection element is able to be brought into engagement with the bar receiving member of the first connection element.
    Type: Grant
    Filed: November 10, 2013
    Date of Patent: January 6, 2015
    Assignee: Airbus Operations GmbH
    Inventors: Hans-Gerhard Giesa, Dieter Behlich, Thomas Rathmann-Ramlow
  • Patent number: 8930792
    Abstract: Systems and method relating generally to data processing, and more particularly to systems and methods for utilizing multiple data streams for data recovery from a storage device. In some cases the systems include a low density parity check data decoder circuit including at least a first data decoder engine and a second data decoder engine each electrically coupled to a common circuit. The common circuit is operable to: shift a combination of both a first sub-message from the first data decoder engine and the second sub-message from the second data decoder engine to yield an shifted output, and disaggregate the shifted output to yield a third sub-message to the first data decoder engine and a fourth sub-message to the second decoder engine.
    Type: Grant
    Filed: February 14, 2013
    Date of Patent: January 6, 2015
    Assignee: LSI Corporation
    Inventors: Shu Li, Shaohua Yang, Zongwang Li, Yang Han
  • Patent number: 8929010
    Abstract: A data processing system includes a digital data input operable to receive digital data, a digital data values input operable to receive values of the digital data, a loop pulse response estimation circuit operable to calculate a loop pulse response based on the digital data and the values of the digital data and based at least in part on past values of the loop pulse response, and a scaling circuit operable to scale the loop pulse response based at least in part on an absolute sum of the loop pulse response to yield a scaled loop pulse response.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: January 6, 2015
    Assignee: LSI Corporation
    Inventors: Rui Cao, Yu Kou, Xuebin Wu, Yang Han
  • Patent number: 8928158
    Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: January 6, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Seung Han, Ju Mi Kim, Sung Su Park, Eun Jung Lee
  • Patent number: 8928639
    Abstract: The present invention relates to a display device capable of reducing power consumption and preventing flicker, as well as a driving method thereof. An exemplary display device includes: a display panel configured for display of a still image and a motion picture; a signal controller programmed to transmit control signals for driving the display panel; and a graphic processing unit transmitting input image data to the signal controller. The signal controller includes a frame memory storing the input image data, and the display panel is driven at a first frequency when the motion picture is displayed and alternatingly driven at the first frequency and a second frequency when the still image is displayed, the second frequency being lower than the first frequency.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: January 6, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min Joo Lee, Po-Yun Park, Sang Su Han, Youn Jin Jung, Yong-Jun Choi, Jae-Suk Choi
  • Patent number: 8927084
    Abstract: The present invention relates to a groove-type vacuum insulation material and a method of manufacturing the same. The groove-type vacuum insulation material includes core materials each having a block shape, at least one lateral wall of which has an inclined surface; a groove-type insulation board, in which the core materials are arranged on a plane of the board to be separated from each other, with the inclined surfaces thereof facing each other; an outer skin material formed in a film pouch shape and surrounding the entirety of upper and lower sides of the groove-type insulation board, the outer skin material being brought into close contact with the groove-type insulation board by vacuum-sealing, and exhibiting bending characteristics in a space between the core materials. The present invention also relates to a method of manufacturing the same.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: January 6, 2015
    Assignee: LG Hausys, Ltd.
    Inventors: Seung-Min Jeon, Sung-Seock Hwang, Suk Jang, Myung Lee, Jung-Pil Han
  • Patent number: 8928176
    Abstract: An energy storage system has a reduced number of capacitors for storing energy such as renewable energy, thereby reducing cost and improving stability of the system. The energy storage system is configured to store power from a power generating unit, and includes: a storage capacitor having a first end electrically coupled to one end of the power generating unit; a secondary battery having a first terminal electrically coupled to a second end of the storage capacitor, and a second terminal electrically coupled to another end of the power generating unit; and a first converter configured to selectively couple the storage capacitor and the secondary battery to a load.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: January 6, 2015
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jongho Park, Namsung Jung, Jungpil Park, Sungsoo Hong, Chungwook Roh, Sangkyoo Han