Abstract: Disclosed are a switching atomic transistor with a diffusion barrier layer and a method of operating the same. By introducing a diffusion barrier layer in an intermediate layer having a resistance change characteristic, it is possible to minimize variation in the entire number of ions in the intermediate layer involved in operation of the switching atomic transistor or to eliminate the variation to maintain stable operation of the switching atomic transistor. In addition, it is possible to stably implement a multi-level cell of a switching atomic transistor capable of storing more information without increasing the number of memory cells. Also, disclosed are a vertical atomic transistor with a diffusion barrier layer and a method of operating the same. By producing an ion channel layer in a vertical structure, it is possible to significantly increase transistor integration.

Abstract: Apparatuses, systems, and methods for a user equipment device (UE) to perform methods for enhancement of multi-SIM devices, such as UE 106. A network may increase paging retries for known MU-SIM devices, e.g., based on an indication of capabilities from a MU-SIM device. The indication may be via a NAS registration request, an RRC capability procedure, and/or an RRC UE assistance procedure. Additionally, a network may include an indication of a paging priority to the UE. The UE may then determine a response to the page based, at least in part, on the indicated priority. Further, the UE may indicate a tune-away to the network. The indication of the tune-away may include a cause and/or duration for the tune-away and may be provided at an RRC level or a network access stratum (NAS) level.

Abstract: Provided is a display panel. The display panel includes a base layer in which a display area where a plurality of pixels are disposed and a non-display area surrounding the display area are defined; a circuit element layer which is disposed on the base layer; an input sensing layer which is disposed on the circuit element layer; and one or more display signal pads and one or more sensing signal pads which are disposed on a sidewall of each of the base layer, the circuit element layer and the input sensing layer, wherein each of the display signal pads is electrically coupled to a display signal line disposed in the circuit element layer, and each of the sensing signal pads is electrically coupled to an input sensing line disposed in the input sensing layer.

Abstract: An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer; and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal.

Abstract: The present disclosure relate to a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises a semiconductor light emitting chip, and first electrodes electrically connected to the semiconductor light emitting chip, with the first electrodes each having a planar area larger than that of the semiconductor light emitting chip, wherein lower surfaces of the first electrodes are exposed externally, and an insulating material is filled in-between inner lateral surfaces of the first electrodes.

Abstract: A method for preparing a stencil to receive a plurality of IC units, the method comprising the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; removing portions of said adhesive surface corresponding to the apertures in the metal substrate.

Abstract: An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.

Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

Abstract: A compressor that includes a casing, a compression mechanism provided inside the casing to compress a refrigerant, a rotary shaft transmitting a rotational force to the compression mechanism from a drive source provided outside the casing, a clutch connecting the drive source and the rotary shaft by a magnetic force generated when electric power is applied to the clutch and disconnecting the drive source and the rotary shaft by losing the magnetic force when the electric power applied thereto is cut off, and a rotation measurement means for receiving the magnetic force from the clutch to measure a change in magnetic flux according to the rotation of the rotary shaft and measure a rotational speed of the rotary shaft. Thus, it is possible to measure the rotational speed of the rotary shaft without including a permanent magnet.

Abstract: Provided is a display panel. The display panel includes a base layer in which a display area where a plurality of pixels are disposed and a non-display area surrounding the display area are defined; a circuit element layer which is disposed on the base layer; an input sensing layer which is disposed on the circuit element layer; and one or more display signal pads and one or more sensing signal pads which are disposed on a sidewall of each of the base layer, the circuit element layer and the input sensing layer, wherein each of the display signal pads is electrically coupled to a display signal line disposed in the circuit element layer, and each of the sensing signal pads is electrically coupled to an input sensing line disposed in the input sensing layer.

Abstract: Provided herein may be a semiconductor memory device including a memory cell, a read and write circuit, a current sensing circuit, and control logic. The memory cell array includes a plurality of memory cells. The read and write circuit includes a plurality of page buffers coupled to the plurality of memory cells through a plurality of bit lines, respectively. The current sensing circuit is coupled to the read and write circuit through a plurality of sensing lines. The control logic is configured to control operations of the current sensing circuit and the read and write circuit. At least two page buffers among the plurality of page buffers are coupled to one of the plurality of sensing lines. The control logic controls the read and write circuit to simultaneously perform a current sensing operation for the at least two page buffers.

Abstract: Provided herein may be a semiconductor memory device including a memory cell, a read and write circuit, a current sensing circuit, and control logic. The memory cell array includes a plurality of memory cells. The read and write circuit includes a plurality of page buffers coupled to the plurality of memory cells through a plurality of bit lines, respectively. The current sensing circuit is coupled to the read and write circuit through a plurality of sensing lines. The control logic is configured to control operations of the current sensing circuit and the read and write circuit. At least two page buffers among the plurality of page buffers are coupled to one of the plurality of sensing lines. The control logic controls the read and write circuit to simultaneously perform a current sensing operation for the at least two page buffers.

Abstract: The present technology relates to a memory device and method of operating the memory device. The memory device includes a plurality of memory cells, a peripheral circuit, and control logic. The peripheral circuit performs a plurality of program loops each including a program operation and a verify operation on selected memory cells of the plurality of memory cells. The control logic controls the peripheral circuit to increase a potential of selected bit lines.

Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.

Abstract: An antenna module includes: a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to the at least one wiring layer; an antenna package including antenna members configured to transmit or receive a radio frequency (RF) signal, a feed vias each having one end electrically connected to a respective one of the antenna members and another end electrically connected to the at least one wiring layer, and a dielectric layer having a height greater than a height of the at least one insulating layer, and having a first surface facing a second surface of the connection member; and dielectric members disposed in positions corresponding to the antenna members on the second surface of the antenna package.

Abstract: An antenna device includes a dielectric layer and a radiation electrode on an upper surface of the dielectric layer. The radiation electrode includes a plurality of electrode lines therein. The radiation electrode has a visibility index in a range from ?1.4 to 1.9. An electrode visibility is suppressed and a signaling sensitivity is enhanced from the radiation electrode. A display device including the antenna device is also provided.

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

Abstract: An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.

Abstract: The present disclosure relates to a composition for the destruction of microalgae or mosses. The composition for the destruction of microalgae or mosses may suppress the growth and proliferation of microalgae when treated in moss cultivation facilities, marine microalgae cultivation facilities, areas in which green or red tide is occurring, or areas in which green or red tide is expected to occur, thereby preventing damage caused by the green or red tide.