Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.

Abstract: An electrostatic discharge (ESD) protection circuit includes an ESD detector connected between a pad and a first power source and configured to generate a detection signal when ESD is detected at the pad, a switch transistor including a gate controlled by the detection signal and a source and a drain connected between the pad and the memory, and a leakage current prevention circuit including a first transistor including a first gate connected to a second power source and a source and a drain connected between the pad and a first node, and a second transistor including a second gate connected to the pad and a source and a drain connected between the first node and the second power source. The first node is connected to or in electrical communication with a bulk node of the switch transistor.

Abstract: The embodiments of the present disclosure relate to a steering control device and method. Specifically, a steering control device according to the present disclosure may include a receiver configured to receive inclination angle information, vehicle speed information of a host vehicle, steering angle information of a steering wheel, steering angular velocity information of the steering wheel, and hysteresis torque information of the host vehicle from a plurality of sensors, a determiner configured to determine whether the host vehicle is located on a flat surface based on the inclination angle information, an estimator configured to estimate a loading weight based on a hysteresis torque value compared to a steering angular velocity value if determined that the host vehicle is located on the flat surface, and a controller configured to shift an assist map based on the estimated loading weight.

Abstract: Disclosed is a display device capable of reducing the thickness and the weigh thereof. In an organic light-emitting diode display device having a touch sensor, a plurality of routing lines, which are connected respectively to a plurality of touch sensors disposed on an encapsulation unit, are disposed on different planes so as to overlap each other and are electrically connected to each other through a plurality of routing contact holes. Thereby, a connection fault between the routing lines is prevented. In addition, through the provision of the touch sensors above the encapsulation unit, a separate attachment process is unnecessary, which results in a simplified manufacturing process and reduced costs.

Abstract: A display device prevents cracks from spreading to an active area. The display device includes a substrate including an active area and a non-active area having a bending area, a thin-film transistor disposed in the active area, a light-emitting element disposed in the active area and connected to the thin-film transistor, an encapsulation layer disposed on the light-emitting element, a touch sensor disposed on the encapsulation layer, a touch pad disposed in the non-active area, a first routing line connecting the touch sensor to the touch pad via a second routing line in the bending area, and a crack prevention layer disposed on the second routing line in the bending area. Thus, the crack prevention layer is capable of preventing the occurrence of cracks in the bending area BA, thus preventing cracks from spreading to the active area AA.

Abstract: Disclosed are a timing controller and driver which are improved to have a function of compensating a source signal to be provided to a display panel, and a display system including the timing controller and the driver.

Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.

Abstract: A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.

Abstract: An input/output circuit for a memory and a method of controlling the same are disclosed. The input/output circuit and the method of controlling the same are configured to prevent a memory element from being falsely or incorrectly programmed due to an ESD pulse. More particularly, the input/output circuit and the method of controlling the same include an ESD detection unit configured to detect a programming voltage or an ESD pulse on a pad terminal, a control logic unit configured to transmit a first voltage or a second voltage according to the programming voltage and the ESD pulse, and a switch unit configured to perform a turn-on or turn-off operation according to the first voltage or the second voltage.

Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

Abstract: A display device prevents cracks from spreading to an active area. The display device includes a substrate including an active area and a non-active area having a bending area, a thin-film transistor disposed in the active area, a light-emitting element disposed in the active area and connected to the thin-film transistor, an encapsulation layer disposed on the light-emitting element, a touch sensor disposed on the encapsulation layer, a touch pad disposed in the non-active area, a first routing line connecting the touch sensor to the touch pad via a second routing line in the bending area, and a crack prevention layer disposed on the second routing line in the bending area. Thus, the crack prevention layer is capable of preventing the occurrence of cracks in the bending area BA, thus preventing cracks from spreading to the active area AA.

Abstract: An apparatus for processing a substrate includes a process chamber; a support which is placed inside the process chamber and supports the substrate; a fluid supplier which supplies fluid into the process chamber; and a controller configured to perform a compressing step to bring the fluid into a supercritical phase inside the process chamber, in which the compressing step includes a continuous first section and second section, the fluid supplier includes a first portion and a second portion, and the controller supplies the fluid into the process chamber at a first speed during the first section using the first portion, and supplies the fluid into the process chamber at a second speed higher than the first speed during the second section using the second portion.

Abstract: A substrate rotating apparatus may include a spin chuck supporting a substrate and a stage rotating the spin chuck about an axis parallel to a first direction. The spin chuck may include a first magnetic element and a substrate supporting member thereon. The stage may include a stage housing, a rotating part rotating about the axis, an inner control unit controlling rotation of the rotating part, a power supplying part supplying a power to the rotating part, and a wireless communication part receiving a control signal from an outside and transmitting the control signal to the inner control unit. The rotating part may include a second magnetic element spaced apart from the first magnetic element and a rotation driver rotating the second magnetic element. The rotating part, the inner control unit, the power supplying part, and the wireless communication part may be placed in the stage housing.

Abstract: A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.

Abstract: An embodiment power train for a vehicle includes a first input shaft configured to receive rotating forces from a first motor and an engine, a second input shaft configured to receive a rotating force from a second motor, an output shaft disposed in parallel with the first input shaft and the second input shaft, a transmission gear set in which a plurality of gear sets having different gear ratios are engaged with and coupled to the first input shaft and the output shaft, a shifting unit configured to select a gear set of the plurality of gear sets based on a traveling speed of the vehicle, and a motor-side transfer gear set engaged with and coupled to the second input shaft and the output shaft.

Abstract: In a substrate processing method, a rinse process using a rinse solution is performed on a development-processed photoresist pattern on a substrate. A substitution process including a first substitution step using a mixed solution of a non-polar organic solvent and a surfactant and a second substitution step using the non-polar organic solvent is performed on the substrate. The substitution process is performed a plurality of times until the rinse solution remaining on the substrate is less than a predetermined value. A supercritical fluid drying process is performed on the substrate to dry the non-polar organic solvent remaining on the substrate.

Abstract: A substrate processing apparatus includes a chamber including an upper chamber and a lower chamber coupled to each other to provide a space for processing a substrate, a substrate support configured to support the substrate within the chamber, an upper supply port provided in the upper chamber and configured to supply a supercritical fluid on an upper surface of the substrate within the chamber, a recess provided in a lower surface of the upper chamber, the recess including a horizontal extension portion extending in a direction parallel with the upper surface of the substrate in a radial direction from an outlet of the upper supply port and an inclined extension portion extending obliquely at an angle from the horizontal extension portion, and a baffle member disposed within the recess between the upper supply port and the substrate.

Abstract: A wafer drying apparatus is disclosed. The wafer drying apparatus may include a drying chamber housing providing a drying space, in which a wafer is disposed, a supercritical fluid supplying part configured to supply a supercritical fluid into the drying space, a wafer heating part configured to heat the wafer disposed in the drying space, and a wafer cooling part configured to cool the wafer disposed in the drying space. The wafer cooling part may include a cooling plate disposed below a place, on which the wafer is loaded, and a cooling conduit inserted in the cooling plate.

Abstract: An aerosol generating device includes: an output unit; a biometric information obtaining unit configured to obtain an image of a pupil of a user; a communication unit configured to transmit the image of the pupil of the user to a server and receive information about a recommended cartridge corresponding to the emotional state calculated by the server using a neural-network-based emotion calculation model and a neural-network-based cartridge recommendation model; and a controller configured to control the output unit to output the recommendation cartridge information.

Abstract: A display device and method of forming the same are provided. A display device includes: an encapsulating structure between a device substrate and a cover substrate, a light-emitting element between the device substrate and the encapsulating structure, the light-emitting element including: a first electrode, a light-emitting layer, and a second electrode, which are sequentially stacked, a touch structure between the encapsulating structure and the cover substrate, the touch structure including: a first bridge electrode, a touch insulating layer, and a second bridge electrode, which are sequentially stacked, and a reflecting prevention layer between the first bridge electrode and the touch insulating layer.