Abstract: Proposed is a substrate processing apparatus for cleaning the bottom surface of a substrate. The apparatus includes a processing container configured to form a processing space for a substrate, a substrate support unit provided inside the processing space and configured to support the substrate, a first nozzle unit configured to have a first nozzle member provided on a side of the substrate support unit inside the processing space and supplying a processing fluid toward a center area of a bottom surface of the substrate, and a second nozzle member provided to be fixedly coupled to the substrate support unit and supplying a processing fluid toward an edge area of the bottom surface of the substrate, wherein the first nozzle member is provided to rotate between a center position and an end position of the bottom surface of the substrate.

Abstract: A substrate treating apparatus includes a housing having an inner space; a support positioned in the inner space and configured to support a substrate; a treating container having a treating space therein and surrounding the supported substrate. A cleaning unit may supply a liquid to the substrate supporting on the support and a heating unit may heat a fluid that is supplied to the treating space to decrease a relative humidity of the treating space.

Abstract: An apparatus for processing a substrate includes a first bowl and a processing space therein; a first support portion disposed in the processing space and configured to support the substrate in a first support position; a second bowl disposed to move in a first direction in the processing space; a second support portion configured to move upwardly and downwardly with respect to the first support portion to support the substrate between the second support position disposed above the first support position and the third support position, and to move in the first direction; and a cleaning unit including a first cleaning portion disposed below the substrate toward a rear surface of the substrate in the first support position and a second cleaning portion disposed below the substrate and opposing a rear surface of the substrate between the second support position and the third support position.

Abstract: A semiconductor device and a method of fabricating a semiconductor device, the device including a fin-type pattern extending in a first direction; a gate electrode extending in a second direction over the fin-type pattern, the second direction being different from the first direction; spacers on sidewalls of the gate electrode; a capping structure on the gate electrode and the spacers, the capping structure including a first capping pattern and a second capping pattern, the second capping pattern being on the first capping pattern; and an interlayer insulating film surrounding sidewalls of each of the spacers and sidewalls of the capping structure, the interlayer insulating film being in contact with the first capping pattern.

Abstract: Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.

Abstract: A novel compound having excellent light emission and heat stability is disclosed. Also disclosed is an organic electroluminescent device having properties such as light emitting efficiency, an operation voltage, and a service life improved by including the compound in at least one organic layer of the device.

Abstract: A semiconductor device and a method of fabricating a semiconductor device, the device including a fin-type pattern extending in a first direction; a gate electrode extending in a second direction over the fin-type pattern, the second direction being different from the first direction; spacers on sidewalls of the gate electrode; a capping structure on the gate electrode and the spacers, the capping structure including a first capping pattern and a second capping pattern, the second capping pattern being on the first capping pattern; and an interlayer insulating film surrounding sidewalls of each of the spacers and sidewalls of the capping structure, the interlayer insulating film being in contact with the first capping pattern.

Abstract: A liquid chemical supply apparatus for supplying a liquid chemical to a plurality of substrate processing apparatuses disposed at different heights includes a pump for providing a hydraulic pressure for moving the liquid chemical to the substrate processing apparatuses, a plurality of liquid chemical supply lines having ends connected to the pump and other ends separately connected to the substrate processing apparatuses, to provide passages through which the liquid chemical moves, and a pump vent line connected to the pump to discharge some of the liquid chemical to outside, wherein flow rate calibration lines are connected between the liquid chemical supply lines and the pump vent line.

Abstract: Provided are a pump, an apparatus for supplying a chemical liquid and an apparatus for processing a substrate. The pump includes a tube having elasticity and having a flow path through which a chemical liquid flows in; and a case having an internal space partitioned into at least two chambers through which gas is supplied or discharged, where the at least two chambers cover an outer circumference of the tube. Using the pump, the apparatus for supplying a chemical liquid and the apparatus for processing a substrate, by an operation in which gas is supplied or discharged into each partitioned chamber in the case, by applying or releasing pressure to the outer circumference of each corresponding tube independently without interfering between the internal pressures between the chambers, efficient pumping operation of the pump may be obtained, and precise control of the discharge pressure of the liquid may be implemented.

Abstract: Various examples are provided related to detection and measurement of respiratory parameters. In one example, a system for monitoring an individual's respiration includes a thermal sensor that can detect CO2, an optical sensor, and image processing circuitry that can determine a parameter of CO2 gas being exhaled about a mouth of the individual using a thermal image captured by the thermal sensor and optical image(s) captured by the optical sensor. In other examples, a system includes an arrangement of thermal sensors and/or optical sensors that can monitor gas being exhaled about a mouth of the individual. In another example, a system includes an arrangement of thermal and optical sensors and image processing circuitry that can determine, e.g., a flow field and/or distribution of gas being exhaled about a mouth of the individual based upon thermal images and optical images captured by the arrangement of thermal and optical sensors.

Abstract: Provided is a wafer treatment apparatus capable of measuring warpage of a wafer, the wafer treatment apparatus including a support plate providing a surface on which the wafer is supported, a temperature control channel mounted in the support plate to provide a path through which a fluid flows, and a plurality of warpage measurers disposed on the support plate and having lower ends mounted to be vertically spaced apart from an upper portion of the temperature control channel.

Abstract: A training system uses a physical model of a head and neck with a first tracker, a second tracker on a physical laryngoscope model, a third tracker on a physical endotracheal tube model, and a fourth tracker on a VR goggle; the system uses the trackers to determine positions of the physical models. A simulation system has corresponding digital 3D models of a laryngoscope, an endotracheal tube, and an airway, the airway including 3D models of surfaces of tongue, epiglottis, larynx, pharynx, and trachea. The physical model locations are registered to the digital models. In embodiments, the physical laryngoscope model has sensors measure strain or pressure along its blade and the simulation system has instructions to distort the digital 3D model of the airway according to readings of the sensors. The system can render the digital 3D model viewed from the VR goggle or a camera of the laryngoscope.

Abstract: A substrate processing apparatus includes: a nozzle unit configured to discharge a processing liquid to a substrate; a pipe connected to the nozzle unit and a processing liquid supply unit supplying the processing liquid; a charge amount control unit disposed at the pipe, including a filter unit charged with positive charges or negative charges, and including at least one of a control valve, controlling a flow rate of the processing liquid passing through an inside of the filter unit, and a power supply unit, applying a voltage to the filter unit, to control a charge amount of the processing liquid; and a control unit connected to the charge amount control unit.

Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus according to an exemplary embodiment may include: a support unit supporting a substrate; a treating container covering an outer side of the support unit; a liquid supply unit including a nozzle ejecting a liquid to the substrate supported on the support unit; and a home port which is positioned outside the treating container, and in which the nozzle waits, and the home port may include a body having a discharge space to which the liquid ejected from the nozzle is discharged therein, and a measurement unit connected to the body and measuring a charging amount of the liquid discharged from the discharge space.

Abstract: Provided is an apparatus for treating a substrate. The substrate treating apparatus may include: a substrate support unit supporting a substrate; a nozzle supplying a liquid to the substrate supported on the substrate support unit; a home port in which the nozzle waits; and an electrostatic measurement member measuring an electrostatic amount of a liquid dispensed from the nozzle in the home port.

Abstract: The present invention provides a pump for supplying a liquid. The pump comprises: a tube member having a hose communicating with a chemical liquid inlet and a chemical liquid outlet, and a cylindrical drum provided to wind the hose, and configured to discharge a chemical liquid through a volume change caused by contraction of the hose wound around the drum; and a driver configured to provide a rotational force such that the hose is wound around the drum.

Abstract: Proposed are a chilling unit, a heat treatment apparatus including same, and a heat treatment method. More particularly, proposed is a technology capable of rapidly and effectively lowering the temperature of a heating plate by bringing a heat exchange medium of a chilling unit into contact with the heating plate and then circulating a refrigerant after performing a heat treatment process of a substrate through a heat treatment apparatus.

Abstract: Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.

Abstract: Proposed are a home port, and a substrate processing apparatus and a home port cleaning method using the same. The home port includes a housing supported by a holder and having a space therein, a nozzle holder provided at an upper portion of the housing and mounting a nozzle for discharging a process liquid to a substrate, an inclined surface formed below the nozzle holder in the space, an exhaust hole exhausting fumes generated in the space of the housing, a rinse supply hole supplying a rinse liquid for removing a residual process liquid remaining on the inclined surface, a hinge provided at a lower portion of the housing and hingedly coupling the housing and the holder to enable rotation of the housing, and an actuating means rotating the housing in a direction in which the inclined surface is parallel to a ground surface on which the housing is installed.

Abstract: An apparatus for inspecting a chemical solution of the present invention comprises a base unit having an inlet, through which a chemical solution is introduced, a flow path unit, in which the chemical solution introduced through the inlet is moved while a velocity of its fluid is changed, and including a first region unit provided adjacent to the inlet of the base unit and a second region unit being in series communication with the first region unit, in which the chemical solution discharged from the first region unit is moved, a detecting unit including a first detecting member for detecting a first signal that is an electrical signal of the first region unit, and a second detecting member for detecting a second signal that is an electrical signal of the second region unit, and a determining unit for receiving a signal from the detecting unit and determining that a particle and a bubble are detected if a current of the first signal and the second signal is changed compared to a reference value, and discrimin