Abstract: The present invention relates to a method for forming a wiring of a printed circuit board and more particularly, to a method including: preparing a base film; forming a wiring pattern with ink including metal nanoparticles on the base film by printing; and forming a wring by the induction heating of the base film on which the wiring pattern is formed. The method of the present invention which minimizes the thermal strain and thermal decomposition of a base film, provides an appropriate sintering process of wirings, shortens the manufacturing process, and exhibits excellent mechanical strength is provided by using the induction heating.

Abstract: The present invention relates to a method of manufacturing cubic copper nanoparticles, and in particular, to a method including (a) mixing and agitating a copper precursor and an amine compound; (b) raising the temperature of the mixed solution up to 90-170° C. and reacting it at the same temperature; (c) adding the mixture to nonaqueous solvent to lower the temperature of the solution to 20-50° C. when the incubation completes; and (d) precipitating and obtaining the nanoparticles by adding an alcohol solvent to the mixture. According to the invention, while conductive wiring is formed metal nanoparticles can be manufactured not in sphere but in cubic shape so that void between particles can be efficiently removed and the height of wiring can be raised.

Abstract: The present invention relates to a method for manufacturing metal nanoparticles, more particularly to a method for manufacturing metal nanoparticles, which includes: preparing a mixed solution including capping molecules, a metal catalyst, a reducing agent, and an organic solvent; adding a metal precursor to the mixed solution and raising to a predetermined temperature and stirring; and lowering the temperature of the mixed solution and producing nanoparticles. Embodiments of the invention allow the synthesis of nanoparticles, such as of single metals, metal alloys, or metal oxides, to a high concentration in a water base using a metal catalyst.

Abstract: The present invention provides a method for surface modification of non-dispersible metal nanoparticles and the metal nanoparticles for inkjet printing thus modified, in particular, a method for surface modification of non-dispersible metal nanoparticles comprising, mixing metal nanoparticles having an amorphous carbon layer on the surface and an alcohol or thiol solvent, mixing a capping molecule having a carboxylic head group in the mixed solution, and (c) separating the metal nanoparticles from the mixed solution and the metal nanoparticles for inkjet printing thus modified. According to the present invention, the present invention ensures mass production, by converting non-dispersible metal nanoparticles, produced in large quantities, to nanoparticles for inkjet printing.

Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.

Abstract: The present invention provides the method for forming a fine wiring quickly by using magnetic ink. Also the present invention provides wiring forming method and device by which the coffee stain and the migration are not caused due to the ink with the uniformly dispersed metal nanoparticles so that the wiring with distinguished electrical reliability is obtained. Also the present invention provides a substrate with excellent electrical conductivity and reliability. According to an aspect of the present invention, a wiring forming method to apply a magnetic field on the magnetic ink may be provided in a step of forming a wiring by ejecting magnetic ink on one side of a substrate.

Abstract: An apparatus for controlling a multi-outlet power strip, in which the above-described switch vibration can be avoided, and which can be easily fabricated along with reduction in the manufacturing cost is provided. Detector detects electric current flowing through the main plug connector. Amplifier amplifies the electric current detected by the current detector to produce an amplified signal. Schmitt trigger circuit compares the amplified signal from the amplifier with a reference value, and outputs a control signal for a vibration prevention having a predetermined threshold voltage according to the compared result. Switch operator switches an electric power to the plurality of auxiliary connectors. Driver drives the detector, the amplifier, the Schmitt trigger circuit, and the switch operator.