Abstract: There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.

Abstract: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

Abstract: A light emitting diode module having improved luminous efficiency is provided. The light emitting diode module includes: a light emitting chip; a phosphor layer formed of phosphor materials emitting light having a wavelength longer than the light emitted from the light emitting chip using light emitted from the light emitting chip as an excitation source; and a reflection plate that is disposed between the light emitting chip and the phosphor layer and that reflects the light emitted by the phosphor layer.

Abstract: There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

Abstract: The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.

Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.

Abstract: A combined mirror and presentation medium includes a presentation member (24) for displaying an image, a presentation body (23) inserted into the presentation member to display an image, a light-emitting unit (25) disposed on one side of the presentation member, a transparent member (21) disposed on one side of the presentation member, and a reflection member (22) deposited between the transparent member (21) and the presentation member (24); a body unit (10) for supporting the presentation medium; a speech recognition drive unit (40) installed inside the body unit (10), configured to detect speech frequencies from a user's speech signals, and driving the system; a control unit (50) installed inside the body unit (10) and configured to control the presentation medium (20) and the speech recognition drive unit (40); and a power source unit (60) for supplying power to the presentation medium, a speaker (70), and the control unit (50).

Abstract: Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body-including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.

Abstract: There is provided a light emitting diode (LED) package in which a phosphor layer encapsulating an LED chip is formed uniformly to facilitate a process. The LED package includes: a package body having a mounting area; a holding part mounted on the mounting area to expose a portion of the mounting area; an LED chip mounted on the mounting area, the LED chip surrounded by the holding part to emit light; and a phosphor layer held by the holding part to seal a space defined by the holding part, the phosphor layer converting a wavelength of the light from the LED chip.

Abstract: Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.

Abstract: Disclosed herein is a quantum dot phosphor for light emitting diodes, which includes quantum dots and a solid substrate on which the quantum dots are supported. Also, a method of preparing the quantum dot phosphor is provided. Since the quantum dot phosphor of the current invention is composed of the quantum dots supported on the solid substrate, the quantum dots do not aggregate when dispensing a paste obtained by mixing the quantum dots with a paste resin for use in packaging of a light emitting diode. Thereby, a light emitting diode able to maintain excellent light emitting efficiency can be manufactured.

Abstract: A memory controller includes a memory capacity setting circuit and an address selecting circuit. The memory capacity setting circuit is configured to set a valid memory capacity of a memory device based on a defective cell information signal, and generate a valid memory capacity signal based on the valid memory capacity. The address selecting circuit is configured to disable an address signal corresponding to a memory block having a defective cell, and generate a selection address signal based on the valid memory capacity signal and the disabled address signal. A non-defective cell in a memory cell array is activated based on the selection address signal and a command signal.

Abstract: A light emitting device package is provided. The light emitting device package comprises a base substrate on which a wiring pattern is formed; a light emitting device mounted on the base substrate to emit light when supplied with driving power through the wiring pattern; a molded lens stably seated on the base substrate and having an inner space for sealing the light emitting device and reflective surfaces formed along outer sides facing the inner space to guide light from the light emitting device in an effective display direction; and a sealing resin between the inner space to bond the base substrate to the molded lens, whereby the packaging structure is simplified so that an assembly process and reliability testing are simplified, process losses due to defects are minimized, and the light extraction efficiency from the light emitting device and heat-dissipation performance are improved.

Abstract: A composition for forming a prism layer and a prism film manufactured using the same. The composition for forming a prism layer includes a UV-curable monomer A, including a fluorene derivative diacrylate monomer represented by Formula 1 or 2; a UV-curable monomer B, including at least one acrylate monomer; a photoinitiator; and an additive, and thus is excellent in surface strength, adhesion to a substrate film and anti-yellowing properties, with a viscosity suitable for formation of the prism layer.

Abstract: A long life light-emitting diode (LED) module is provided. The LED module includes: a light-emitting chip; a phosphor layer formed of phosphor materials that transform light emitted from the light-emitting chip into light having a longer wavelength than the light emitted from the light-emitting chip; a capping layer that is formed on the light-emitting chip and protects the light-emitting chip; and a heat spreading plate that is disposed between the capping layer and the phosphor layer that dissipates heat generated in the light-emitting chip and the phosphor layer.

Abstract: A method of constructing a roadway having an embedded linear synchronous motor (LSM) utilizes prefabricated modules. Structurally, each module comprises a top plate, a multiple-phase winding tied to the top plate, and a concrete mold encapsulating the winding. With the modules prefabricated, the roadway is constructed by first excavating a trench to position a foundation at the trench bottom. Then a mud matt is positioned on the foundation. Next, the modules are laid end-to-end on the mud matt. Thereafter, the windings in adjacent modules are electrically interconnected through joints. Further, the joints are covered by junction boxes, and the trench around the roadway is filled in with aggregate.

Abstract: A signal, a transmitting apparatus, a receiving apparatus, a display apparatus and a method for processing a signal in a receiving apparatus connected with a transmitting apparatus through a wireless network, the method including: receiving the signal; receiving a request for storing the received signal; and transmitting and storing the received signal to and in the transmitting apparatus.

Abstract: The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; an LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.

Abstract: Example embodiments may include a light emitting device package. The light emitting device package may include a light emitting device, a package body including a cavity having a bottom surface on which the light emitting device is mounted and a side surface for reflecting light emitted from the light emitting device, a first electrode protruding from the package body, and a second electrode coupled with the package body. The first and second electrodes may be designed to couple respectively with the second and first electrodes of another light emitting device package, thereby forming an array of light emitting device packages.

Abstract: Provided is a method of manufacturing a vertical light emitting device.